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3D Packaging and TSV Technologies -- Market Research Database

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MEMS Journal has conducted the largest industry survey on emerging opportunities and challenges for 3D packaging and TSV technologies.

This survey includes most of the players in the semiconductor ecosystem including, but not limited to, MEMS and sensor technology companies.

During the course of this study, we’ve reached out to 3,500+ individuals and have received more than 570 responses.

Each respondent has provided us with approximately one page of feedback on their existing 3D packaging and TSV projects, as well as their specific current challenges.

We are now making the results of this survey available as a market research and intelligence database.

This information will be useful for companies which are developing strategic plans and roadmaps for their next generation products and services. The database will also be useful for sales and business development people as a source of new leads.

This market research database provides the following benefits:

market research and intelligence data around the topic of advanced packaging including 3D packaging, TSV, and WLP technologies

more than 570 pages of direct feedback from the key industry participants who have outlined their needs and priorities as related to core product and service offerings

new business leads for your sales and business development team; the database includes contact information for all of the survey participants it is easy to get in touch with them directly to discuss business and partnership opportunities.

vital competitive and market intelligence for your strategy development and roadmap efforts; we’ve spent 24+ months to conduct this survey and you will get all of the results to instantly obtain an advantage in the marketplace

For more information about MEMS Journal, please go to http://www.memsjournal.com

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3D Packaging and TSV Technologies -- Market Research Database

  1. 1. www.memsjournal.com | mr@memsjournal.com | Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. MARKET RESEARCH DATABASE 3D Packaging and TSV Technologies Overview and Database Features July 2016
  2. 2. 2 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Confidentiality and Disclaimer Notice The content of this document is for information purposes only and is not intended to provide tax, legal or investment advice. You should not fully rely on any material contained in this document and should seek independent advice wherever necessary. Any decisions you make based upon any information contained in this document are your sole responsibility. The information does not constitute a solicitation of any order to buy or sell any securities. For further questions, please contact us at info@memsjournal.com.
  3. 3. 3 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Background MEMS Journal has conducted the largest industry survey on emerging opportunities and challenges for 3D packaging and TSV technologies. This survey includes most of the players in the semiconductor ecosystem including, but not limited to, MEMS and sensor technology companies. During the course of this study, we’ve reached out to 3,500+ individuals and have received more than 570 responses. Each respondent has provided us with approximately one page of feedback on their existing 3D packaging and TSV projects, as well as their specific current challenges. We are now making the results of this survey available as a market research and intelligence database. This information will be useful for companies which are developing strategic plans and roadmaps for their next generation products and services. The database will also be useful for sales and business development people as a source of new leads.
  4. 4. 4 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Background This market research database provides the following benefits: • market research and intelligence data around the topic of advanced packaging including 3D packaging, TSV, and WLP technologies • more than 570 pages of direct feedback from the key industry participants who have outlined their needs and priorities as related to core product and service offerings • new business leads for your sales and business development team; the database includes contact information for all of the survey participants it is easy to get in touch with them directly to discuss business and partnership opportunities. • vital competitive and market intelligence for your strategy development and roadmap efforts; we’ve spent 24+ months to conduct this survey and you will get all of the results to instantly obtain an advantage in the marketplace
  5. 5. 5 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Background Each individual included in this database has addressed the following questions: • What does your company do and how does it relate to 3D packaging and TSVs? • What types of companies are your main customers? Which companies are your main suppliers? • What is your personal involvement (vs. your company or organization in general) with 3D packaging technologies and/or processes? What about with TSV processes and/or technologies? • For your ongoing 3D packaging and/or TSV projects, what are the main challenges (business and/or technical) that you are encountering? What’s causing most of your challenges and why? • Are you personally a buyer or a seller of 3D packaging or TSV technologies or services? Which specific 3D packaging technologies or services do you primarily buy or sell?
  6. 6. 6 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Database features Database includes such details as: • First and last name • Email address • Phone number • Job title • Company/organization name • Details about companies’ and individuals’ 3D packaging and TSV project needs and requirements Database features: • Number of responses/contacts: 570 • Format: Excel spreadsheet • Feedback from companies such as Apple, Intel, IBM, Samsung, TSMC, Microsoft, Dow, Broadcom, TI • Rate per response/contact (w/email and phone): $5.25 Enterprise license: $2,995
  7. 7. 7 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Database sample screenshot #1
  8. 8. 8 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Database sample screenshot #2
  9. 9. 9 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Database sample screenshot #3
  10. 10. 10 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Database features Database includes such details as: • First and last name • Email address • Phone number • Job title • Company/organization name • Details about companies’ and individuals’ 3D packaging and TSV project needs and requirements Database features: • Number of responses/contacts: 570 • Format: Excel spreadsheet • Feedback from companies such as Apple, Intel, IBM, Samsung, TSMC, Microsoft, Dow, Broadcom, TI • Rate per response/contact (w/email and phone): $5.25 Enterprise license: $2,995
  11. 11. 11 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Get ahead of the competition -- get the database! Click here to order the enterprise license of this market research database. For further questions, please contact us at info@memsjournal.com.
  12. 12. 1212 Microfluidics Market Research Database | Market Research Report | mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com About Us For more information, please email us at info@memsjournal.com
  13. 13. 13 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com About MEMS Journal, Inc. • MEMS Journal was founded in 2003 • 35 full-time and part-time staff, headquartered in Southfield, Michigan • Largest MEMS publication worldwide, with 34,800+ subscribers, growing quickly • Published over 9,800 stories, interviews, and articles and have reviewed more than 26,000 patents and patent applications • Main focus is on MEMS and sensors technologies • Services include: – Strategic planning (focus and positioning, marketplace perception, competitive analysis, roadmap development) – Market research and intelligence (technology scouting and assessment, system and component teardowns, patent/IP analysis) – Event organization and management (organize 4-5 events and sponsor 20-25 events per year) – Marketing and advertising (brand building, lead generation) – Content development (whitepapers, presentations, reports)
  14. 14. 14 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Market intelligence services For questions or more information, please email us at info@memsjournal.com.
  15. 15. 15 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Market intelligence services For questions or more information, please email us at info@memsjournal.com.
  16. 16. 16 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Some of our other market research reports
  17. 17. 17 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Some of our recent conferences and workshops
  18. 18. 18 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Contact us MEMS Journal, Inc. 2000 Town Center, Suite 1900 Southfield, Michigan 48075 info@memsjournal.com 248.792.9618 (office phone) http://www.memsjournal.com
  19. 19. 19 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Database features Database includes such details as: • First and last name • Email address • Phone number • Job title • Company/organization name • Details about companies’ and individuals’ 3D packaging and TSV project needs and requirements Database features: • Number of responses/contacts: 570 • Format: Excel spreadsheet • Feedback from companies such as Apple, Intel, IBM, Samsung, TSMC, Microsoft, Dow, Broadcom, TI • Rate per response/contact (w/email and phone): $5.25 Enterprise license: $2,995
  20. 20. 20 3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com Get ahead of the competition -- get the database! Click here to order the enterprise license of this market research database. For further questions, please contact us at info@memsjournal.com.

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