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Industrial Application note: Copper pillar characterisation, STmicroelectronics worked with PAC-G

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A new solution has been developed thanks to PAC-G to characterise 3D integration systems, which aims to make devices smaller.
STMicroelectronics has worked with a team of researchers from the CEA-Leti and the ESRF - The European Synchrotron, using synchrotron tomographies contrast.
Computed tomography techniques offer good information about the voids present in the pillars and, in the case of synchrotron radiation, also about the intermetallic shapes.

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Industrial Application note: Copper pillar characterisation, STmicroelectronics worked with PAC-G

  1. 1. I N S T I T U T D E R E C H E R C H E T E C H N O L O G I Q U E Platform for Advanced Characterisation – Grenoble (PAC-G) STMicroelectronics
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  3. 3. Experimental conditions for the data acquisition performed on the ID16A nanotomography beamline at ESRF.
  4. 4. Experimental conditions for the data acquisition performed on the ID19 beamline at ESRF.
  5. 5. • • • • • • Link to the article: A. Fraczkiewicz et al. https://www.sciencedirect.com/science/article/pii/S0304399117300621?via%3Dihub Acknowledgement: This work has been supported by the IRT Nanoelec program and the French “Recherche Technologique de Base” (RTB) program. The authors acknowledge access to the nanocharacterization platform (PFNC) at the Minatec Campus in Grenoble. The synchrotron experiments were performed on beamlines ID16A and ID19 at the European Synchrotron Radiation Facility (ESRF), Grenoble, France, in the frame of the long term project ma2240.
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