Low Cost Bumping for RFID Chips

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Low Cost Bumping for RFID Chips

  1. 1. Low-Cost RFID IC Packaging and Assembly Workshop November 14th 2005 Low Cost Bumping for RFID Chips Dr. E. Zakel; T.Oppert www.pactech.de Certified DIN EN ISO 9001
  2. 2. Content • Electroless Ni/Au Bumping – Market share & Usage – Process/Yield/Reliability – Equipment – Assembly – Applications Certified DIN EN ISO 9001
  3. 3. 1995 Locations Worldwide 2005 Sweden Finland Denmark Pac Tech GmbH Pac Tech USA Inc Berlin/ Nauen Santa Clara, CA Italy Korea Boston Tokyo Israel Fukui China Taiwan Thailand Application Center Philippines Singapore Manufacturing Distributor/ Rep. Facilities Office Certified DIN EN ISO 9001
  4. 4. I Electroless Ni/Au Bumping Market Share & Usage Certified DIN EN ISO 9001
  5. 5. Worldwide Use of Electroless Ni/Au USA (30%) Production 50% Europe (40%) Implementation Qualification 30% Distribution Asia (30%) Status Prod. Ramp Up 20% Memory 12.5% Applications RFID 20% RFID – Growth ! Pass. Comp./CSP's 20% MOSFET 10% LCD Driver 2.5% ASIC 22.5% Medical 12.5% Certified DIN EN ISO 9001
  6. 6. Worlwide Implementation of electroless Ni/Au for Al pad metalization ♣ Europe - 1 subcontractor bumping facility - 4 wafer foundries ♣ Asia - 4 subcontractor facilities - 5 wafer foundries ♣ USA - 2 subcontractor facilities - 3 wafer foundries Certified DIN EN ISO 9001
  7. 7. Main products using electroless Ni/Au - ASIC (Sensors) - LCD Drivers - PowerMOS (Automotive) - MOSFET - Protection devices (Passives) CSP‘s, WLCSP‘s - Memories and memory modules - Consumer electronics - Battery control (Mobile Phone) - Medical (Ear phone) • Products under very high price pressure (RFID) Certified DIN EN ISO 9001
  8. 8. Business Development – Licenses of Pac Tech Asia China n.a. Europe & Asia PacTech USA WL-CSP USA Europe STW RFID Memory SubCon Japan Korea SubCon Growth 2000 2001 2002 2003 2004 2005 2006 Year Certified DIN EN ISO 9001
  9. 9. II Electroless Ni/Au Bumping Process/Yield/Reliability Certified DIN EN ISO 9001
  10. 10. Bumping methods Product Scale Cost Electroless Ni/Au mass production how Electroplated Au mass production high Au-Stud small/medium high production Ni/Au + Solder Mass low Electroless Pd Development n.a. Certified DIN EN ISO 9001
  11. 11. Comparison of Bumps for ACF/ NCP bonding Electroplated Au Electroless Ni/ Au Plating Base Al - Pad Al - Pad Passivation Passivation Si - Wafer Si - Wafer - Low Hardness - Lowest Cost - State of the Art - Higher Hardness Requires Modified Assembly Parameters - Single Wafer Process - Batch Process up to 50 Wafers - Volume Production for RFID Applications Certified DIN EN ISO 9001
  12. 12. Under Bump Metal Process Electroless Plating of Ni/Au Bumps 1/2 Backside Coating Pad Cleaning Pad Activation Electroless Nickel Flash Gold Coating Removal Certified DIN EN ISO 9001
  13. 13. Under Bump Metal Process Electroless Plating of Ni/Au Bumps 2/2 Backside Coating Aluminum Cleaning Zincate Pretreatment Electroless Nickel Immersion Gold Coating Removal Certified DIN EN ISO 9001
  14. 14. 25µm Ni/Au UBM on RFID-Wafers 1/2 Customer A Certified DIN EN ISO 9001
  15. 15. 20µm Ni/Au UBM on RFID-Wafers 2/2 Customer B Certified DIN EN ISO 9001
  16. 16. Shearforce Measurements of 25µm Ni/Au Customer A Shearvalue: 725g Shearheight @ 9µm Certified DIN EN ISO 9001
  17. 17. Yield (%) 90 91 92 93 94 95 96 97 98 99 503133; 10913 100 503132; 10916 484828; 10917 484819; 10918 503120; 10919 503489; 10920 503131; 10921 503770; 11012 503768; 11013 Certified DIN EN ISO 9001 503767; 11014 503769; 11015 503769; 11015 HHSSR.00; 11040 HHST2.00; 11041 Lot # HHSSW.00; 11094 Customer A HHSSW.00; 11094 HHSSY.00; 11095 503771; 11096 503772; 11097 HHST1.00; 11133 HHSSS.00; 11134 Bump Yield Ni/Au September 2005 HHSSS.00; 11134 HHST0.00; 11135 HHST4.00; 11178 HHSST.00; 11179
  18. 18. Yield (%) 98,00 80,00 85,00 90,00 95,00 100,00 10932 105,00 10948 10964 10981 10987 10994 11005 11017 11023 Certified DIN EN ISO 9001 11035 11057 11063 11081 11087 Process # 11101 Customer B 11106 11122 11138 11151 11157 11167 Bump Yield Ni/Au September 2005 11184 11191 11196 11201
  19. 19. Days 10 93 0,00 1,00 2,00 3,00 4,00 5,00 6,00 7,00 8,00 9,00 10,00 10 2 94 10 5 95 10 5 96 10 7 98 10 4 99 11 1 00 11 3 00 11 9 02 11 1 03 11 4 Certified DIN EN ISO 9001 05 11 7 06 11 3 08 11 0 08 11 6 10 Process # 11 0 Customer B 10 11 6 12 11 1 13 11 6 15 11 0 15 11 6 16 11 6 18 Process Time September 2005 11 4 19 11 0 19 11 6 20 2
  20. 20. Reliability - Smart Label Customer C Chip size: 2.5 x 2.5 mm Number of I/O's: 4 Pitch: 400 µm Assembly type: ACF Substrate: Polyester Reliability: · 40°C, 80% rH: 1000 hours - no failure · 125°C 1000 hours - no failure · mechanical torque(ISO) 500 cycles - no failure Number of samples for test conditions: 100 Certified DIN EN ISO 9001
  21. 21. III Electroless Ni/Au Bumping Equipment Certified DIN EN ISO 9001
  22. 22. Pacline 300 - A50 8 Plating Systems in the Field Certified DIN EN ISO 9001
  23. 23. Electroless UBM Advantages ♣ Maskless Process ♣ No Sputtering ♣ Low Initial Capital Investment ♣ Quality/Reliable/Proven Chemistries ♣ Suitable for Solder Bumping & Adhesives ♣ Wire bondable Interface ♣ Less cost than Electrolytic Plating • 150 Wafers / hour ♣ Fastest and Most Cost Effective Method • 4“ – 12“ Capability • SECS GEM • 300mm Handling • SPC Sofware Certified DIN EN ISO 9001
  24. 24. Pac Tech Worldwide Production Capacity 2004 2005 Q1* Q2* Q3* Q4* Q1* Q2* Q3* Q4* Pac Tech Nauen PacLine 200 A25 40.000 40.000 40.000 40.000 40.000 40.000 40.000 40.000 PacLine 300 A50 ____ ____ ____ ____ 5.000 25.000 75.000 75.000 Japan (Alpha Bumping Technology) PacLine 200 A25 40.000 40.000 40.000 40.000 40.000 40.000 40.000 40.000 PacLine 300 A50 ____ ____ ____ ____ ____ ____ 25.000 75.000 Pac Tech USA PacLine 300 A50 ____ ____ ____ ____ 5.000 25.000 75.000 75.000 Total 80.000 80.000 80.000 80.000 90.000 130.000 255.000 305.000 Total Capacity per Year 320.000 Wafers 780.000 Wafers Certified DIN EN ISO 9001
  25. 25. IV Assembly Certified DIN EN ISO 9001
  26. 26. Low Cost Flip Chip – Attach for Smart Cards / Smart Labels Low Cost Electroless Ni/Au Bump 1.) Leadfree Soldering 2.) Anisotropic Conductive Adhesive Laser Reflow (LaPlace) Laser Polymer Curing (ACA, ACF) 3.) Isotropic Conductive Adhesive 4.) Nonconductive Adhesive Laser Polymer Curing (ICA) Laser Polymer Curing (NCA, NCF) Low Cost Flip Chip.ppt Certified DIN EN ISO 9001
  27. 27. Chip Assembly on RFID- Cards and Labels • Module – Wire bonding - Flip Chip • Bare Die Assembly onto Antenna – Wire bond - Flip Chip Certified DIN EN ISO 9001
  28. 28. Advantage of Flip Chip Technology • Reduction of Card / Label Thickness – by eliminating wire bond loop • Cost Reduction Certified DIN EN ISO 9001
  29. 29. RFID Substrate and antenna material • Limitation on selection of flip chip processes – assembly temperature below TG of substrate material – joining technology compatible with antenna material Certified DIN EN ISO 9001
  30. 30. Challenges of Flip Chip Attach in RFID- Cards and Labels Solutions/advantages of laser soldering/curing • Low cost materials – Substrate materials • PVC,PET, PP,....., Paper • TG below 100 °C • Material Property: flexible – Antenna material • bare Copper (etched, coated wire) • Aluminium • Printed Antenna Certified DIN EN ISO 9001
  31. 31. Flip Chip Bonder - LAPLACE Certified DIN EN ISO 9001
  32. 32. V Applications Certified DIN EN ISO 9001
  33. 33. Applications RFID-Tag Ni/Au on Copper Certified DIN EN ISO 9001
  34. 34. FC with ACF - Smart Label Certified DIN EN ISO 9001
  35. 35. Flip chip on coil for contactless smart cards Certified DIN EN ISO 9001
  36. 36. Chip-Card-IC on Copper-Coil Chip: Mifare, Phillips Coil: Etched Cu-Coil Contact: Ni/Au + Leadfree Solder or NCP, ICP Conductive Adhesive Certified DIN EN ISO 9001
  37. 37. Flip Chip Modules for contactless Smart Cards Substrate handling: reel to reel Assembly: Laplace soldering Flip chip attach Certified DIN EN ISO 9001

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