Diane Bryant S. VP & GM of Intel’s Datacenter & Connected Systems Group discusses “Architecting for Hyper-Scale Datacenter Efficiency.” She reviews the newly announced Intel Atom Processor C2000 now in production, 1st “Silvermont” based SoC (System on a Chip), and the more than 50 new systems designs enabled – Microserver, Cold Storage, plus Entry Networking solutions. Diane also outlines the new Rack Scale Architecture Technologies enabled by next generation interconnect technologies using Intel silicon photonics.

2. Architecting for Hyper-scale
Datacenter Efficiency
Diane Bryant
Senior Vice President & General Manager
Datacenter & Connected Systems Group

3. Today’s News
Intel® Atom™ Processor C2000 now in production
1st “Silvermont” based SoC
>50 new systems designs enabled
Microserver, Cold Storage and Entry Networking
New Rack Scale Architecture technologies unveiled
Next generation interconnect technologies using Intel® silicon photonics

4. Cloud Service Provider Environment
Drives Need for Dynamic, Efficient, Workload Optimized Infrastructure
159 new services &
features in 20122
>175% YoY
user growth3
1. http://blog.instagram.com/post/8758396471/testing-testing; http://www.digitalbuzzblog.com/infographic-instagram-stats/
2. Amazon year end results press release Jan 2013
3. http://www.tencent.com/en-us/content/at/2013/attachments/20130814.pdf August 2013
100M  >1B photos
uploaded in <1 year1
*Other brands and names are the property of their respective owners
Manage Workload
Diversity
Ramp New
Services
Support Dramatic
Growth

5. Software Defined Infrastructure
Application-driven allocation of resources for greater efficiency
Datacenter
Orchestration
Workload
Optimized
Solutions
System
Attributes Power Performance ThermalsSecurity Utilization
NETWORK STORAGE SERVER
Cloud
Services

6. I/O Intensive
ComputeIntensive
Cold Storage
Workload Optimized Solutions
E- Commerce
Dedicated
Hosting
Enterprise
Resource
Planning
Dynamic Modeling
and Simulation
Big DataContent Delivery
and Gaming
Graphics Rendering
Entry
Networking
Edge Routing
Storage
De-dupe
Cloud RAN
Static WebMemory
Caching
Dedicated
Hosting Cold Storage
Entry
Networking
Static WebMemory
Caching
Collaboration
Tools
Workload Optimized Solutions
Lightweight workloads require right-sized processing & low power

7. Architecting for Hyper-scale Efficiency
Software Defined, Workload Optimized Infrastructure
PROCESSOR SYSTEM RACK
End to End Innovation

8. Low Power Product Direction
2011
All products, computer systems, dates, and figures specified are preliminary based on
current expectations, and are subject to change without notice.
2012 2013 2014+
Xeon E3
Sandy Bridge
32nm
As low as 20W
“Broadwell”
14nm
Xeon E3
Ivy Bridge
22nm
As low as 17W
Xeon E3
Haswell
22nm
As low as 13W
Atom S1200
32nm
As low as 6W
“Denverton”
14nm
“Broadwell”
SoC
14nm
Atom C2000
22nm
As low as 6W
ANNOUNCING
TODAY

9. Higher Performance
• Up to 7x faster1
Energy Efficient
• Up to 6x higher2 performance per watt
IA Software Compatibility
• Leverages existing SW ecosystem
Datacenter Class
• 64 bit, ECC memory, Intel® Virtualization Tech
Workload Optimized
•13 customized configurations
• Intel Quick Assist Technology
Intel® Atom™ Processor C2000 Product Family
2nd Generation Workload Optimized SoCs
IN PRODUCTION NOW!
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems,
components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated
purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance.
1 Performance based on Dynamic Web Benchmark Performance: Atom S1260(8GB,SSD,1GbE), Score=1522. Atom C2750(32GB, SSD,10GbE), Score=11351.
2 Performance per Watt based on Dynamic Web Benchmark: Atom S1260(8GB,SSD,1GbE), Score=1522, est node power=20W, PPW=76.1 Atom C2730(32GB, SSD,10GbE), Score=8778, est node power=19W,
PPW=462. Source: Intel Internal measurements as of August 2013. Refer to backup for additional details. Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any
difference in system hardware or software design or configuration may affect actual performance.
ANNOUNCING
TODAY

10. Extending Low Power IA Into New Segments
WIRELESS
LINE CARDS
ROUTERSSWITCHES
MICROSERVERS
COLD
STORAGE
NETWORK SECURITY
APPLIANCES
8C, Intel QuickAssist
Technology
8C, 64GB,
4x2.5GbE
2C, 7W,
10yr reliability
4C, <15W,
6 SATA
2C, Fanless, 7-yr
supply
4C, Intel QuickAssist
Technology
8C, Intel VT
And more configurations available…

11. Mats Karlsson
Vice President and Head of Architecture and
Process, Group Function Technology
*Other brands and names are the property of their respective owners.

12. © Ericsson AB 2013 | 2013-09-04 | Page 12

13. © Ericsson AB 2013 | 2013-09-04 | Page 13
Ericsson cloud system
The Network Enabled Cloud
Operator network
Network & DC Infrastructure
Ericsson Cloud Execution Environment
Ericsson
Cloud Manager
Ericsson Cloud System
ApplicationApplicationApplication
Application Application Application
Innovation & TTM
Performance
Efficiency

14. © Ericsson AB 2013 | 2013-09-04 | Page 14
Ericsson and INTEL
Announcing the Intel Atom C2000 in Ericsson’s cloud infrastructure
Common SW framework Energy efficiency
Intel VT, Intel DPDK Scalable product portfolio

15. Architecting for Hyper-scale Efficiency
Software Defined, Workload Optimized Infrastructure
PROCESSOR SYSTEM RACK

16. High Density System Innovation ANNOUNCING
TODAY
Intel® Ethernet Switch FM5224
Compressed Memory Connector
Shared Management Architecture
Up to
30%1
Server
Density
Memory
Density
Up to
2x
3
Power
& Components
Up to
75%
2
Reduction
*Other brands and names are the property of their respective owners
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems,
components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated
purchases, including the performance of that product when combined with other products. For more information go to www.intel.com/performance.
1. Based on 2.5G port count compared to the BCM56540
2. Based on 8 node configuration where 8 BMCs are replaced by a two component MMC solution
3. Based on Intel SSI based Tiger Cove CRB using Compressed Footprint Connector (CFC) compared to a standard DIMM connector
EcosystemEnabling
MMC
SoC
SoC
SoC
SoC
SoC
SoC
SoC
SoC

17. 50+ Atom C2000 System Designs
Microserver
Cold Storage
Entry Network
*Other brands and names are the property of their respective owners.

18. Germain Masse
Chief Operating Officer
*Other brands and names are the property of their respective owners.

19. © 2013 ovh.com. All rights reserved
2013
10
servers
150 000
servers
1999
10 000
servers
70 000
servers
Breathtaking GrowthRacks of servers
< 1h delivery

20. OVH.com
© 2013 ovh.com. All rights reserved
150 000
physical servers
12
datacenters
*Netcraft source, nov. 2012
3rd
worldwide
hosting provider*

21. © 2013 ovh.com. All rights reserved
Innovation for Technology and Cost Leadership
Watercooling Unique No Rack
design
SSD based
High performance storage
Own high speed WW fibre n/w
2 Tbps capacity

22. OVH.com deploying Intel Atom C2000
© 2013 ovh.com. All rights reserved
Storage Servers
(Deep archiving)
Entry-level
Dedicated Servers Memcache Servers
Higher Performance Larger Memory Capacity Low Power Consumption
Vs. Intel® Atom™ Processor S1200Vs, Intel® Atom™ Processor S1200 Vs. Intel® Atom™ Processor S1200

23. Intel® Atom™ Processor C2000
Collaborating with Leading Cloud Providers & Hosters
“The right size performance,
power efficiencies and data
center class features makes
the Intel Atom Processor
C2000 the right choice for our
entry level dedicated hosting
service that will launch this
year.”
Robert Hoffmann, CEO Hosting,
United Internet
Multiple joint R&D projects:
Specialized rack architecture
Multi-tier data storage
Broad use of Xeon in storage
today and evaluating Atom
C2000 for entry storage
*Other brands and names are the property of their respective owners.

24. Architecting for Hyper-scale Efficiency
Software Defined, Workload Optimized Infrastructure
PROCESSOR SYSTEM RACK

25. Intel® Silicon Photonics
Silicon: Intel® Atom™ & Xeon
Open Network Platform
CPU / Mem Modules
Intel Rack Scale Architecture Innovation
Orchestration
ANNOUNCING
TODAY
*Other brands and names are the property of their respective owners.
 New MXC connector
Up to1.6 Terabits per second bandwidth1
 New “ClearCurve” fiber
Enables >3x cable length (300m) at 25Gbps2
Higher Bandwidth, Modularity & Density
2ClearCurve fiber operating at 300 meters was tested using 300 meters of new ClearCurve fiber connected to an Agilent Bit Error Rate Tester (BERT) that
included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector.
1Measured per fiber bandwidth on an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector. MXC connector used had
32 fibers for an actual data rate of .8 tera-bits. Mechanical models and CAD simulations show that the MXC can accommodate up to 64 fibers for a theoretical total bandwidth of 1.6 Tera-bits per second.

26. Live Rack Scale
DEMO

27. Intel Rack Scale Architecture
Growing Range of Implementations
January
Open Compute
Project
April
Project
Scorpio
Today
Next Gen Cloud
Scale Architecture
*Other brands and names are the property of their respective owners.

28. Chris Phillips
General Manager, Windows Server &
System Center Program Management
*Other brands and names are the property of their respective owners.

29. Innovation Cycle at Global Scale drives
‘Cloud OS’

30. ‘Cloud OS’ -
Blurring lines within, across racks

31. Software
Compatibility
Global
Ecosystem
Technology
Portfolio
Architecture
Consistency
Workload
Optimized
Silicon
Most Energy
Efficient
Transistors
Intel’s Unmatched Assets

32. Today’s News
Intel® Atom™ Processor C2000 now in production
1st “Silvermont” based SoC
>50 new systems designs enabled
Microserver, Cold Storage and Entry Networking
New Rack Scale Architecture technologies unveiled
Next generation interconnect technologies using Intel® silicon photonics

33. Q&A
Continue the Atom-C Conversation with live audiocast interviews from our
launch event featuring: Advantech, Dell, HP, Intel, Portwell, and Wiwynn
http://intel.ly/inteldc7
*Other brands and names are the property of their respective owners.

34. Legal Disclaimers
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are
measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other
information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the
referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of
systems available for purchase.
Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative
performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of
the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.
SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information.
Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer.
Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit
http://www.intel.com/info/hyperthreading.
Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select
Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit
http://www.intel.com/go/turbo
Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at http://ark.intel.com/ or contact your Intel representative for more information.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:
http://www.intel.com/products/processor_number
Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products specified are for
planning purposes only and are subject to change without notice.
Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product
roadmaps.
Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
All dates and products specified are for planning purposes only and are subject to change without notice
*Other names and brands may be claimed as the property of others.
* Other names and brands may be claimed as the property of others.

35. Legal Disclaimers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO
FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S
PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS,
OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR
INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS
SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions
marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to
them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to:
http://www.intel.com/design/literature.htm
* Other names and brands may be claimed as the property of others.

36. Performance Configuration Details
Dynamic Web Perfomance:
Atom S1260: DBC SDP w/Intel® Atom™ S1260 (2.0GHz, 2C), Hyper-Threading Enabled, 1x8GB DDR3-1333
MHz UDIMM ECC, BIOS version D134.4, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP
5.4.7, Boot Drive 1x 150GB SSD, Addl Drive 2x 150GB SSD, 2xGbE, Score: 1522
Atom C2xxx: MPK SDP w/Intel® Atom™ C2xxx (8C), Turbo Disabled, 4x8GB DDR3-1600 MHz UDIMM ECC,
BIOS version 18D05, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive
1x150GB SSD, Addl Drive 1x 800GB SSD, 1x10GbE, Score: 11109
Perfomance Per Watt:
Atom S1260: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013
Supermicro* 5017A-EF with one Intel® S1260 processor (2-core 2.0GHz), EIST Enabled, Hyper-Threading
Enabled, 8GB memory (1x 8GB DDR3-1333 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise
Linux 6.4 . Estimated score:int_rate_base2006=18.7. Est. Power=20W
Atom C2xxx: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013
Intel® Mohon Peak Alpha platform with one Intel® Avoton processor (8-core), Turbo Boost Disabled, 16GB
memory (2x 8GB DDR3-1600 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux
6.4. Estimated score:int_rate_base2006=69, Est. Power=19W