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Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit

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This report covers the design analysis of an Ericsson LTE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson LTE. The unit was manufactured in Q1 2012. Component and semiconductor suppliers mentioned in this report include: Analog Devices, Broadcom, Ericsson, ETAL Group, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies, Integrated Device Technology, Kemet, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nichicon, Nihon Denpa Kogyo, NXP Semiconductors, ON Semiconductor, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors.Features:' Complete Part Number/Marking' Component Manufacturer Identification' Function Component Description' Package TypeImportant Note: There is NO component pricing contained within the report.

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Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit

  1. 1. ReportLinker Find Industry reports, Company profilesand Market Statistics>> Get this Report Now by email!Design Analysis Ericsson LTE DUL 20 01 Digital Baseband UnitPublished on April 2013Report SummaryThis report covers the design analysis of an Ericsson LTE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601base station platform for Ericsson LTE. The unit was manufactured in Q1 2012.Component and semiconductor suppliers mentioned in this report include:Analog Devices, Broadcom, Ericsson, ETAL Group, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies,Integrated Device Technology, Kemet, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nichicon, NihonDenpa Kogyo, NXP Semiconductors, ON Semiconductor, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, STMicroelectronics,TDK-Epcos, Texas Instruments, Vishay Semiconductors.Features: Complete Part Number/Marking Component Manufacturer Identification Function Component Description Package TypeImportant Note: There is NO component pricing contained within the report.Table of ContentTABLE OF CONTENTSEXECUTIVE SUMMARY 5Active/Passive Component Summary 5Important Note 5CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM 6Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering 6CHAPTER 2: DUL MECHANICAL ANALYSIS 9Mechanical Analysis 9CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM 16Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit (From Slideshare) Page 1/5
  2. 2. ReportLinker Find Industry reports, Company profilesand Market Statistics>> Get this Report Now by email!Semiconductor Heat Sinks 29APPENDIX A - PASSIVE CASE SIZE ANALYSIS 33APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS 37TABLESTable 1: DUL PCB Top Area A1 Bill of Materials 22Table 2: DUL PCB Top Area A2 Bill of Materials 23Table 3: DUL PCB Bottom Area B Bill of Materials 27Table 4: Passive Component Case Size Distribution by System Subsection 34Table 5: Identified Passive Component Supplier Distribution by System Subsection 35Table 6: Active/Passive Component Distribution by System Subsection 36Table 7: Active Semiconductor/Component Vendor Distribution by System Subsection 38EXHIBITSExhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System.7Exhibit 2: Ericsson DUL System Block Diagram.8Exhibit 3: DUL Unit, Front 9Exhibit 4: DUL Unit, Back10Exhibit 5: DUL Unit, Left Side 10Exhibit 6: DUL Unit, Top 11Exhibit 7: DUL Unit, Bottom 12Exhibit 8: DUL Top Shield, External View 13Exhibit 9: DUL Top Shield, Internal View 13Exhibit 10: DUL Bottom Shield, External View14Exhibit 11: DUL Bottom Shield, Internal View14Exhibit 12: DUL Bottom Shield, Front View 15Exhibit 13: DUL Bottom Shield, Rear View 15Exhibit 14: DUL 20 01 System, Exploded Side View15Exhibit 15: DUL PCBTop View 16Exhibit 16: DUL Baseband Processing/CPRI/Interface PCB Top, Area A 17Exhibit 17: DUL Baseband Processing PCB Bottom, Area B 18Exhibit 18: DUL PCB Top Area A1 Component Diagram 19Exhibit 19: DUL PCB Top Area A2 Component Diagram 20Exhibit 20: DUL Baseband Processing/CPRI/Interface Block Diagram 21Exhibit 21: DUL PCB Bottom Area B Component Diagram 26Exhibit 22: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Front View 29Exhibit 23: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Side View29Exhibit 24: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Bottom View 30Exhibit 25: Semiconductor IC Heat Sink Dimensions, 27mm30Exhibit 26: Semiconductor IC Heat Sink Dimensions, 35mm31Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit (From Slideshare) Page 2/5
  3. 3. ReportLinker Find Industry reports, Company profilesand Market Statistics>> Get this Report Now by email!Exhibit 27: Semiconductor IC Heat Sink Dimensions, 41mm32Exhibit 28: Passive Component Case Size Distribution 33Exhibit 29: Identified Passive Component Market Share by Vendor 36Exhibit 30: Active Semiconductor Component Share 37Exhibit 31: High Pin Count IC vsDiscretes 39Exhibit 32: Active Semiconductor Market Share by Vendor39Exhibit 33: High Pin Count (64+) Active Semiconductor Market Share by Vendor 40Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit (From Slideshare) Page 3/5
  4. 4. ReportLinker Find Industry reports, Company profilesand Market Statistics>> Get this Report Now by email!Fax Order FormTo place an order via fax simply print this form, fill in the information below and fax the completed form to:Europe, Middle East and Africa : + 33 4 37 37 15 56Asia, Oceania and America : + 1 (805) 617 17 93If you have any questions please visit http://www.reportlinker.com/notify/contactOrder InformationPlease verify that the product information is correct and select the format(s) you require.Product FormatsPlease select the product formats and the quantity you require.Contact InformationPlease enter all the information below in BLOCK CAPITALSTitle: Mr Mrs Dr Miss Ms ProfFirst Name: _____________________________ Last Name: __________________________________Email Address: __________________________________________________________________________Job Title: __________________________________________________________________________Organization: __________________________________________________________________________Address: __________________________________________________________________________City: __________________________________________________________________________Postal / Zip Code: __________________________________________________________________________Country: __________________________________________________________________________Phone Number: __________________________________________________________________________Fax Number: __________________________________________________________________________Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit1 User License--USD 7 500.00 Quantity: _____Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit (From Slideshare) Page 4/5
  5. 5. ReportLinker Find Industry reports, Company profilesand Market Statistics>> Get this Report Now by email!Payment InformationPlease indicate the payment method, you would like to use by selecting the appropriate box.Payment by credit card Card Number: ______________________________________________Expiry Date __________ / _________CVV Number _____________________Card Type (ex: Visa, Amex…) _________________________________Payment by wire transfer Crédit MutuelRIB : 10278 07314 00020257701 89BIC : CMCIFR2AIBAN : FR76 1027 8073 1400 0202 5770 189Payment by check UBIQUICK SAS16 rue Grenette – 69002 LYON, FRANCEPlease note that by ordering from Reportlinker you are agreeing to our Terms and Conditions athttp://www.reportlinker.com/index/termsPlease fax this form to:Europe, Middle East and Africa : + 33 4 37 37 15 56Asia, Oceania and America : + 1 (805) 617 17 93Customer signature: Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit (From Slideshare) Page 5/5

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