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PAC-Grenoble: Neutron Imaging to find water inside a sealed package


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The case for neutron imaging
Finding water has long been a key point in the development of our world. This is also true for semiconductors.
Either inside a sealed fully packaged system or after bonding processes, detecting the presence of water is of the essence. New sensor applications are submitting electronic components to a number of different environments and harsh conditions of operation. It is thus crucial to detect moisture and humidity contamination that could jeopardise a chip’s functionality. Constituted of light elements, water is particularly hard to detect using conventional lab techniques especially in a non-invasive and non-destructive way.

Published in: Engineering
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PAC-Grenoble: Neutron Imaging to find water inside a sealed package

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