Direct Writing

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Direct Writing

  1. 1. Direct 3D  Di 3D Microfabrication Process Presented by Thomas Martinuzzo Project Manager, Sciences and Engineering thomas.martinuzzo@univalor.ca
  2. 2. Overview Method b ild Functionalized 3D Mi M h d to build F i li d 3D Microstructures Seeking Partnerships in Development and Market Deployment in Development Market : $25 billions in 2009 (Micro‐system technologies) Inventors: Ecole Polytechnique de Montreal + INRS Intellectual Property: US Patent Application (12/252,722)
  3. 3. MEMS, NEMS and Organic Electronics MEMS NEMS and Organic Electronics Current microfabrication t h i C t i f b i ti techniques MicroElectroMechanicalSystem Organic electronics  lithographic methods Solvent Casting (prof. Peter, EPM) (Aissa, INRS‐EMT) Do not allow direct manufacturing  of devices in 3D 4
  4. 4. State of the art… Current Limitations C t Li it ti Limited Range of Materials Limited Range of Materials The structure needs to be physically supported p y y pp Cannot be used straightforwardly Require a controlled environment
  5. 5. Technical aspects  Advantages: – Cost‐effective Cost effective – Fast – Scalable Radiation  Dispensing  – Repetitive source apparatus – Low environmental requirements – Direct writing of 3D structures – Variability of materials  – Variability of radiation source  Variability of radiation source Extruded  material (UV, Visible light, etc.) Schematic 6
  6. 6. 3D microstructures: applications 3D microstructures: applications Tissue Engineering MEMS 1 mm 2.5 mm Tailored scaffold structure Nanocomposite spring Organic electronics 2.5 mm Conductive Polymer Electrical Contacts 7
  7. 7. Target Markets Target Markets • Ti Tissue Engineering E i i – $15 billion now $ • MEMS – $12.5 billion in 2010 • Organic Electronics Organic Electronics – $25 billion in 2015 – $250 billions in 2025 8
  8. 8. Team Louis Laberge Lebel, Ph.D Louis Laberge Lebel Ph D Student • Ecole Polytechnique de Montreal Pr. Daniel Terriault, Ph.D • Professor Pr. My Ali El Khakani, Ph.D • Professor INRS Brahim Aissa, Ph.D Student • INRS INRS-EMT
  9. 9. Summary Simple Idea Si l Id Developed Within Academic Institution Through Boostrapping Financing g pp g g Core IP Various Market Segments Looking For Partnerships in Development and Market Deployment p y
  10. 10. Direct 3D Microfabrication Process Thomas Martinuzzo thomas.martinuzzo@univalor.ca thomas martinuzzo@univalor ca

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