This report covers the design analysis of an Ericsson LTE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson LTE. The unit was manufactured in Q1 2012. Component and semiconductor suppliers mentioned in this report include: Analog Devices, Broadcom, Ericsson, ETAL Group, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies, Integrated Device Technology, Kemet, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nichicon, Nihon Denpa Kogyo, NXP Semiconductors, ON Semiconductor, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors.Features:' Complete Part Number/Marking' Component Manufacturer Identification' Function Component Description' Package TypeImportant Note: There is NO component pricing contained within the report.

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Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit
Published on April 2013
Report Summary
This report covers the design analysis of an Ericsson LTE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601
base station platform for Ericsson LTE. The unit was manufactured in Q1 2012.
Component and semiconductor suppliers mentioned in this report include:
Analog Devices, Broadcom, Ericsson, ETAL Group, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies,
Integrated Device Technology, Kemet, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nichicon, Nihon
Denpa Kogyo, NXP Semiconductors, ON Semiconductor, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, STMicroelectronics,
TDK-Epcos, Texas Instruments, Vishay Semiconductors.
Features:
' Complete Part Number/Marking
' Component Manufacturer Identification
' Function Component Description
' Package Type
Important Note: There is NO component pricing contained within the report.
Table of Content
TABLE OF CONTENTS
EXECUTIVE SUMMARY 5
Active/Passive Component Summary 5
Important Note 5
CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM 6
Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering 6
CHAPTER 2: DUL MECHANICAL ANALYSIS 9
Mechanical Analysis 9
CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM 16
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Semiconductor Heat Sinks 29
APPENDIX A - PASSIVE CASE SIZE ANALYSIS 33
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS 37
TABLES
Table 1: DUL PCB Top Area A1 Bill of Materials 22
Table 2: DUL PCB Top Area A2 Bill of Materials 23
Table 3: DUL PCB Bottom Area B Bill of Materials 27
Table 4: Passive Component Case Size Distribution by System Subsection 34
Table 5: Identified Passive Component Supplier Distribution by System Subsection 35
Table 6: Active/Passive Component Distribution by System Subsection 36
Table 7: Active Semiconductor/Component Vendor Distribution by System Subsection 38
EXHIBITS
Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System.7
Exhibit 2: Ericsson DUL System Block Diagram.8
Exhibit 3: DUL Unit, Front 9
Exhibit 4: DUL Unit, Back10
Exhibit 5: DUL Unit, Left Side 10
Exhibit 6: DUL Unit, Top 11
Exhibit 7: DUL Unit, Bottom 12
Exhibit 8: DUL Top Shield, External View 13
Exhibit 9: DUL Top Shield, Internal View 13
Exhibit 10: DUL Bottom Shield, External View14
Exhibit 11: DUL Bottom Shield, Internal View14
Exhibit 12: DUL Bottom Shield, Front View 15
Exhibit 13: DUL Bottom Shield, Rear View 15
Exhibit 14: DUL 20 01 System, Exploded Side View15
Exhibit 15: DUL PCBTop View 16
Exhibit 16: DUL Baseband Processing/CPRI/Interface PCB Top, Area A 17
Exhibit 17: DUL Baseband Processing PCB Bottom, Area B 18
Exhibit 18: DUL PCB Top Area A1 Component Diagram 19
Exhibit 19: DUL PCB Top Area A2 Component Diagram 20
Exhibit 20: DUL Baseband Processing/CPRI/Interface Block Diagram 21
Exhibit 21: DUL PCB Bottom Area B Component Diagram 26
Exhibit 22: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Front View 29
Exhibit 23: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Side View29
Exhibit 24: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Bottom View 30
Exhibit 25: Semiconductor IC Heat Sink Dimensions, 27mm30
Exhibit 26: Semiconductor IC Heat Sink Dimensions, 35mm31
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Exhibit 27: Semiconductor IC Heat Sink Dimensions, 41mm32
Exhibit 28: Passive Component Case Size Distribution 33
Exhibit 29: Identified Passive Component Market Share by Vendor 36
Exhibit 30: Active Semiconductor Component Share 37
Exhibit 31: High Pin Count IC vsDiscretes 39
Exhibit 32: Active Semiconductor Market Share by Vendor39
Exhibit 33: High Pin Count (64+) Active Semiconductor Market Share by Vendor 40
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