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MEMS Journal has conducted the largest industry survey on emerging opportunities and challenges for 3D packaging and TSV technologies.
This survey includes most of the players in the semiconductor ecosystem including, but not limited to, MEMS and sensor technology companies.
During the course of this study, we’ve reached out to 3,500+ individuals and have received more than 570 responses.
Each respondent has provided us with approximately one page of feedback on their existing 3D packaging and TSV projects, as well as their specific current challenges.
We are now making the results of this survey available as a market research and intelligence database.
This information will be useful for companies which are developing strategic plans and roadmaps for their next generation products and services. The database will also be useful for sales and business development people as a source of new leads.
This market research database provides the following benefits:
market research and intelligence data around the topic of advanced packaging including 3D packaging, TSV, and WLP technologies
more than 570 pages of direct feedback from the key industry participants who have outlined their needs and priorities as related to core product and service offerings
new business leads for your sales and business development team; the database includes contact information for all of the survey participants it is easy to get in touch with them directly to discuss business and partnership opportunities.
vital competitive and market intelligence for your strategy development and roadmap efforts; we’ve spent 24+ months to conduct this survey and you will get all of the results to instantly obtain an advantage in the marketplace
For more information about MEMS Journal, please go to http://www.memsjournal.com