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HDT: General overview April 1999

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General overview of HDT activity and collaborations in 1999, by Emmanuel Leroux

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HDT: General overview April 1999

  1. 1. 1 GENERAL OVERVIEW Emmanuel LEROUX Chief Application Engineer
  2. 2. Application Domain • Signal Integrity investigation – efficient handling of huge number of transmission lines – simultaneous analysis of transmission, crosstalk and switching noise issues • High-speed and complex system design&validation • MCM, PCB, Backplane, Interconnection layout check • EMC/EMI analysis • Hardware quality verification
  3. 3. Application Market • Telecom • Computer • Automotive • Aerospace • Automatic Test Equipment • Measurement • Biomedical • Consumer Electronics
  4. 4. Technologies supported • PCB • MCM • Hybrid Interconnect levels • multiboards • backplane • LANS • entire apparatus
  5. 5. Platforms supported • HP 9000/700 Series • Sun SPARC , ULTRA Series • PC Windows NT 4.0
  6. 6. 6 of 17 THE CONCEPT PRESTO 123456 789 FILE_TYPE=HDT_PLIB; TIME=Thu Dec 10 10:45:33 1992 COMPONENT=AC04, 74AC04; FAMILY=FACT; PACKAGE=DEFAULT, DIP14, SOIC14; FACTORY=DEFAULT; TYPE=IC; NPINS=14; BEGIN_PIN FACT_DR24_P=2,4,6,8,10,12; FACT_RC_P=1,3,5,9,11,13; FACT_GND_P=7; FACT_VCC_P=14; END_PIN; BEGIN_FUNCTION DRIVER=2,4,6,8,10,12; RECEIVER=1,3,5,9,11,13; POWER_FACT=14; GROUND_FACT=7; END_FUNCTION; END. Driver Receiver SSN report Compliance analysis report Overshoots undershoots rise and fall time report 398.00 399.00 400.00 401.00 402.00 403.00 404.00404.40 TIME[nS] -2.00 V -1.75 V -1.50 V -1.25 V -1.00 V -0.75 V -0.50 V V(116) 70.00 80.00 90.00 100.00 110.00 120.00 130.00 140.00 150.00 160.00 170.00 180.00 -5.00V -4.00V -3.00V -2.00V -1.00V 0.00V 1.00V 2.00V 3.00V 4.00V 5.00V 6.00V 7.00V 8.00V
  7. 7. 7 of 17 The HDT line: “The Backbone”  SPRINT – Simulation Program of Response of Integrated Network Transients  SIGHTS – Standard Interface for Graphic Handling of Transient Signals  Mod-env – Modeling environment
  8. 8. 8 of 17 The HDT line: “Signal Integrity”  PRESTO – Post-layout Rapid Exhaustive Simulation and Test of Operation  TEMPO – Tool for Electrical Multiple Performance Optimization  XTALK – CrossTALK  SSN – Simultaneous Switching Noise
  9. 9. 9 of 17 The HDT line: “EMC”  PRESTO_CNT – Post-layout simulation to evaluate Conducted Noise Transmission  EMIR – EMIssion Radiated  EMIR-Cable – Cable attached PCB emission & conducted noise transmission analysis
  10. 10. 10 of 17 The differentiators: “Fast” Remember this: approx 0.3 secs for single net simulation! • Comparison between simulation and measures of high-speed multiboard system (155Mbit/s) • 50000 elements • 32 simultaneous input sequence • 16000 time points • 60 min. simulation time on a HP 750
  11. 11. 11 of 17  Simultaneous simulation of all nets of a complex PCB is available  Presto can simulate signal integrity, crosstalk but also simultaneous switching noise on vcc/gnd nets or planes  Many benchmark results are available to demonstrate a good comparison with measurement The differentiators: “Accurate”
  12. 12. 12 of 17 The differentiators: “User friendly” 70.00 80.00 100.00 120.00 140.00 160.00 180.00 TIME[nS] -4.00V -2.00V 0.00V 2.00V 4.00V 6.00V 8.00V #U4_1 #IC23_4 lower and upper masks mask violations Net CLK1 upper and lower masks v iolation Error f igure: 8.12 Net DAT1 upper and lower masks v iolation Error f igure: 6.01 Net ADD1 lower mask v iolation Error f igure: 0.21 Net ADD2 upper mask v iolation Error f igure: 0.11 Net ADD3 upper mask v iolation Error f igure: 0.11 Net RD no v iolation Error f igure: - Net RDN no v iolation Error f igure: - 70.00 80.00 100.00 120.00 140.00 160.00 180.00 TIME[nS] -4V -2V 0V 2V 4V 6V 8V Eye-diagram opening Jitter
  13. 13. 13 of 17  It is possible to predict results of precompliance tests for: – RADIATED EMISSIONS – CONDUCTED NOISE SUSCEPTIBILITY – CONDUCTED EMISSIONS The differentiators: “A complete solution”
  14. 14. 14 of 17 10 100 1 10 320 10 0 10 20 30 40 50 60 70 80 Frequency in MHz |E| in dBV/m EN 55022 Emissions fromPCB + cable: measurement Emissions fromPCB + cable: simulation Emissions fromPCB: simulation Emissions from the cable: simulation The differentiators: “Advanced”
  15. 15. Collaborations • Research centers: »CSELT inside of THRIS product (telecom market) »COREP »ITALTEL in EMC/EMI
  16. 16. • University research&thesis: »Politecnico di Torino (Prof. Canavero), »Università di Ancona (Prof. De leo), »Università di L’Aquila (Prof. Orlandi), »University of Belgrade (Prof. Djordjeviz), »University of Lille (Prof. Demoulin) Collaborations
  17. 17. • EUROPRACTICE Training Courses: »EMC/EMI design for Printed Circuit Boards • ESPRIT ESD: »EMCLO (Magneti Marelli) »OMEGA (Aerospatiale) »MERITA (Bull) »RISIP (GEA) Collaborations

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