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The case for non-destructive imaging
New integrated circuit technologies and advanced heterogeneous integration call for innovative non-destructive and non-invasive imaging techniques. Semiconductors are everywhere and it is no longer possible to decapsulate an IC whilst keeping its functionality undamaged. The increasing trend towards More-than-Moore (MtM) approaches and the universalisation of sensor applications have brought the need to see what is going on inside fully encapsulated packaged devices. As fabrication process complexity increases, the possibility to perform in situ/in operando 3D/2D radiographic
investigations of systems as manufactured remains a major challenge for the semiconductor industry.