Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.
Hybrid Photonic integration @ Huawei:     for optical transport & C2C         Photonic integration in Si and InP:        O...
OutlineSi integration at LuxteraInP integration at Infinera• OOK• Coherent detection & advanced modulationSummaryPotential...
At @ Luxtera:Si photonics integration  Confidential and         3
Si optical chips and interconnect systems                                                                     Optical Filt...
Design experienceGrating couplersDesigned SOI production waferstructure •   Integration challenge •   Need best system com...
General rigorous device design methodology Functionality Architectural choices Design inputs and outputs  •   Input parame...
Wafer level testing: Design and architecture                              Million of multi-port devices on ea.            ...
At @ Infinera:InP photonics integration   Confidential and         8
10ch. x 10G OOK Tx and Rx PICsOptics and Photonics News (2009)             CS MANTECH Conference (2006)                   ...
10ch. x 10G OOK Transmitter module                                                                                        ...
Advanced modulation formats      Confidential and        11
Pol-Mux DQPSK Reference Tx box: Performance HW development and integration                                                ...
Reference Tx for PM-DQPSK and coherent QPSK                              (typical HW configuration)                Confide...
Typical test set for BER test (simplified)  OFC 2011 (OML7)                    Confidential and     14
Non-coherent DQPSK Rx  Passive PIC: uses 1-bit delay  Pros:   •   No LO frequency mismatch || Pol. demux done by MIMO anal...
Coherent Rx Active Rx PIC: uses DFB LO Pros:   •   Pol. tracking done by DSP ASIC digitally   •   DSP compensates for PMD,...
1 Tb/s Tx PIC                                                                       Each PIC:                             ...
InP DQPSK modulator“Terabit Superchannel Coherent InP PM-QPSK Transmitter PIC”       P. Evans, M. Fisher, R. Malendevich e...
Tx DFB Frequency Noise Power Spectral Density (PSD)       Fundamental problem: phase noise   σ = 2π ⋅ LW ⋅ ∆t             ...
First live network coherent PIC demo (2010)                 Confidential and             20
et al.Linear Tx driver                                      From coherent DSP                   Confidential and          ...
*                                                                                                et al.* O. Gerstel (VZ) e...
Gridless super-channel transmissionSame ref. as on slide 23                           Confidential and   23
“Elastic optical network”                              (spectrum defragmentation) Same ref. as on slide 23                ...
Potential future aspirations      Confidential and         25
PAM for 500mRef.: IEEE 100G taskforce                            Confidential and   26
3D Packaging for C2CRef.: Computer Systems Based on Silicon Photonic Interconnects,      Sun, IEEE Proceedings (2009)     ...
SummaryThe field of photonics integration is blossoming •   With applications in long-haul, metro, local, FTTH and datacen...
AddendumsConfidential and   29
AcademicsCREOL (Center for Research and Education in Optics &Lasers) Univ. of Central FloridaKiev National University •   ...
Upcoming SlideShare
Loading in …5
×

Candidate experience overview (2013)

625 views

Published on

  • Be the first to comment

  • Be the first to like this

Candidate experience overview (2013)

  1. 1. Hybrid Photonic integration @ Huawei: for optical transport & C2C Photonic integration in Si and InP: Overview of experience and expertise Roman Malendevich Confidential and proprietary 02/23/13
  2. 2. OutlineSi integration at LuxteraInP integration at Infinera• OOK• Coherent detection & advanced modulationSummaryPotential future aspirations• PAM for 500m• 3D packaging for C2C Confidential and 2
  3. 3. At @ Luxtera:Si photonics integration Confidential and 3
  4. 4. Si optical chips and interconnect systems Optical Filters - DWDM Flip-chip bonded lasers 10G Modulators 4 km 10G Rx Fiber cable Ge detectors, TIAs Ceramic Package copper SOI transistor Optical “wire” SOI transistor (waveguide) poly Si WG Field oxide "Active" Si Si Buried Oxide (BOX) "Handle" Si Confidential and 4
  5. 5. Design experienceGrating couplersDesigned SOI production waferstructure • Integration challenge • Need best system compromise of performances of individual components “Photonics Spectra”, March 2006 – Grating couplers (IL and bandwidth) – Waveguide loss – Modulators (speed and IL) – AWG (cross-talk and IL) – Manufacturability and yield Confidential and 5
  6. 6. General rigorous device design methodology Functionality Architectural choices Design inputs and outputs • Input parameters interactions Theoretical limits Key trade-offs Design: • theory • modeling & simulations • experimental DOEs (tape-outs) Design and process sensitivities • corner cases, Monte-Carlo statistics • manufacturability, yields Skewing test results • Repeatability, reproducibility, accuracy, Gage R&R Correlations and building models Confidential and 6
  7. 7. Wafer level testing: Design and architecture Million of multi-port devices on ea. wafer fibers RF • 6D alignment Multiple input-output fibers • separated by only 127um DC Finds ea. device in seconds • not minutes Initial aligning structures: • one-port reflecting Littrow gratings Capacitor Z-axis spacing sensor • tight 5um air gap across 8” wafer Operator-free 24/7 Still in production (10 years) • 9 patents 8” Si wafer “Photonics Spectra”, March 2006 Confidential and 7
  8. 8. At @ Infinera:InP photonics integration Confidential and 8
  9. 9. 10ch. x 10G OOK Tx and Rx PICsOptics and Photonics News (2009) CS MANTECH Conference (2006) Confidential and 9
  10. 10. 10ch. x 10G OOK Transmitter module 200G spacing 0 Normalized Power (dB) -10 -20 -30 -40 -50 Tx PIC -60 1.525 1.530 1.535 1.540 1.545 Wavelength (µm)Fiber Systems, Lightwave Europe (2006) OPN (2009) Confidential and 10
  11. 11. Advanced modulation formats Confidential and 11
  12. 12. Pol-Mux DQPSK Reference Tx box: Performance HW development and integration Amplitude • Ref Tx to Ref Rx: test data shown • OSNR-loaded long-term (24/7) stability <0.1dB Q Phase 90o 0oTE 180o 270oTM Confidential and 12
  13. 13. Reference Tx for PM-DQPSK and coherent QPSK (typical HW configuration) Confidential and 13
  14. 14. Typical test set for BER test (simplified) OFC 2011 (OML7) Confidential and 14
  15. 15. Non-coherent DQPSK Rx Passive PIC: uses 1-bit delay Pros: • No LO frequency mismatch || Pol. demux done by MIMO analog control • No need for coherent DSP ASIC || Saves 1-2 yrs development time || Saves power Cons: • Reduced Rx power sensitivity • TE/TM paths must be bit aligned – need integrated PBS and pol. rotator → High losses in InP • MIMO circuits’ zero offsets complicate pol. tracking || Reduced Q performance MIMO ASIC 1-bit delayOFC 2011 (OML7) Confidential and 15
  16. 16. Coherent Rx Active Rx PIC: uses DFB LO Pros: • Pol. tracking done by DSP ASIC digitally • DSP compensates for PMD, CD • PBS can be external • Better Rx power sensitivity Cons: • Requires development time of complex, power-hungry DSP • Tx DFB and LO DFB must have limited linewidth, phase noise“10-channel, 28 Gbaud PM-QPSK, monolithic InP Terabit Superchannel Receiver PIC” M. Kato, R. Malendevich, D. Lambert et al., 2011 IEEE Photonics invited, & OFC 2011, invited Confidential and 16
  17. 17. 1 Tb/s Tx PIC Each PIC: >400 integrated functions Each λ:“Terabit Superchannel Coherent InP PM-QPSK Transmitter PIC” P. Evans, M. Fisher, R. Malendevich et al., Opt. Express 19 2011 & OFC 2011 (post-deadline) Confidential and 17
  18. 18. InP DQPSK modulator“Terabit Superchannel Coherent InP PM-QPSK Transmitter PIC” P. Evans, M. Fisher, R. Malendevich et al., Opt. Express 19 2011 & OFC 2011 (post-deadline) Confidential and 18
  19. 19. Tx DFB Frequency Noise Power Spectral Density (PSD) Fundamental problem: phase noise σ = 2π ⋅ LW ⋅ ∆t Linewidth < 1MHz Linewidth < 1MHzRef. on slide 18 Confidential and 19
  20. 20. First live network coherent PIC demo (2010) Confidential and 20
  21. 21. et al.Linear Tx driver From coherent DSP Confidential and 21
  22. 22. * et al.* O. Gerstel (VZ) et al, “Elastic Optical Networking: A New Dawn for the Optical Layer?”, IEEE Comm. Magazine, 2012 Confidential and 22
  23. 23. Gridless super-channel transmissionSame ref. as on slide 23 Confidential and 23
  24. 24. “Elastic optical network” (spectrum defragmentation) Same ref. as on slide 23 Confidential and 24
  25. 25. Potential future aspirations Confidential and 25
  26. 26. PAM for 500mRef.: IEEE 100G taskforce Confidential and 26
  27. 27. 3D Packaging for C2CRef.: Computer Systems Based on Silicon Photonic Interconnects, Sun, IEEE Proceedings (2009) Confidential and 27
  28. 28. SummaryThe field of photonics integration is blossoming • With applications in long-haul, metro, local, FTTH and datacenter networks, as well as C2C and MCM communication – Even in your living room! • A number of start-ups (Aurrion, Skorpio Technologies, Luxtera) and giants (Intel, Huawei, Cisco/Lightwire, Oracle/Sun, IBM, Finisar, Samsung) intensifying the field • The future of photonic integration looks as promising as ever • I have personally worked on OOK and coherent PICs, modules and systems, integrated both in Si and InP – From concept to real world, customer demos and production Confidential and 28
  29. 29. AddendumsConfidential and 29
  30. 30. AcademicsCREOL (Center for Research and Education in Optics &Lasers) Univ. of Central FloridaKiev National University • 1st runner-up National Physics Olympics Confidential and 30

×