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New Jersey Micro-Electronic Testing
Metropolitan Labs
Tokyo, Japan Los Angeles, CA Denver, CO Clifton, NJ Toronto, Canada ...
New Jersey Micro-Electronic Testing
Memberships and Certifications
NJMET Inc. is a worldwide recognized AS9100 /
ISO9001:2008 certified test laboratory, accommodating a
variety of specifica...
Our leading edge, standards compliant electronic
testing capabilities have accommodated the prime
contractors of the Unite...
 NJMET A9100:2004 Certification
 NJMET ISO9001:2008 Certification
 DLA Defense Logistics Agency (QTSL) Qualified Testin...
 Commercial, Industrial, Military, Aerospace,
Space Screening & Qualification
Accommodating:MlL-STD-883, MlL-STD-750,
MlL...
 Discrete Semiconductors (Transistors,
Diodes, FET’s, SCR’s)
 Linear / Analog
 Digital-IC’s
 Memory-(Ic’s) (Asics / Mi...
 Stabilization Bake
 Humidity Conditioning
 Temperature Cycling (Shock)
 Moisture Resistance
 Salt Atmosphere
 Burn-...
 Constant Acceleration (Centrifuge)
 PIND (Particle Impact Noise Detection)
 Internal Visual Analysis
 Solderability
...
Memory-Programming/Marking
 Marking / Labeling / Erase / Bar
Coding
 Proms
 Eproms, EEProms
 PAL’s, GAL’s, PLD’s, FPGA...
R/F Microwave Testing
Lead Forming
Trimming / Straightening
Bake & Dry Pack
RoHS Compliance Testing
RoHS Compliance Laboratory Services
 Lead (Pb) content
 Mercury (Hg) content
 Cadmium (Dc) cont...
 Material Analysis
 Wafer / Die Acquisition and Preparation
 Pre-cap Visual Inspection
 Component Electrical Screening...
Solderability / Tinning
& Inspection
• Part Numbers • Color Coding
Component Marking and
Marking Permanency
Component
Marking Test
Taping and Reeling
Counterfeit / Risk Mitigation
Testing
SAE AS 6081 Test / Inspection
Minimum Required Tests
Documentation and Packaging (non-destructive)
External Visual Inspect...
SAE AS 6081 Test / Inspection (Continued)
Additional Tests (as agreed between Customer and Organization)
Remarking & Resur...
Incoming Inspection
Counterfeit Component
Visual Inspection
The inspection begins with checking the boxes for any
shipping damages or evidence of a counterfeit or suspect
bar code la...
Suspect Packaging
Suspect Discovery
Suspect Marking
Inspection Discovery
Evidence of Altered/Sanded Marking
Inspection Discovery
Suspect Philips Product
Inspection Discovery
Suspect Cypress Device
Inspection Discovery
Suspect Philips Device
Inspection Discovery
Physical Dimensions
Discovery
Original Configuration
88 Pins
Inspection Uncovered
68 Pins
Suspect Marking
PREPARATION OF PROPER
RESISTANCE TO SOLVENTS
MARKING PERMANENCY APPLICATION
883 Method 2015, 750 Method 1022, 202 Method 2...
Counterfeit Unit Showing
Non Uniform Black Coat Layer
Black Top Marking Test
Over the past few years new techniques of bla...
To perform this test mix a solution of 3 parts mineral spirits
with 1 part alcohol. Dip a cotton swab into the solution an...
First technique requires Acetone be applied to the cotton swab and
lightly rubbed across the surface. If the swab turns bl...
When using 1-Methyl 2-Pyrrolidinone, suspend the part so that half
of it is in the solution and heat it to 115 120C for 2 ...
For Dynasolve 711/750, the process is similar to the 1-Methyl 2-
Pyrrolidinone test but it used a lower temperature (105C)...
X-Ray / Radiographic
Inspection
The industry standard used regarding testing the component devices full
functional and parametric requirements at the reco...
In recent years many counterfeit/cloned devices were discovered to work
electrically. The question to a mislead industry t...
Industry Temperatures Test Objectives
Commercial 0°C - 70°C DC, AC Functional and Parametric Testing
Industrial -40°C - +8...
Functional and Parametric Testing
Using (ATE) Automatic Test Equipment with a (PTFS)
Precision Temperature Forcing System
Functional and Parametric Testing
Using Test Instrumentation with Liquid Nitrogen
Internal Visual Analysis
• Topography Verification
• Part Number Verification (If Available)
• Data Code Verification (If ...
A four point inspection of the device die,
leads, bond wire and packaging are
performed to verify material authenticity.
T...
This analysis uses a focused beam of high-
energy electrons to generate a variety of
signals at the surface of the specime...
Spectroscopy is an analytical technique used for
the elemental analysis or chemical
characterization and verification to s...
Original OEM Devices vs. Cloned Devices
Spectra
Original Clone
Composition Balance Composition Imbalance
Fourier Transform Infrared Spectroscopy
is used mostly for identifying chemicals that
are either organic or inorganic and ...
X-Ray Fluorescence Energy Dispersive is
performed to characterize individual particles
to verify it meets manufacturing cr...
Original OEM Devices vs. Cloned
Devices
Original
Cloned
Acoustic Microscopy is a screening technique used to uncover
anomalies in the device package and construction.
CSAM:
CSAM view of the device where severe
internal de-lamination or pop-corning
over the entire die surface was observed.
This ...
Temperature Cycling
Electronic Burn In
Fine Leak Testing
Gross Leak Testing
 Complete Assembly Procurement
 Parts Purchasing
 Receiving Material Inspection
 Labeling / Marking / Bar Coding
 Log...
Certifying the Quality of Your Product
NJMET Inc. Test Team
An Introduction to New Jersey Micro Electronic Testing
An Introduction to New Jersey Micro Electronic Testing
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An Introduction to New Jersey Micro Electronic Testing

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This presentation gives an introduction to the electronic testing services provided by NJ Micro Electronic Testing, Inc. The presentation includes a video tour of NJMET's Clifton, NJ headquarters and laboratory.

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An Introduction to New Jersey Micro Electronic Testing

  1. 1. New Jersey Micro-Electronic Testing Metropolitan Labs Tokyo, Japan Los Angeles, CA Denver, CO Clifton, NJ Toronto, Canada London, England Tel Aviv, Israel Presenting the One Source for Electronic Component Procurement, Testing, Upscreening, and Counterfeit Detection AS9100 / ISO9001 Registered
  2. 2. New Jersey Micro-Electronic Testing Memberships and Certifications
  3. 3. NJMET Inc. is a worldwide recognized AS9100 / ISO9001:2008 certified test laboratory, accommodating a variety of specifications tailored to our clientele. We are DLA Defense Logistics Agency (QTSL) Qualified Testing Suppliers List Certified FSCs 5961 (Semiconductors)/5962 (Microcircuits) Our headquarters is located in Clifton, NJ with sales offices in Los Angeles, Denver, London, Tokyo, Toronto and Tel Aviv. For over 36 years, NJMET Inc. has been a pioneer to the Commercial, Military, Aerospace, Industrial, Automotive and Space fields providing worldwide quality electronic component / product testing.
  4. 4. Our leading edge, standards compliant electronic testing capabilities have accommodated the prime contractors of the United States Department of Defense, the aerospace and industrial industries as well as the FAA, the FCC, the European Community Council and the Israeli Aerospace and Defense Industries. Moreover, NJMET provides quality testing, re-certification, upscreening, qualification, and contract manufacturing of electronic component products (custom/obsolete) including component solutions for discontinued devices.
  5. 5.  NJMET A9100:2004 Certification  NJMET ISO9001:2008 Certification  DLA Defense Logistics Agency (QTSL) Qualified Testing Suppliers List Certified FSCs 5961 (Semiconductors)/5962 (Microcircuits)  ANSI ESD S20.20-2007 Certification  AS5553 Certification from SAE International  ISO 17025 Applicant  ITAR Registration No: M18392  ERAI: Electronic Resellers Association International Registered Membership  CCAW Counterfeit Avoidance Workshop Training  IDEA/EPTAC Counterfeit Components Training Program Certifications
  6. 6.  Commercial, Industrial, Military, Aerospace, Space Screening & Qualification Accommodating:MlL-STD-883, MlL-STD-750, MlL-PRF-38534. MlL-PRF-38535. MlL-STD-202. ANSI/J MlL-STD-1580. ASTM, JEDEC STD, and Many Others Electronic Component Screening, Selection & Qualification
  7. 7.  Discrete Semiconductors (Transistors, Diodes, FET’s, SCR’s)  Linear / Analog  Digital-IC’s  Memory-(Ic’s) (Asics / Microprocessors)  Resistors / Capacitors / Inductors  Switches/Connectors  Cables  Relays (Mechanical and Solid State)  Printed Circuit Boards  Optical Devices  Hybrid Devices Electronic Testing (Screening / Qualification)
  8. 8.  Stabilization Bake  Humidity Conditioning  Temperature Cycling (Shock)  Moisture Resistance  Salt Atmosphere  Burn-In (Static Dynamic) and Life Test  High Temperature Reverse Bias  HAST/Highly Accelerated Stress Testing Environmental Testing (Screening / Qualification)
  9. 9.  Constant Acceleration (Centrifuge)  PIND (Particle Impact Noise Detection)  Internal Visual Analysis  Solderability  Hermeticity Seal, Fine & Gross Leak  Physical (Mechanical) Dimensions  Internal Water Vapor Content  RGA: Residual Gas Analysis  External Examinations  Die Shear  Compression Molding (Micro-sectioning)  Lead Fatigue Test/Terminal Strength  SEM (Scanning Electron Microscope)  Mechanical Shock/Vibration Reliability Testing (Screening / Qualification)
  10. 10. Memory-Programming/Marking  Marking / Labeling / Erase / Bar Coding  Proms  Eproms, EEProms  PAL’s, GAL’s, PLD’s, FPGA’s  Micro-Computers  Flash Memories  Micro-Controllers & Peripherals
  11. 11. R/F Microwave Testing
  12. 12. Lead Forming Trimming / Straightening
  13. 13. Bake & Dry Pack
  14. 14. RoHS Compliance Testing RoHS Compliance Laboratory Services  Lead (Pb) content  Mercury (Hg) content  Cadmium (Dc) content  Hexavlent chromium, Cr 6+, Cr (V1)  Polybrominated biphenyls, PBBs  Polybrominated diphenyl ethers, PBDEs
  15. 15.  Material Analysis  Wafer / Die Acquisition and Preparation  Pre-cap Visual Inspection  Component Electrical Screening and Characterization  Component Marking  Die Duplication and Reproduction Component Assembly And Packaging
  16. 16. Solderability / Tinning & Inspection
  17. 17. • Part Numbers • Color Coding Component Marking and Marking Permanency
  18. 18. Component Marking Test
  19. 19. Taping and Reeling
  20. 20. Counterfeit / Risk Mitigation Testing
  21. 21. SAE AS 6081 Test / Inspection Minimum Required Tests Documentation and Packaging (non-destructive) External Visual Inspection a. General (non-destructive) b. Detailed (non-destructive) Remarking & Resurfacing (destructive) Solvent Test for Remarking (destructive) Solvent Test for Resurfacing (destructive) Radiological (X-Ray) Inspection X-Ray Inspection (non-destructive) Lead Finish Evaluation (XRF or EDS/EDX) XRF (non-destructive) or EDS/EDX (destructive) Delid / Decapsulation Internal Analysis (destructive) Delid / Decapsulation (destructive)
  22. 22. SAE AS 6081 Test / Inspection (Continued) Additional Tests (as agreed between Customer and Organization) Remarking & Resurfacing (destructive) Scanning Electron Microscope (destructive) Quantitative Surface Analysis (non-destructive) Thermal Testing Thermal Cycling Test Electrical Testing Electrical Testing Burn-in Burn-In (Pre & Post) Hermeticity Verification (Fine and Gross Leak) Hermeticity Verification (Fine and Gross Leak) Scanning Acoustic Microscopy (SAM) Scanning Acoustic Microscopy (SAM) Other Other test/inspections
  23. 23. Incoming Inspection Counterfeit Component Visual Inspection
  24. 24. The inspection begins with checking the boxes for any shipping damages or evidence of a counterfeit or suspect bar code label and then continues on to the component level upon the opening of the packages. An in-depth, near 100 point inspection process via a detailed checklist of suspect error types and optical microscopy (digital imaging) is performed to verify the component Part Number, Marking, Lead Straightness, Color, or any anomaly related to the integrity of the devices, such as cracks, dents, scratches, mechanical anomalies, spelling errors, suspect date codes, suspect manufacturers logos, breaks, or corrosions.. Incoming Inspection:
  25. 25. Suspect Packaging Suspect Discovery
  26. 26. Suspect Marking Inspection Discovery
  27. 27. Evidence of Altered/Sanded Marking Inspection Discovery
  28. 28. Suspect Philips Product Inspection Discovery
  29. 29. Suspect Cypress Device Inspection Discovery
  30. 30. Suspect Philips Device Inspection Discovery
  31. 31. Physical Dimensions Discovery Original Configuration 88 Pins Inspection Uncovered 68 Pins
  32. 32. Suspect Marking
  33. 33. PREPARATION OF PROPER RESISTANCE TO SOLVENTS MARKING PERMANENCY APPLICATION 883 Method 2015, 750 Method 1022, 202 Method 215
  34. 34. Counterfeit Unit Showing Non Uniform Black Coat Layer Black Top Marking Test Over the past few years new techniques of black top marking tests have been implemented to discover non authentic marking and coating processes on plastic devices.
  35. 35. To perform this test mix a solution of 3 parts mineral spirits with 1 part alcohol. Dip a cotton swab into the solution and wipe the swab across the part makings. The markings should not smear or be removed. If they are removed or smeared this is a failure. SAVE THE SWABS USED TO PERFORM THE TEST and include with the parts when returned to the report writer. Report Writer: After the conclusion of this test place all three devices under the camera and along with the cotton swab next to the devices and take an optical photo, showing the results label this photo RTS). This photo should clearly show that the top coating did or did not come off the device. This photo must be placed in the analysis photo folder in the database. Test 1 ( Mineral Spirits)
  36. 36. First technique requires Acetone be applied to the cotton swab and lightly rubbed across the surface. If the swab turns black, please stop and inform a report writer. SAVE THE SWABS USED TO PERFORM THE TEST and include with the parts when returned to the report writer. Second technique requires the Acetone be applied to the swab and aggressively rubbed on the surface. The swab may be wetted several times and pressure applied to the same location multiple times before any effect is seen. SAVE THE SWABS USED TO PERFORM THE TEST and include with the parts when returned to the report writer. Report Writer: After the conclusion of this test place all three devices under the camera and along with the cotton swab next to the devices and take an optical photo, showing the results (label this photo RTS 2). This photo should clearly show that the top-coating did not come off the device. This photo must be placed in the analysis photo folder in the database. Test 2 ( Acetone Test)
  37. 37. When using 1-Methyl 2-Pyrrolidinone, suspend the part so that half of it is in the solution and heat it to 115 120C for 2 to 5 minutes) the time and temperature may be adjusted to compensated for your sample). Once the part is removed from the solution, use a cotton swab to attempt to wipe the top coating off (avoid markings if possible). The removed coating will show on the cotton swab as black in color. SAVE THE SWABS USED TO PERFORM THE TEST and include with the parts when returned to the report writer. Report Writer: After the conclusion of this test, place all three devices under the camera and along with the cotton swab next to the devices ad take an optical photo, showing the RTS results (label this photo RTS 3). This photo should clearly show that the top coating did or did not come off the device. This photo must be placed in the analysis photo folder into the database. Test 3 ( 1-Methyl 2-Pyrrolidinone Test)
  38. 38. For Dynasolve 711/750, the process is similar to the 1-Methyl 2- Pyrrolidinone test but it used a lower temperature (105C) and the time increased to approximately 45 minutes. Suspend the part so that half of it is in the solution and heat it up to 105C for 45 minutes. Once the part is removed from the solution, use a cotton swab to attempt to wipe the top coating off (avoid markings if possible). The removed coating will show on the cotton swab as black in color. SAVE THE SWABS USED TO PERFORM THE TEST and include with the parts when returned to the report writer. Report Writer: After the conclusion of this test, place all three devices under the camera and along with the cotton swab next to the devices and take an optical photo, showing the RTS results (label this photo RTS 4). This photo should clearly show that the top coating did or did not come off the device. This photo must be placed in the analysis photo folder in the database. Test 4 ( Dynasolve 711/750)
  39. 39. X-Ray / Radiographic Inspection
  40. 40. The industry standard used regarding testing the component devices full functional and parametric requirements at the recommended manufacturers or specific industry extreme operating temperatures. Electrical Testing Over Temperature
  41. 41. In recent years many counterfeit/cloned devices were discovered to work electrically. The question to a mislead industry then becomes just how long will these devices work? Once again engineering consultation will refer to other methodologies in these processes to uncover the counterfeits or working cloned devices. Electrical Testing
  42. 42. Industry Temperatures Test Objectives Commercial 0°C - 70°C DC, AC Functional and Parametric Testing Industrial -40°C - +85°C DC, AC Functional and Parametric Testing Automotive -45°C - +110°C DC, AC Functional and Parametric Testing Military / Aerospace -55°C - +125°C Subgroups 1, 2, 3, 4, 5, 6, 7, 8A, 8B. 9, 10, 11 Space -65°C - +150°C Subgroups 1, 2, 3, 4, 5, 6, 7, 8A, 8B. 9, 10, 11 The test objectives are to exercise the DC and AC Functional and Parametric requirements as indicated on the industry specifications. In cases of military, aerospace and space design, the respective subgroups contained in those documents would suffice for the objective tests. Electrical Testing Over Temperature
  43. 43. Functional and Parametric Testing Using (ATE) Automatic Test Equipment with a (PTFS) Precision Temperature Forcing System
  44. 44. Functional and Parametric Testing Using Test Instrumentation with Liquid Nitrogen
  45. 45. Internal Visual Analysis • Topography Verification • Part Number Verification (If Available) • Data Code Verification (If Available) • Manufacturer’ s Logo (If Available)
  46. 46. A four point inspection of the device die, leads, bond wire and packaging are performed to verify material authenticity. The following materials tests are performed separately or together based on suspect matter in or order to determine material authenticity Material Analysis:
  47. 47. This analysis uses a focused beam of high- energy electrons to generate a variety of signals at the surface of the specimens. SEM: Scan Electron Microscopy:
  48. 48. Spectroscopy is an analytical technique used for the elemental analysis or chemical characterization and verification to see if the elements are verified in accordance with the manufacturer’s requirements. EDXA: Energy Dispersive X-Ray
  49. 49. Original OEM Devices vs. Cloned Devices Spectra Original Clone Composition Balance Composition Imbalance
  50. 50. Fourier Transform Infrared Spectroscopy is used mostly for identifying chemicals that are either organic or inorganic and is useful in identifying polymer, coatings, and contaminants which are useful in identifying counterfeit electronic products. FTIR:
  51. 51. X-Ray Fluorescence Energy Dispersive is performed to characterize individual particles to verify it meets manufacturing criteria both quantitatively and qualitatively. XRF:
  52. 52. Original OEM Devices vs. Cloned Devices Original Cloned
  53. 53. Acoustic Microscopy is a screening technique used to uncover anomalies in the device package and construction. CSAM:
  54. 54. CSAM view of the device where severe internal de-lamination or pop-corning over the entire die surface was observed. This was previously visible optically where a bubble in the molding compound over the die was observed.
  55. 55. Temperature Cycling
  56. 56. Electronic Burn In
  57. 57. Fine Leak Testing
  58. 58. Gross Leak Testing
  59. 59.  Complete Assembly Procurement  Parts Purchasing  Receiving Material Inspection  Labeling / Marking / Bar Coding  Logistics Testing  Inventory Stocking/Management  Material Management of Production Builds Kitting
  60. 60. Certifying the Quality of Your Product NJMET Inc. Test Team

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