Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.
Textmasterformat bearbeiten ▪ Second Level ▪ Third Level ▪ Fourth Level Fifth Level September 6, 2017 A25 – High-Performan...
2 Multicore VMEbus Board based on Intel Xeon D ▪ Up to 32 DDR4 DRAM memory ▪ Intel Xeon D CPU with 4, 8, and 16 cores ▪ 7 ...
3 Flexible Open-Source Solution ▪ VMEbus interface FPGA-based ▪ Future-proof and cost-effective functionality extension ▪ ...
4 Flexible and Future-Proof for High-End Applications ▪ Reliable Solution in High- Performance Embedded Applications ▪ Ind...
A25 – High-Performance VMEbus SBC with Intel Xeon D
Upcoming SlideShare
Loading in …5
×

A25 – High-Performance VMEbus SBC with Intel Xeon D

126 views

Published on

The A25 is a powerful multicore VMEbus board, based on Intel's Xeon D-1500 server CPU. The board is available in versions with 4, 8 or 16 cores and therefore provides a concentrated computing power. The 32 GB DDR4 memory and the scalability of the offered standard models make the board a reliable partner for high-performance applications.

Published in: Technology
no profile picture user

  • Be the first to comment

  • Be the first to like this

A25 – High-Performance VMEbus SBC with Intel Xeon D

  1. 1. Textmasterformat bearbeiten ▪ Second Level ▪ Third Level ▪ Fourth Level Fifth Level September 6, 2017 A25 – High-Performance VMEbus SBC with Intel Xeon D
  2. 2. 2 Multicore VMEbus Board based on Intel Xeon D ▪ Up to 32 DDR4 DRAM memory ▪ Intel Xeon D CPU with 4, 8, and 16 cores ▪ 7 years CPU long-term availability ▪ Trusted Platform Module (TPM) ▪ VMEbus interface implemented as FPGA ▪ Versatile front I/O and interface options
  3. 3. 3 Flexible Open-Source Solution ▪ VMEbus interface FPGA-based ▪ Future-proof and cost-effective functionality extension ▪ Versatile front I/O ▪ Two USB ▪ Three Gigabit Ethernet ▪ Two RS232 ports at the front ▪ Expandable with an XMC/PMC mezzanine card and a PCI Express Mini Card ▪ Additional front I/O for e.g. graphics, mass storage, further Ethernet
  4. 4. 4 Flexible and Future-Proof for High-End Applications ▪ Reliable Solution in High- Performance Embedded Applications ▪ Industrial Automation ▪ Energy Segment ▪ Long product life-time due to robust design ▪ -40° C to +60° C ▪ Prepared for coating ▪ Soldered components ▪ Long-term availability of CPU ▪ Future-proof use of open FPGA interface ▪ Proven reliability in CERN LHC

×