Sputtering deposition semiconductor equipment

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Sputtering Deposition Semiconductor Equipment

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Sputtering deposition semiconductor equipment

  1. 1. Sputter Deposition System - Semiconductor Equipment Source Page 1 of 22 Home Semiconductor Equipment Companies Sputter Deposition System Semiconductor Equipment Source semiconductor-equipment-companies-list Used Semiconductor Equipment Source Chemical Deposition(CVD,PECVD) ADVANCED CRYSTAL SCIENCES LPCVD SYSTEM AIXTRON AIX200 LP-MOCVD Chemical Vapor Deposition AMP-3300 Plasma II PECVD Deposition System NOVELLUS Deposition Tool CONCEPT 2 Altus DLCM Oxford PlasmaLab 80 Plus DLC Deposition System Plasma-Therm 730 SLR PECVD Load-Locked System Plasma-Therm 790 Dual Chamber PECVD & RIE System Plasma-Therm 790™ Series Platform Plasma-Therm LAPECVD™ Plasma-Therm Productivity Enhancements Plasmafab PF310 (STS 310) PECVD Plasmatherm 790 PECVD Plasmatherm Dual Chamber PVD-RIE Plasmatherm SLR 730 PECVD Plasma Shuttle-Lock Plasmatherm SLR 730 PECVD Shuttle lock PECVD hysical sputtering is driven by momentum PlasmaTherm Versalock 700 PECVD exchange between the ions and atoms in the ROTH & RAU AK 800 materials, due to collisions. Solid State Equipment SSEC 3308 Cassette to Cassette The incident ions set off collision cascades in the Technics PEIIA PECVD / RIE System target. When such cascades recoil and reach the TEMESCAL BJD-1800 target surface with an energy greater the surface Used CHA SEC 1000 RAP 4 pocket E-Beam evaporator binding energy, an atom would be ejected, known Used CVC Old Style Shutter Assembly as sputtering. If the target is thin on an atomic Used CVD Semicoductor Equipment List scale the collision cascade can reach the back Used Plasmatherm 700 VLR (Versalock ) PECVD System side of the target and atoms can escape the Used Plasmatherm 790 PECVD Stand alone deposition surface binding energy `in transmission. The average number of atoms Used Plasmatherm 790 PECVD/RIE Dual Chamber 790 ejected from the target per incident ion is called the sputter yield andhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  2. 2. Sputter Deposition System - Semiconductor Equipment Source Page 2 of 22 Used Plasmatherm PT530 PECVD Deposition System depends on the ion incident angle, the energy of the ion, the masses of the Veeco RF350 C2 IBE (Ion Beam Deposition) ion and target atoms, and the surface binding energy of atoms in the target. Watkins Johnson (WJ) 1000 For a crystalline target the orientation of the crystal axes with respect to the Watkins Johnson (WJ) 1500 target surface is relevant. Watkins Johnson (WJ) 999R APCVD The primary particles for the sputtering process can be supplied in a number Coater and Developer of ways, for example by a plasma, an ion source, an accelerator or by a Karl Suss ACS200 Cassette to Cassette Coat-Develop radioactive material emitting alpha particles. Suss Microtec Delta 20T2/150VPO A model for describing sputtering in the cascade regime for amorphous flat Used SVG Coater and Developer Equipment targets is Thompsons analytical model.[4] An algorithm that simulates Contact Us sputtering based on a quantum mechanical treatment including electrons Dicing Saws stripping at high energy is implemented in the program TRIM.[5] Thermocarbon Dicing Saw 8003 A different mechanism of physical sputtering is heat spike sputtering. This E-Testers may occur when the solid is dense enough, and the incoming ion heavy Agilent HP 4062UX Semiconductor Process Control System enough, that the collisions occur very close to each other. Then the binary Evaporation Equipment collision approximation is no longer valid, but rather the collisional process Balzers Evaporator should be understood as a many-body process. The dense collisions induce CHA Industries Mark 40 Source Evaporator a heat spike (also called thermal spike), which essentially melts the crystal CHA Industries Mark 50 Source Evaporator locally. If the molten zone is close enough to a surface, large numbers of CHA Industries SE 1000 E-Beam Evaporation System atoms may sputter due to flow of liquid to the surface and/or CHA Industries SE 600 E-Beam Evaporator microexplosions.[6] Heat spike sputtering is most important for heavy ions CHA Mark 50 system for sale (real CHA) (say Xe or Au or cluster ions) with energies in the keV–MeV range CHA SE 600 EBEAM SYSTEM bombarding dense but soft metals with a low melting point (Ag, Au, Pb, etc.). CHA SE 600 EVAPORATOR The heat spike sputtering often increases nonlinearly with energy, and can CHA SE 600 RAP CHA for small cluster ions lead to dramatic sputtering yields per cluster of the Cooke Filament Evaporator order of 10000.[7] For animations of such a process see here. CTI 8 CRYOPUMP CTI Physical sputtering has a well-defined minimum energy threshold which is Denton 502 Denton equal to or larger than the ion energy at which the maximum energy transfer Edwards Auto 500 of the ion to a sample atom equals the binding energy of a surface atom. NRC / Varian 3117 Thermal Evaporator This threshold typically is somewhere in the range 10–100 eV. NRC / Varian 3125 E-Beam Evaporator Preferential sputtering can occur at the start when a multicomponent solid Temescal BJD 1800 6 Pocket E-Beam Evaporator target is bombarded and there is no solid state diffusion. If the energy Temescal FC 1800 E-Beam Evaporator transfer is more efficient to one of the target components, and/or it is lesshttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  3. 3. Sputter Deposition System - Semiconductor Equipment Source Page 3 of 22 Temescal VES 2550 Four Pocket E-Beam Evaporator strongly bound to the solid, it will sputter more efficiently than the other. If in Used CHA 1000 E-Beam Evaporator an AB alloy the component A is sputtered preferentially, the surface of the Used CHA 600 Gold Evaporator solid will, during prolonged bombardment, become enriched in the B Used Semiconductor Equipment component thereby increasing the probability that B is sputtered such that Used Temescal FCE 3200 Six Pocket E - Beam Evaporator the composition of the sputtered material will be AB. VARIAN 3117 FILIMENT EVAPORATOR Varian 3118 Thermal Filament Evaporator Electronic sputtering Varian 3180 Sputtering System The term electronic sputtering can mean either sputtering induced by Veeco RF350 C2 IBD Ion Beam Deposition energetic electrons (for example in a transmission electron microscope), or VEECO/SLOAN ELECTRON BEAM EVAPORATOR sputtering due to very high-energy or highly charged heavy ions which lose Furnace and Oven energy to the solid mostly by electronic stopping power, where the electronic Lab-Line Squaroid DUO-VAC OVEN excitations cause sputtering.[8] Electronic sputtering produces high sputtering LINDBERG TUBE FURNACE yields from insulators, as the electronic excitations that cause sputtering are MRL Cyclone C430 LH Nitride/Oxidation Furnance not immediately quenched, as they would be in a conductor. One example of Vacuum Furnace for Hard Bake special parts this is Jupiters ice-covered moon Europa, where a MeV sulfur ion from Inductively coupled plasma-ICP Jupiters magnetosphere can eject up to 10,000 H2O molecules.[9] STS (Surface Tech Sys) MultiplexInductively-Coupled Plasma (ICP) Advanced Silicon Etch (ASE) System Potential sputtering STS Inductively Coupled Plasma High Density Plasma Etch STS Multiplex ASE AOE ICP CLUSTER TOOL In the case of multiply charged projectile ions a particular form of STS MultiplexInductively-Coupled Plasma (ICP) Advanced Silicon electronic sputtering can take place which has been termed potential Etch (ASE) System sputtering. In these cases the potential energy stored in multiply charged Lithography & Photoresist ions (i.e., the energy necessary to produce an ion of this charge state from its Metrology Systems neutral atom) is liberated when the ions recombine during impact on a solid surface (formation of hollow atoms). This sputtering process is characterized Clean Room Partice Count Meter model 100 by a strong dependence of the observed sputtering yields on the charge ESD RING Automatic Cold Resistance Meter of Sliders state of the impinging ion and can already take place at ion impact energies Hitachi CD-SEM S-8820 Used Semiconductor Equipment well below the physical sputtering threshold . Potential sputtering has only HItachi CD-SEM S-8840 Used Semiconductor Equipment been observed for certain target species and requires a minimum potential HITACHI Field Emission SEM (FE-SEM) S-5000 energy. Hitachi S-800 SEM Scanning Electron Microscope JWS-7555S Wafer Inspection Etching and chemical sputtering Kla-Tencor OmniMap Auto RS55 / tc USEDhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  4. 4. Sputter Deposition System - Semiconductor Equipment Source Page 4 of 22 PEGASUS 2000 Flying Height Test System Model FHT Removing atoms by sputtering with an inert gas is called `ion milling or ion Tencor TF-1 Thin films monitor etching. Used Hitachi CD-SEM Equipment Sputtering can also play a role in reactive ion etching (RIE), a plasma Used Hitachi FE-SEM/SEM Equipment process carried out with chemically active ions and radicals, for which the Used KLA-Tencor Metrology Equipment sputtering yield may be enhanced significantly compared to pure physical Zeiss/Leo DSM 982 FE SEM sputtering. Reactive ions are frequently used in Secondary Ion Mass Plasma Asher Descum Systems Spectrometry (SIMS) equipment to enhance the sputter rates. The Plasma Etcher mechanisms causing the sputtering enhancement are not always well Technics PEIIB Planar Etch Plasma System understood, but for instance the case of fluorine etching of Si has been Two Used Matrix 10 Plasma Asher Machine for 8 inch Wafe modeled well theoretically. Used Hydrogen Chloride (HCl) Etching System Sputtering which is observed to occur below the threshold energy of physical Rapid Thermal Process sputtering, is also often called chemical sputtering. The mechanisms behind A.G. Associates 410 Table such sputtering are not always well understood, and may be hard to AG ASSOCIATES 2146 distinguish from chemical etching. At elevated temperatures, chemical AG Associates 4100 Heatpulse Rapid Thermal Processor sputtering of carbon can be understood to be due to the incoming ions AG Associates Heatpulse 210 Rapid Thermal Process weakening bonds in the sample, which then desorb by thermal AG ASSOCIATES HEATPULSE 210 RAPID THERMAL activation. The hydrogen-induced sputtering of carbon-based materials PROCESSOR observed at low temperatures has been explained by H ions entering AG Associates Heatpulse 410 Rapid Thermal Anneal between C-C bonds and thus breaking them, a mechanism dubbed swift AG ASSOCIATES HEATPULSE 410 RAPID THERMAL chemical sputtering. PROCESSOR AG Associates Heatpulse 610 I Rapid Thermal Processor Applications and phenomena AG Associates Heatpulse 610 Rapid Thermal Anneal AG Associates Heatpulse 610 Rapid Thermal Process Film deposition AG ASSOCIATES HEATPULSE 610 RAPID THERMAL PROCESSOR Main article: Sputter deposition AG Associates Heatpulse RTP Sputter deposition is a method of depositing thin films by sputtering which AG Associates Heatpulse Services involves eroding material from a "target" source onto a "substrate" e.g. a AG Associates Heatpulse210 silicon wafer. Resputtering, in contrast, involves re-emission of the deposited AG Associates Heatpulse410 Rapid Thermal Processor material, e.g. SiO2 during the deposition also by ion bombardment. AG Associates Heatpulse610 Rapid Thermal Processor Sputtered atoms ejected into the gas phase are not in their thermodynamic AG ASSOCIATES MINIPULSE 310 RAPID THERMAL equilibrium state, and tend to deposit on all surfaces in the vacuum chamber. PROCESSORhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  5. 5. Sputter Deposition System - Semiconductor Equipment Source Page 5 of 22 AG Associates Minipulse310 Rapid Thermal Processor A substrate (such as a wafer) placed in the chamber will be coated with a APPLIED MATERIALS 0010-22033 Rapid Thermal Process thin film. Sputtering usually uses an argon plasma. APPLIED MATERIALS Centura 5200 APPLIED MATERIALS Centura 5200 TPCC Etching APPLIED MATERIALS Centura ACP 2X Radiance ISSG In semiconductor industry sputtering is used to etch the target. Sputter APPLIED MATERIALS Centura RTP TPCC XE+ etching is chosen in cases where a high degree of etching anisotropy is APPLIED MATERIALS Centura TPCC Rapid Thermal Anneal needed and selectivity is not a concern. One major drawback of this BOC EDWARDS Helios technique is wafer damage. BOC EDWARDS Helios S Rapid Thermal Processing BOC EDWARDS IGRC For analysis CEE/Brewer Science UV-Thermal Processing System Another application of sputtering is to etch away the target material. One DAINIPPON LA-3000-F such example occurs in Secondary Ion Mass Spectrometry (SIMS), where EATON NOVA / AXCELIS 808 the target sample is sputtered at a constant rate. As the target is sputtered, EATON NOVA / AXCELIS Reliance 850 the concentration and identity of sputtered atoms are measured using Mass INSTRON RHS 1533A Spectrometry. In this way the composition of the target material can be Koyo Thermo Systems RTP and RTA Systems:RLA3100 series determined and even extremely low concentrations (20 µg/kg) of impurities RLA1200 series detected. Furthermore, because the sputtering continually etches deeper into LPT TM 100 / 300 FC RTA RTP RTO RTN Systems the sample, concentration profiles as a function of depth can be measured. Mattson AST2800 Mattson AST2900 RTP In space Mattson AST3000 Sputtering is one of the forms of space weathering, a process that changes Mattson SHS-2900 RTA RTP System for 200 mm Wafer the physical and chemical properties of airless bodies, such as asteroids and METRON / AG ASSOCIATES 4108 Rapid Thermal Annealing RTA our moon. It is also one of the possible ways that Mars has lost most of RTP RTO RTN Systems its atmosphere and that Mercury continually replenishes its tenuous surface- METRON / AG ASSOCIATES Heatpulse 8108 Rapid Thermal bounded exosphere. Process RTA RTP RTN RTO Systems METRON / AG ASSOCIATES Heatpulse 8800 Rapid Thermal Anneal RTA RTP RTN RTO METRON / AG ASSOCIATES Heatpulse 8800 RTA RTP RTN RTO Rapid Thermal Anneal Modular Pro RTP-600S MPT Used UV-600 UV-OZONE CLEANING SYSTEMhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  6. 6. Sputter Deposition System - Semiconductor Equipment Source Page 6 of 22 MPTC RTP-600XP Rapid Thermal Annealing Systems RTP RTA RTN RTO Systems MPTC RTP-600XP Rapid Thermal Processors Systems RTA RTP RTO RTN Systems NEWYOUNG RTA 200HRapid Thermal Processing Systems RTO RTN RTA RTP Systems PEAK ALP 5000 Flash Rapid Thermal Annealing Systems RTN RTO RTP RTA Systems PPC 2016 BT Rapid Thermal Process Systems RTA RTP RTO RTN Equipment Rapid Thermal Processing: AG ASSOCIATES 8800 Rapid Thermal Processors: AET RX-V4 Rapid Thermal Processors: AG ASSOCIATES 210 Rapid Thermal Processors: AG ASSOCIATES 2106 Rapid Thermal Processors: AG ASSOCIATES 210M Rapid Thermal Processors: AG ASSOCIATES 2146 Rapid Thermal Processors: AG ASSOCIATES 410 Rapid Thermal Processors: AG ASSOCIATES 410 C23 Rapid Thermal Processors: AG ASSOCIATES 8108 Rapid Thermal Processors: AG ASSOCIATES Heatplus 2146 Rapid Thermal Processors: AG ASSOCIATES Heatpulse 2101-01 Rapid Thermal Processors: AG ASSOCIATES Heatpulse 210T Rapid Thermal Processors: AG ASSOCIATES Heatpulse 4100 Rapid Thermal Processors: AG ASSOCIATES Heatpulse 4108 Rapid Thermal Processors: AG ASSOCIATES Heatpulse 610 Rapid Thermal Processors: AG ASSOCIATES Heatpulse 8108 Rapid Thermal Processors: AG ASSOCIATES Heatpulse 8800 Rapid Thermal Processors: AG ASSOCIATES Mini-Pulse 310 Rapid Thermal Processors: APPLIED MATERIALS Centura Rapid Thermal Processors: APPLIED MATERIALS Centura 5200 Rapid Thermal Processors: APPLIED MATERIALS Centura 5200 TPCC Rapid Thermal Processors: APPLIED MATERIALS Centura ACPhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  7. 7. Sputter Deposition System - Semiconductor Equipment Source Page 7 of 22 Rapid Thermal Processors: APPLIED MATERIALS Centura RTP XE+ Rapid Thermal Processors: BOC EDWARDS TCS 1 Rapid Thermal Processors: BOC EDWARDS TCS-S Rapid Thermal Processors: DAINIPPON LA-820 Rapid Thermal Processors: JIPELEC JetFirst 300 Rapid Thermal Processors: MATTSON 3000 Rapid Thermal Processors: METRON / AG ASSOCIATES 4100 Rapid Thermal Processors: METRON / AG ASSOCIATES Heatpulse 8108 Rapid Thermal Processors: STEAG / MATTSON / AST 2800 Rapid Thermal Processors: STEAG / MATTSON / AST 2800e Rapid Thermal Processors: STEAG / MATTSON / AST SHS 2800 Rapid Thermal Processors: STEAG / MATTSON / AST SHS 3000 RAYTEK Marathon MR Series Pyrometer RTP 2 INCH 115V RAPID THERMAL PROCESSOR, RAPID THERMAL ANEALER RTP Matton SHS 2900 AST 2900 Rapid Thermal Process Spare Parts for AG Associates Product Lines SSI Solaris 150 Rapid Thermal Annealing System TEL / WAFERMASTERS SA0150LP Rapid Thermal Processing Systems TEL / WAFERMASTERS SRTF200-LP Rapid Thermal Processor RTA RTP RTN RTO System Used ANNEALSYS Products RTP & RTCVD AS-Master Used ANNEALSYS Products RTP & RTCVD AS-One Used Annealsys Rapid Thermal Annealing furnaces AS-Micro Used CEE/Brewer Science 2100 UV-Thermal processing Used CVD RTA RTP Systems Used Jipelec JetClip -200-mm RTP & RTCVD Cluster Tool Used Jipelec JetClip sg Used Jipelec JetFirst RTA-Low cost bench top RTP processor - Up to 12"https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  8. 8. Sputter Deposition System - Semiconductor Equipment Source Page 8 of 22 Used Jipelec JetStar -Versatile RTP processor to transfer your process from development to production. Used Koreavac KVR-2000 Series RTP(Rapid Thermal Process) Used Koreavac KVR-4000 Series RTP(Rapid Thermal Process) Used Koreavac KVR-6000 Series RTP(Rapid Thermal Process) Used Modular Process Technology Rapid Thermal Processing System: RTP-3000 Used Modular Process Technology Rapid Thermal Processing System: RTP-800S (200 mm) Used Modular Process Technology Rapid Thermal Processing Production System: MODULAR One Used Rapid Thermal Annealing System AO 500 Used Rapid Thermal Annealing System: RTP-600S (150 mm) Modular Process Technology Used SSI Inc Solaris 100 Rapid Thermal Processor Used SSI Inc Solaris 150 Rapid Thermal Processor Used SSI Inc Solaris 200 Rapid Thermal Processor Used SSI INC Solaris Eclipse Vacuum RTP Used SSI Solaris 150UV Used Summit XT RAPID THERMAL PROCESSING Used ULVAC Technologies MILA-5000-P-F Mini Lamp Annealer Used ULVAC Technologies MILA-5000-P-N Mini Lamp Annealer Used ULVAC Technologies MILA-5000-UHV Mini Lamp Annealer Used UniTemp GmbH RTP-1000-150 Front loading Used UniTemp GmbH RTP-1200-100 Front loading Used UniTemp GmbH VPO-1000-300 Top loading WAFERMASTERS 5BAO-200 Rapid Thermal Anneal Equipment RTA RTP RTN RTO Reactive ion etching-RIE Alcatel 601E DRIE Plasma-Therm Reactive Ion Etching System Model 70 Serie Plasmatherm SLR 720 RIE,700 series STS RIE systemhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  9. 9. Sputter Deposition System - Semiconductor Equipment Source Page 9 of 22 Used Plasmatherm 790 RIE Stand alone 790 RIE Sciber Breaker Dynatex DX-III wafer sciber breaker Dynatex GST-150 wafer sciber breaker Sputter Deposition System 2400 series single piece product line 2KVA Evaporator From CVC system 2KVA transformer AIRCO TEMESCAL FDC-8000 Sputtering Systems: Airco Temescal HRS 2550 Sputtering System AIRCO TEMESCAL HRS 2550 Sputtering Systems: AIRCO TEMESCAL VES 2550 Sputtering Systems: AKT 1600 Sputtering Systems: ALCATEL / MEIVAC / COMPTECH 2480 Sputter Deposition Systems: ALCATEL PUMA 500 Sputtering Systems: AMAT Endura® 5500 SIP EnCoRe™ System ANATECH / TECHNICS HUMMER V ANATECH / TECHNICS Hummer V-A Sputter Coater System ANATECH / TECHNICS HUMMER X ANATECH / TECHNICS RF-2C ANATECH / TECHNICS: HUMMER 6.2 ANATECH / TECHNICS: HUMMER IV Sputter Deposition System PECVD ANATECH / TECHNICS: HUMMER V ANATECH / TECHNICS: Hummer V-A Sputter ANATECH / TECHNICS: HUMMER VI ANATECH / TECHNICS: HUMMER VI Sputter Systems ANATECH / TECHNICS: HUMMER VII Anelva ILC-3935S Sputter APPLIED MATERIALS CENTURA 300MM APPLIED MATERIALS ENDURA 5500 SIP ENCORE APPLIED MATERIALS HDP APPLIED MATERIALS: Endurahttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  10. 10. Sputter Deposition System - Semiconductor Equipment Source Page 10 of 22 APPLIED MATERIALS: Endura 5500 APPLIED MATERIALS: Endura 5500 Sputter Deposition APPLIED MATERIALS: Endura 5500 Sputter Systems PECVD APPLIED MATERIALS: Endura 5500P Sputtering Coating Equipment APPLIED MATERIALS: Endura PECVD Semiconductor Equipment APPLIED MATERIALS: Endura Sputter Deposition Systems APPLIED MATERIALS: Endura Sputter Systems AURION Custom Sputter Systems Aurion Sputter AVIZA AL203 Process Module for Nano-ALD System AVIZA NANO-ALD Brooks Automation Gemini Express BALZERS: LLS 801 Bellopressor Technologies Four Stage Compressor Blank off Flange for CVC 2800/611 8" target P/N 288536 Blank off Flange for CVC 601 8" target Buy Perkin-Elmer Sputter CANON / ANELVA: C-7100 CANON / ANELVA: ECR 300E CANON / ANELVA: I-1012 CANON / ANELVA: I-1012 Sputter Coater CANON / ANELVA: I-1060 SVII Plus 1 CANON / ANELVA: ILC 1012 MK II CANON / ANELVA: ILC 1013 CANON / ANELVA: ILC 1015 CANON / ANELVA: ILC 1051 CANON / ANELVA: ILC 1060 CANON / ANELVA: ILC 1060SV CANON / ANELVA: ILC 3103 CANON / ANELVA: ILD 4100 CANON / ANELVA: MIG 430 CANON / ANELVA: SPF-540Hhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  11. 11. Sputter Deposition System - Semiconductor Equipment Source Page 11 of 22 CANON / ANELVA: SPF-710H CANON / ANELVA: SPF-730H CHA 600 Evaporator CHA Industries Mark 50 Source Evaporator CHA INDUSTRIES SPUTTERING SYSTEM CHA SE 600 EBEAM SYSTEM CHA WEB/ROLL SPUTTER COATER CHESSEN Sputter Systems CPA V2000 Five Target RF and DC Magnetron In Line CPA V2000 Five Target RF and DC Magnetron Inline Sputtering System CVC 601 Four Target RF Sputtering System CVC 601 LL Load Lock with RF Etch CVC 601 sputter systems CVC parts CVC SPUTTERING SYSTEM, ION ETCH AST-304 Denton Desktop Pro Sputtering System Denton Explorer Thin Film Deposition Platform Denton Integrity Precision Optics Coating Platform DENTON KSE 2AA Denton DENTON VACUUM DESK II EDWARDS 306 FILAMENT EVAPORATOR Edwards 306 Sputtering System Edwards AUTO 306 Sputtering System Edwards Auto 500 ELECTRON MICROSCOPY SCIENCES EMS575XD Fulintec FSE-ANE-IBS - 6”/ 8” wafer UBM sputter for sale GENCOA PLANAR MAGNETRON CATHODE INNO VAC KVTS-T0138 ION BEAM SPUTTER TARGET KDF 654ix Wafer Processing System KURT J. LESKER Vacuum Systemhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  12. 12. Sputter Deposition System - Semiconductor Equipment Source Page 12 of 22 L / VARIAN MB2-830 L91510 Perkin Elmer PE-2400 Sputtering System parts/repair w/Accessories Leybold Balzers Z660, Used, Oerlikon Complete System LEYBOLD HERAEUS A 1350 BM sputtering Systems LEYBOLD HERAEUS: A 1350 BM sputter LEYBOLD HERAEUS: Z650 LGA Thin Films Magnetron Sputter Source - High Vacuum DC/RF Magnetron Magnetron Sputtering Magnetron Sputtering Cathode Services Manufacturer: MAGNETRON Sputter Manufacturer: MAGNETRON Sputter coater MEIVAC / ALCATEL / COMPTECH VQ 200-ISO-U-SM Mfr of Sputter Systems MILL LANE DUAL CHAMBER RESEARCH SPUTTERING SYSTEM MILL LANE ENGINEERING REEL COATER 4123 MKS 250/B MKS 252A MRC / TEL Eclipse Mark II MRC / TEL Eclipse Mark II Pre-Star MRC / TEL Eclipse Mark IV MRC / TEL Eclipse Star MRC / TEL: Eclipse Mark II sputtering MRC / TEL: Eclipse Star MRC / TEL: Eclipse Star sputter coater MRC 600 Series Sputtering Tool MRC 603 II MRC 603 Sputter System MRC 603-III MRC INLINE SPUTTERING SYSTEM, CRYO PUMPED Used MRC 643 Sputtering System (643)https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  13. 13. Sputter Deposition System - Semiconductor Equipment Source Page 13 of 22 MRC 902 sputter MRC 903M MRC MRC 903M 3 TARGET SPUTTERING DEPOSITION SYSTEM MRC 943 Down Sputter System MRC 943 Down sputter system. MRC IN-LINE SPUTTER ETCH SYSTEM MRC 902 MRC Planar MRC THREE TARGET INLINE SPUTTERING SYSTEM MRC 903M NORDIKO: 2550 sputter deposition NORDIKO: 8550 NORDIKO: 8550 sputtering deposition NOVELLUS SYSTEM: CONCEPT 3 INOVA-xT sputter NOVELLUS SYSTEM: CONCEPT 3 sputter NOVELLUS: CONCEPT 2 sputter system NOVELLUS: MB2 sputter deposition NOVELLUS: MB2 used sputter coater NOVELLUS: MBB 830 sputtering systems NOVELLUS: XM 90 Used NRC / Varian 3117 Thermal Evaporator NRC / Varian 3125 E-Beam Evaporator Nu Vacuum Systems Ultrahigh Vacuum Box Coater OERLIKON / BALZERS Sprinter-9 OPAL: 3 Pro sputter despostion PELCO: 3 sputter deposition Perkin Elmer 2400 Sputter Tool: New Water Interlock Switch Details Perkin Elmer 2400 Sputtering System with RF Perkin Elmer 2400 Sputtering System with RF Generator Perkin Elmer 2400-SSA Physical Vapor Deposition Perkin Elmer 4400 Sputtering System Perkin Elmer 4410 PERKIN ELMER 4410 (WITH LOAD LOCK) Perkin Elmer 4410 Sputtering Systemhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  14. 14. Sputter Deposition System - Semiconductor Equipment Source Page 14 of 22 Perkin Elmer 4450 Sputtering PERKIN ELMER 5 kV Perkin Elmer 6J Sputtering System Perkin Elmer 8L Sputtering System Perkin Elmer PE-2400 Sputtering System parts/repair w/Accessories Perkin Elmer PVD System Available Parts Perkin Elmer Sputter Perkin-Elmer 2400-6J RF Sputter System, 3 target Perkin-Elmer 2400-8L Sputtering Deposition Systems Service Perkin-ELmer 2400-8SA Sputtering System Technical Service Perkin-Elmer 2400-8SA Sputtering Systems Perkin-elmer 4400 series batch product line Perkin-Elmer 4400 Sputtering Deposition Systems Service Perkin-Elmer 4410 Sputtering Deposition Systems Service PERKIN-ELMER 4450 SPUTTERING DEPOSITION SYSTEM Perkin-Elmer 4450 Sputtering Deposition Systems Service Perkin-Elmer 4480 Sputtering Deposition Systems Service PERKIN-ELMER PE 2400-8L Sputtering System Spare Parts Perkin-Elmer PE 2400-8L Sputtering Systems Perkin-Elmer PE 4400 Sputtering Systems Perkin-Elmer PE 4410 Sputtering Systems Perkin-Elmer PE 4450 Sputtering Systems Perkin-Elmer PE 4480 Sputtering Systems PERKIN-ELMER PE2400-8SA Sputtering System Spare Parts PERKIN-ELMER PE4400 Sputtering System Spare Parts PERKIN-ELMER PE4410 Sputtering System Spare Parts PERKIN-ELMER PE4450 Sputtering System Spare Parts PERKIN-ELMER PE4480 Sputtering System Spare Parts PERKIN-ELMER SPUTTERING DEPOSITION SYSTEM For Sale Perkin-Elmer Sputtering Deposition Systemshttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  15. 15. Sputter Deposition System - Semiconductor Equipment Source Page 15 of 22 PERKIN-ELMER SPUTTERING SYSTEM START-UP PROCEDURE Physical Vapor Deposition (PVD) Suppliers PLASMA SCIENCES: Arc PLASMA SCIENCES: HRC 150 PLASMA SCIENCES: HRC 200 sputter Plasma-Therm Versalock™ Cluster Based Platform PLATECH: 3 Pre-Owned Sputtering Systems PROCESS INTEGRATION: 944 used QUORUM TECH / BIO-RAD / POLARON: E-5100 QUORUM TECH / BIO-RAD / POLARON: E-5100 sputter QUORUM TECH / BIO-RAD / POLARON: E-5150 QUORUM TECH / BIO-RAD / POLARON: E-9200 QUORUM TECH / BIO-RAD / POLARON: ISI PS-2 SANYU: SC-701C sputter SEMICORE: SC 1500 sputter SFI Endeavor 8600 Cluster Sputtering SHARON VACUUM SPUTTERING SYSTEM SHIBAURA BM-1400PC SHIBAURA: CFS-12P-100H SHOWA SHINKU SBC-08C SHOWA SHINKU SBC-08CX SHOWA SHINKU SBC-10DXC SHOWA SHINKU SPH-2016 SHRADER sputter deposition used SIGMA INSTRUMENTS SID-142 SIGMA Sputtering System SLOAN SL 1800-S SONOTEK Ultrasonicator Flexicoat FC SPI 11425 SPI 11430 sputter SPI 11425/11430 Tabletop Sputter Coater for SEMhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  16. 16. Sputter Deposition System - Semiconductor Equipment Source Page 16 of 22 SPI-Module Sputter/Carbon Coater System Sputter Deposition Equipment Accessories Sputter Deposition Key Words-A Sputter Deposition Key Words-B ,C Sputter Deposition Key Words-D,E,F,G,H Sputter Deposition Key Words-I,J,K,L,M,N,O Sputter Deposition Key Words-P,Q,R Sputter Deposition Key Words-S,T,U,V,W,X,Y,Z sputter Varian 3180 3280 3190 3290 3290 STQ thin film sputtering sputter Varian 3180 3280 3190 3290 thin film sputtering SPUTTERED FILMS INC / SFI Endeavor 8600 SPUTTERED FILMS INC / SFI Shamrock 6 Sputtering and Evaporation Service Sputtering Deposit System Spare Parts Sputtering system about by Second Source, Inc. Sputtering system reliability ..... for the last 25 years Sputtering System, Perkin Elmer-4400 Sputtering Systems Emitech / Emcore K650 Sputtering Systems Emitech / Emcore K950 sputter Sputtering Systems Comtech Sputtering Systems Cvc 2800 Sputtering Systems Cvc 2800LL Sputtering Systems Cvc 601 Sputtering Systems Cvc 601LL Sputtering Systems Cvc AST 400 Sputtering Systems Cvc AST 601 Sputtering Systems Cvc ICS 660 Sputtering Systems Cvc PSE 403 Sputtering Systems Denton DESK I Sputtering Systems Denton DESK I Sputter Sputtering Systems Denton DESK II Sputtering Systems Denton DESK II coaterhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  17. 17. Sputter Deposition System - Semiconductor Equipment Source Page 17 of 22 Sputtering Systems Denton DESKTOP I Sputtering Systems Denton DESKTOP II Sputtering Systems Edwards 306 sputter Sputtering Systems Edwards E09602000 Sputtering Systems Edwards E09602000 sputter Sputtering Systems Emscope SC-650 sputter Sputtering Systems Emscope SM-300 sputter Sputtering Systems Enercon LM3214-09 Sputtering Systems Evatec Process System Radiance Sputter Sputtering Systems Fulintec FSE FU-16PEB Sputtering Systems Fulintec FSE-CLS-UBM-200 Sputtering Systems Fulintec FSE-UBM-200 Sputtering Systems Fulintec UBM Sputter Sputtering Systems Glow Research Sputterglow Sputtering Systems Indel 3 RF GUN Sputtering Systems Inficon XMS-1 Sputtering Systems Inficon XMS-3 Sputtering Systems Innotec DS 24 Sputtering Systems Innotec Sputter Sputtering Systems Innotec VS 24C Sputtering Systems VARIAN 3190 Sputtering Systems VARIAN 3280 Sputtering Systems Various sputtering target Sputtering Systems, Cpa / Kurdex Sputtering Systems: AMCI GT777 Sputtering Systems: AMCI GT7777 Sputtering Systems: AURION Sputtering Systems: BALZERS 450 Sputtering Systems: BALZERS BA 810 Sputtering Systems: BALZERS LLS 900 Sputtering Systems: BALZERS SCD 040 Sputtering Systems: BOC EDWARDS 306https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  18. 18. Sputter Deposition System - Semiconductor Equipment Source Page 18 of 22 Sputtering Systems: BOC EDWARDS AR Sputtering Systems: CANON / ANELVA SBH 2306DE Sputtering Systems: CPA / KURDEX 9900 Sputtering Systems: CPA V2000 Sputtering Systems: ISI PS 2 Sputter Coater Sputtering Systems: JM IOTA Sputtering Systems: KDF 945 Sputtering Systems: KRAUSS MAFFEI Triathlon Sputtering Systems: KURT J. LESKER Torus 10l Sputtering Systems: LEYBOLD / BALZERS ZH 620 Sputtering Systems: LEYBOLD / BPS Z 600 Sputtering Systems: LEYBOLD HERAEUS 240 Sputtering Systems: LEYBOLD HERAEUS A550 VZK Sputtering Systems: LEYBOLD HERAEUS APS 1104 Sputtering Systems: LEYBOLD HERAEUS LH 550 Sputtering Systems: LEYBOLD HERAEUS V1500 V-7 Sputtering Systems: LEYBOLD HERAEUS Z400 Sputtering Systems: LEYBOLD HERAEUS Z550 used Sputtering Systems: LEYBOLD HERAEUS Z550MS Sputtering Systems: LEYBOLD HERAEUS Z700 Sputtering Systems: LEYBOLD HERAEUS ZV 1200 used Sputtering Systems: LEYBOLD HERAEUS ZV 6000 Sputtering Systems: LEYBOLD Univex 450C Sputtering Systems: LEYBOLD Univex 500 Sputtering Systems: LK TECHNOLOGIES NGI 3000 Sputtering Systems: MAGNETRON Sputtering Sputtering Systems: MAT-VAC MVT-60X/3T Sputtering Systems: MEIVAC 2252 Sputtering Systems: MRC / KDF 943 Sputtering Systems: MRC / TEL Eclipse Mark II / UHV Sputtering Systems: MRC 600 Series Sputtering Systems: MRC 603https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  19. 19. Sputter Deposition System - Semiconductor Equipment Source Page 19 of 22 Sputtering Systems: MRC 643 Sputtering Systems: MRC 8667 Sputtering Systems: MRC 902A Sputtering Systems: MRC 902M Sputtering Systems: MRC 903 Sputtering Systems: MRC 903A Sputtering Systems: MRC 903M Sputtering Systems: MRC 943 Sputtering Systems: MRC SS-8633 Sputtering Systems: NORDIKO 2050 Sputtering Systems: PERKIN ELMER 2400 Sputtering Systems: PERKIN ELMER 2400 6J Sputtering Systems: PERKIN ELMER 2400 8J Sputtering Systems: PERKIN ELMER 2400 Series Sputtering Systems: PERKIN ELMER 2400-8L Sputtering Systems: PERKIN ELMER 2400-SSA Sputtering Systems: PERKIN ELMER 4400 Sputtering Systems: PERKIN ELMER 4410 Sputtering Systems: PERKIN ELMER 4450 Sputtertech Perkin-Elmer, TFE, and STI sputter systems SST 2200 Vacuum Furnace Suss Micro Tec 2004 Delta 20T/150 VPO Manual Coat Sustaining Engineering - sustainingengineering Tabletop Sputter Coater for SEM Samples TED PELLA INC SC650 TEL / VARIAN MB2 sputter TEL / VARIAN MB2-730 TEL / VARIAN MB2-730 coater TEL / VARIAN MB2-730 HT TEL / VARIAN MB2-730 HT-HT TEL / VARIAN MB2-730W TEMESCAL BJD-1800https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  20. 20. Sputter Deposition System - Semiconductor Equipment Source Page 20 of 22 Temescal BJD-1800 E-Beam Sputter System Temescal FC-3200 Temescal FCE 3200 Six-Pocket E-Beam Evaporator tescal.com TITAN SpraySafe TORR CRC-150 TORR CRC-150 sputter Torr International Model CRC 150 Sputtering System TOUSIMIS Samsputter IIA TOUSIMIS Samsputter IIA sputter coater TRIKON ELECTROTECH 6310 TRIKON / ELECTROTECH 308 TRIKON / ELECTROTECH MS 6200 TRIKON / ELECTROTECH MS 6210 TRIKON / ELECTROTECH MS 6210 sputter TRIKON / ELECTROTECH ND 6200 ULVAC Ceraus thin film sputter ULVAC Ceraus Z-1000 thin film coater ULVAC Ceraus Zi-1000 thin film sputtering ULVAC Ceraus Zi-1000N sputtering thin film ULVAC Ceraus ZX-1000 sputtering thin film coater ULVAC Ceraus ZX-1000 thin film deposition Ulvac Entron W-200T6 PVD System ULVAC MCH-4500 thin film deposition ULVAC MLX-3000N thin film sputtering UNAXIS / BALZERS LLS 502 Used Anatech Hummer VI SEM Sputter Coater Used Cryco Automated Dual Stack loader for Mini-brute Used CVC 601 Physical Vapor Deposition system Used ESC ELAS Large Area Sputtering System Used MRC 643 Horizontal PVD Sputtering System Used or Refurbished Perkin Elmer 2400 Series Sputtering Systemshttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  21. 21. Sputter Deposition System - Semiconductor Equipment Source Page 21 of 22 Used Perkin Elmer 2400-SSA Physical Vapor Deposition Used Perkin-Elmer Sputtering Deposition System Used Polaron Instruments Sputtering System Used Sputter Deposition Semiconductor Equipment Used Sputtering Systems Used Technics Hummer VI Sputtering System Used Vacuum Bell Jars VAGATHERM 550 thin film sputtering deposition VARIAN NOVELLUS M 2000/8 VARIAN NOVELLUS M2i M2000 sputtering VARIAN / NOVELLUS M2000 thin film sputtering VARIAN / NOVELLUS M2i sputtering thin film Varian 3118 E-Beam Evaporator VARIAN 3180 sputtering deposition thin film Varian 3180 Sputtering System Varian 3190 Metal Sputtering System, 5" VARIAN 3190 SPUTTER SYSTEM Varian 3290 Sputtering System VARIAN 3290STQ sputtering deposition thin film VARIAN HIGH PERFORMANCE VACUUM COATER SYSTEM 3118 VARIAN NOVELLUS M2i M2000 sputtering deposition thin film used semiconductor equipment VARIAN NOVELLUS M2i / M2000 VARIAN Varian 7 CFM D/D VARIAN XM 90 thin film deposition sputtering VEECO / CVC CX 6 thin film Veeco 400 E-Beam System Veeco 775 Veeco VEECO EBEAM Veeco VERGASON TECHNOLOGY RAPID CYCLE METALIZING SYSTEM Press-Side 2000 VST | Thin Film Deposition | Equipment Upgrade | Perkin-Elmerhttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012
  22. 22. Sputter Deposition System - Semiconductor Equipment Source Page 22 of 22 WELCH 1397 Welch XYTEC COATINGS (a BOC EDWARDS design) ML-8 Wafer Handling & Robotics Brooks Automation Wafer Aligner USED, 4 inch to 8 inch Wafer Probes ELECTROGLAS EG 1034 wafer probe or prober ELECTROGLAS EG 2001X wafer probe or prober ELECTROGLAS EG 2010 wafer probe or prober ELECTROGLAS EG 2080 wafer probe or prober ELECTROGLAS EG 4085X wafer probe or prober ELECTROGLAS EG 4085X wafer prober for parts Signatone Probe station S-250 Wet Processing Semitool SDC-400 photo mask etch spinner SH-801 Spin Rinse Dryer SV-702 Spin Rinse Dryer Wire & Die Bonding KTC Wire Bond Test machine Model: BT-30 W/TD Sitemap Recent site activity 2 Sign in | Report Abuse | Print Page | Remove Access | Powered By Google Siteshttps://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012

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