3dchips

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Creative vision for creating and fabricating 3D chips

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3dchips

  1. 1. GOING 3-D: SAME EQUIPMENT, DIFFERENT STEPS HOW 2-D CHIPS ARE MADE 1 2 3 4 5 Patterns of ultraviolet Exposed photoresist Ions are showered onto The wafer is coated Chemical-mechanical light are focused onto is removed, and the wafer, doping areas with insulating polishing flattens the a silicon wafer coated unprotected areas are of exposed silicon to dielectric or wafer’s surface with with photoresist etched away by gases make transistors conducting metal 50-nanometer precision PROCESS IS REPEATED FOUR OR MORE TIMES TO ADD METAL INTERCONNECTIONS AND INSULATING OXIDES HOW 3-D CHIPS ARE MADE Additional steps using the same equipment and materials create 3-D microcircuits with many polysilicon transistors stacked vertically 1 2 RETICLE (MASK) LENS Photolithography Photoresist and etching proceed Silicon just as for 2-D chips, dioxide above Silicon nitride Silicon substrate 3 PREPARED SILICON WAFER Ion implantation dopes the silicon to create transistors 4 5 6 7 8 Three new layers are Photolithography is Memory cells and Chemical-mechanical A layer of “antifuse” added: polysilicon, repeated to create metal interconnections polishing knocks down material is added; burning tungsten metal and active regions of are etched; insulation any high spots out an antifuse will store then more polysilicon polysilicon is added a bit in the memory PROCESS IS REPEATED NINE TIMES TO STACK EIGHT MEMORY CELLS ON TOP OF ONE ANOTHER

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