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SAES Packaging Services for MEMS Devices


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Device packaging is one of the most critical aspects for protecting and ensuring long term stability of MEMS based sensors and actuators. High‐performance classes of devices require robust packaging solutions that enable long term stability under a variety of operating conditions.

SAES® Group is now offering a fully integrated MEMS vacuum packaging service that includes the getter deposition on the lid (PageLid), the hermetic sealing process, as well as the RGA and leak rate tests to verify vacuum levels. The use of state-of-the-art sealing equipment, operating in a class 100 clean room, enables the exclusive capability to deliver high quality standard services at competitive costs.

Read more about our packaging service visiting our website at:

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SAES Packaging Services for MEMS Devices

  1. 1. SAES Packaging service making innovation happen, together
  2. 2. Agenda MEMS Packaging service description Facility and operations Capabilities and future prospective Choose your type of service :  Fast prototyping Process developments Packaging foundry service Add‐on services RGA (Residual Gas Analysis) Outgassing  Leak rate measurements  Conclusions MJM 25/01/2013 2 © SAES Group making innovation happen, together
  3. 3. SAES Packaging Service description MEMS discrete (die‐level) vacuum packaging  Ceramic packaging  Metal packaging Getter integration Getter film deposition and pattering Sealing methods Au/Sn eutectic Glass frit soldering MJM  25/01/2013 3 making innovation happen, together
  4. 4. Facilities and operations Equipment  Independent outgassing/forming gas  system High vacuum sealing furnace  Independent heating systems Rapid thermal annealing Temperature: up to 1100°C Heated plates, up to 450 x 450 mm Fast ramping of plate  • Ramp up at > 3.5°C/second  • Ramp down at > 2°C/second 100 steps per program Ultimate Vacuum: ~ 7 x 10‐7mbar High pressure atmosphere: up to 3 bar (abs) Operations Class 100 clean room  High Throughput Flexible sealing recipes Testing Ultrasonic microscope bonding line  integrity test Leak rate measurements MJM  25/01/2013 4 © SAES Group making innovation happen, together
  5. 5. Capabilities and future prospective Current achievements : Final packaging pressure down to 10‐3 – 10‐4 mbar range with getter  integration Hermeticity level < 10‐16 mbar l /s Fast sealing process Die attach materials selections Future available services : Die attach Wire bonding MJM  25/01/2013 5 © SAES Group making innovation happen, together
  6. 6. Choose your type of service SAES is offering :  Fast prototyping Process developments Packaging foundry service MJM  25/01/2013 6 © SAES Group making innovation happen, together
  7. 7. Fast prototyping Need prototypes quickly? Here are the steps SAES follows: Review packaging drawings and requirements  Develop tools   Perform bonding trials on empty packages  Perform bonding on first prototypes  Complete tests and characterizations In a reasonably short time we can make your first prototypes a  thing of reality Need more fast?  We can do that! We can provide effective and robust solutions  MJM  25/01/2013 7 © SAES Group making innovation happen, together
  8. 8. Process developments Step by step process development Discussion and definition of the project goals Material selections and analysis Getter integration Preliminary packaging experiments Recipe definition and testing Recipe improvements Tests on repeatability CpK definition and key control parameters Process installation Tests and fine tuning MJM  25/01/2013 8 © SAES Group making innovation happen, together
  9. 9. Packaging foundry service High throughput capability  Competitive costs Fast delivery Packaging components provided by customer : Ceramic container with die attached and wire bonded MEMS Au plated Kovar lid Au‐Sn Bonding preform  MJM  25/01/2013 9 © SAES Group making innovation happen, together
  10. 10. Add‐on services SAES also offers: RGA (Residual Gas Analysis) Outgassing tests Leak rate measurements  MJM  25/01/2013 10 © SAES Group making innovation happen, together
  11. 11. RGA MEMS samples with internal volume  down to nano liter range Analysis sensitivity 10‐6 cc mbar Total pressure and gas composition Service capability : Two samples per day Standard lead time 4 weeks Fast lead time : 1 week Without getter With getter Sample 1 Q Factor (measured) Q Factor (calculated) Gas H2 Sample 5 Q Factor (measured) Q Factor (calculated) 3000 3220 Pressure Composition (mbar) 7.92E-01 81.7% Gas 500000 1.40E+07 Pressure Composition (mbar) H2 CH4 8.92E-02 9.2% CH4 3.92E-05 9.8% H2O CO N2 9.70E-04 5.53E-02 1.55E-02 0.1% 5.7% 1.6% H 2O CO N2 2.28E-05 5.7% C2H6 5.82E-03 0.6% C 2H 6 1.52E-05 3.8% C3H8 7.76E-03 0.8% C 3H 8 3.36E-05 8.4% CO2 Noble gases (He,Ar,etc...) Total 1.94E-03 0.2% CO2 Noble gases (He,Ar,etc...) Total 2.89E-04 72.3% 4.00E-04 100.0% Mean Viscosity (10-5 Pa s) 1.911 Mean Viscosity (10-5 Pa s) MJM  25/01/2013 11 © SAES Group 7.76E-04 0.1% 9.70E-01 100.0% 0.984 making innovation happen, together
  12. 12. Outgassing tests Material studies on outgassing properties Material vacuum compatibility assessments Material selections  Material comparisons Service capability : Max sample size of 1” Max temperature treatment is 800°C Methods : 450 Static outgassing Dynamic outgassing 330 °C x 12 min 300 250 200 °C x 60 min 200 150 100 is very useful to make measurements on plastics, foams and other materials which show a high amount of gas evolved and mainly outgas water vapor 12 Bonding: 370 °C x 5 min 350 Temperature (°C) to measure the outgassing rate from metals, glasses, ceramics, and other materials which release a relatively low amount of gas MJM  25/01/2013 400 °C x 60 min 400 © SAES Group 50 0 0 20 40 60 80 100 120 140 160 180 Time (min) making innovation happen, together
  13. 13. Leak rate measurements The detection and measurement of very small leaks is a  key factor for the assessment of device lifetime Air leak rate Ultra fine Super fine Extra fine Fine Moderate Gross The method is able to : establish whether the device is affected by a leak or not  quantitatively measure the leak rate Pa·m 3/s 1.0E-14 1.0E-11 1.0E-09 1.0E-07 1.0E-05 1.0E-05 mbar·l/s < 1.0E-13 < 1.0E-10 < 1.0E-08 < 1.0E-06 < 1.0E-04 > 1.0E-04 Torr·l/s 7.5E-14 7.5E-11 7.5E-09 7.5E-07 7.5E-05 7.5E-05 Service capabilities :  Sensitivity : the minimum detectable air leak  rate is about 1x10‐16 mbar l/s. Whenever the  leak rate is close to the system sensitivity an  upper limit will be provided Standard lead time: 4 weeks  Fast service lead time : 2 weeks Example Tests performed on inertial sensors  The producer observed Q‐factor degradation with time for some devices MJM  25/01/2013 13 © SAES Group Device Initial presure Target pressure Volume PaGe® surface Accelerometer 0.01 mbar 0.1 mbar 0.1 mm3 2 mm2 Internal surface outgassing is neglected No getter Measured air leak rate (mbar·l/s) < 3.0E-16 6.6E-16 2.0E-14 7.5E-14 With getter Time to exceed 10 x target pressure 10 y 4.8 y 57 days 15 days >30 y >30 y 15 y 4.2 y making innovation happen, together
  14. 14. Conclusions Competitive advantages of SAES’ MEMS die packaging service High vacuum encapsulation Getter integration for long term stability Flexibility Fast response Competitive costs Engineering capabilities  MJM  25/01/2013 14 © SAES Group making innovation happen, together
  15. 15. Thanks for your attention w w w. s a e s g e t t e r s . c o m