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POWER8 Power Hour with Mark Olson

Compared to alternative products like Intel or Oracle, what makes POWER8 so great?

In this one-hour webinar, IBM’s Power Systems Product Manager Mark Olson joins Tom Huntington to discuss the advantages of Power technology. You’ll get great information about:

• Product specs for the S814, S824, E870, and E880 servers
• What’s new and unique in these servers to the industry
• Why IBM i users on POWER5, POWER6, or POWER7 should move to POWER8
• What to expect next, including storage area network (SAN) and direct access storage (DAS)

POWER8 Power Hour with Mark Olson

  1. 1. © 2014 IBM Corporation IBM Power Systems Power Systems Hardware: Today and Tomorrow Jan, 2015 Mark Olson olsonm@us.ibm.com
  2. 2. © 2014 IBM Corporation IBM Power Systems 2 Processor Technology Roadmap POWER8 22 nm POWER5 130 nm POWER6 65 nm POWER7 45 nm POWER10 Or whatever it is named 2004 2007 2010 Starting 2014 Future POWER9 Or whatever it is named
  3. 3. © 2014 IBM Corporation IBM Power Systems 3 Processor Chip Comparisons POWER5 2004 POWER6 2007 POWER7 2010 POWER7+ 2012 130nm SOI 65nm SOI 45nm SOI eDRAM 32nm SOI eDRAM 2 SMT2 2 SMT2 8 SMT4 8 SMT4 1.9MB (L2) 36MB (L3) 8MB (L2) 32MB (L3) 2 + 32MB (L2+3) None 2 + 80MB (L2+3) None 15GB/s 6GB/s 30GB/s 20GB/s 100GB/s 40GB/s 100GB/s 40GB/s Technology Compute Cores Threads Caching On-chip Off-chip Bandwidth Sust. Mem. Peak I/O POWER8 22nm SOI eDRAM 12 SMT8 6 + 96MB (L2+3) 128MB (L4) 230GB/s 96GB/s
  4. 4. © 2014 IBM Corporation IBM Power Systems 5 Innovation Drives Performance 0% 20% 40% 60% 80% 100% 180 nm 130 nm 90 nm 65 nm 45 nm 32 nm 22 nm Gain by Technology Scaling Gain by Innovation Relative % of Improvement IBM plans for future 22 nm technology are subject to change.
  5. 5. © 2014 IBM Corporation IBM Power Systems 6 POWER8 Chip Packaging Bus Interfaces • Integrated PCIe Gen3 • SMP Interconnect • CAPI Accelerators • Crypto & memory expansion • Transactional Memory • Data Move / VM Mobility Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 L3 Cache & Chip Interconnect 8M L3 Region Mem. Ctrl.Mem. Ctrl. SMPLinks Accelerators SMPLinks PCIe Caches • 64K Data cache (L1) • 512 KB SRAM L2 / core • 96 MB eDRAM shared L3 • Up to 128 MB eDRAM L4 (off-chip) Cores • 12 cores (SMT8) • 8 dispatch, 10 issue, 16 exec pipe • 2X internal data flows/queues • Enhanced prefetching Memory • Dual memory Controllers • 230 GB/sec Sustained bandwidth Energy Management • On-chip Power Management Micro-controller • Integrated Per-core VRM • Critical Path Monitors Technology • 22nm SOI, eDRAM, 650mm2 • 15-layers = great bandwidth
  6. 6. © 2014 IBM Corporation IBM Power Systems 7 Memory Buffer DRAM Chips Intelligence Moved into Memory • Previously on POWER7+ chip onto buffer Processor Interface • High speed interface Performance Value POWER8 Memory Buffer Chip “L4 cache”
  7. 7. © 2014 IBM Corporation IBM Power Systems 8 Memory Bandwidth per Socket 0 10 20 30 40 50 60 70 POWER5 POWER6 POWER7 POWER8 GB/Sec
  8. 8. © 2014 IBM Corporation IBM Power Systems 9 Memory Bandwidth per Socket 0 50 100 150 200 POWER5 POWER6 POWER7 POWER8 GB/Sec Reset the scale
  9. 9. © 2014 IBM Corporation IBM Power Systems 10 POWER8 Memory Bandwidth per Socket 0 50 100 150 200 250 POWER5 POWER6 POWER7 POWER8 GB/Sec
  10. 10. © 2014 IBM Corporation IBM Power Systems 11 POWER7 Chip I/O Bridge GX Bus PCIe Gen2 PCI Devices PCIe Gen3 PCI Device POWER8 Chip POWER8 Integrated PCI Gen 3
  11. 11. © 2014 IBM Corporation IBM Power Systems 15 IO Bandwidth Comparing 2-Socket Servers 0 10 20 30 40 50 60 POWER6 POWER7 POWER7+ GB/Sec
  12. 12. © 2014 IBM Corporation IBM Power Systems 16 IO Bandwidth Comparing 2-Socket Servers 0 50 100 150 200 POWER6 POWER7 POWER7+ POWER8 GB/Sec Reset the scale
  13. 13. © 2014 IBM Corporation IBM Power Systems 17 POWER8 IO Bandwidth Comparing 2-Socket Servers 0 50 100 150 200 POWER6 POWER7 POWER7+ POWER8 GB/Sec
  14. 14. © 2014 IBM Corporation IBM Power Systems 18 POWER8 Coherence Bus FPGA or ASIC Customizable Hardware / Application Accelerator • Specific system SW, middleware, or user application • Written to durable interface POWER8 PCIe Gen3 Transport for encapsulated messages POWER8 CAPI (Coherent Accelerator Processor Interface) Like an “extra” core for the POWER8 chip
  15. 15. © 2014 IBM Corporation IBM Power Systems 19 Example: CAPI Attached Flash Optimization Pin buffers, Translate, Map DMA, Start I/O Application LVM Disk & Adapter DD Read/Write Syscall strategy() iodone() FileSystem strategy() iodone() Interrupt, unmap, unpin,Iodone scheduling 20K Instructions
  16. 16. © 2014 IBM Corporation IBM Power Systems 20 Example: CAPI Attached Flash Optimization  Issues Read/Write Commands from applications to eliminate 97% of instruction path length CAPI Flash controller Operates in User Space  Saves 10 Cores per 1M IOPs Pin buffers, Translate, Map DMA, Start I/O Application LVM Disk & Adapter DD Read/Write Syscall strategy() iodone() FileSystem strategy() iodone() Interrupt, unmap, unpin,Iodone scheduling < 500 Instructions Application Posix Async I/O Style API User Library Shared Memory Work Queue aio_read() aio_write() 20K Instructions Attach flash memory to POWER8 via CAPI coherent Attach
  17. 17. © 2014 IBM Corporation IBM Power Systems 21 POWER8 Leapfrogs 0 50 100 150 200 POWER5 POWER6 POWER7 POWER8 PCIe Gen3 0 50 100 150 200 POWER6 POWER7 POWER7+ POWER8 Memory Bandwidth I/O Bandwidth PCIe Gen3 PCI Device POWER8 POWER7 I/O Bridge GX Bus PCIe Gen2 PCI Devices PLUS …. CAPI Accelerators Transactional Memory Scaleability Smart use of energy … and more
  18. 18. © 2014 IBM Corporation IBM Power Systems 22 Scale-out CPW Comparisons S824 (1 or 2 socket) – 6-core 3.8 GHz 72,000 – 12-core 3.8 GHz 130,000 – 8-core 4.1 GHz 94,500 – 16-core 4.1 GHz 173,500 – 12-core 1-socket not offered – 24-core 3.5 GHz 230,500 S814 (1 socket) – 4-core 3.0 GHz 39,500 – 6-core 3.0 GHz 59,500 – 8-core 3.7 GHz 85,500 740 POWER7+ (1 or 2 socket) – 6-core 4.2 GHz 49,000 – 12-core 4.2 GHz 91,700 – 8-core 3.6 GHz 56,300 – 16-core 3.6 GHz 106,500 – 8-core 4.2 GHz 64,500 – 16-core 4.2 GHz 120,000 720 POWER7+ (1 socket) – 4-core 3.6 GHz 28,400 – 6-core 3.6 GHz 42,400 – 8-core 3.6 GHz 56,300 +50% ~ GHz +40% +40% +60% +90%
  19. 19. © 2014 IBM Corporation IBM Power Systems 23 CPW E880 – 32-core 4.35 GHz 381,000 – 64-core 4.35 GHz 755,000 – 96-core 4.35 GHz 1,114,000** (2015) – 128-core 4.35 GHz 1,495,000** (2015) E870 – 32-core 4.02 GHz 359,000 – 64-core 4.02 GHz 711,000 – 40-core 4.19 GHz 460,000 – 80-core 4.19 GHz 911,000 Measured using SMT8 SMT4 would be somewhat lower * planned to be published closer to their GA date. Early estimates can be provided under nondisclosure agreements if needed ** estimated value, not measured
  20. 20. © 2014 IBM Corporation IBM Power Systems 24 Performance per Core Moves Up with POWER8 24 595 5GHz 770 3.5GHz 780 4.14GHz TurboCore rPerf performance estimate for fully configured systems divided by number of cores 795 4.25GHz TurboCore 770 4.2GHz 780 4.4GHz E870 4.19GHz E880 4.35GHz …up to 1.5X over POWER7+ up to 2X over POWER7 up to 2.5X over fastest POWER6 rPerfPer-core(CPWsamestory)
  21. 21. © 2014 IBM Corporation IBM Power Systems 25 SAP SD Standard Application Benchmark Results, 2-Tier: SD Benchmark Users SAP enhancement package 5 for SAP ERP 6.0 Source: http//www.sap.com/solutions/benchmark/sd2tier.epx Fujitsu PQ 2800E Intel E7-8890 v2, 120c/240t Power E870 outperforms all other 8-socket systems (best Intel Xeon and best Oracle SPARC) 1.6X more users than Ivybridge-EX v2 Nearly 2X more users than Oracle T5-8 with 1/3 less cores! Oracle T5-8 T5, 128c/1024t IBM x3950 X6 Intel E7-8890 v2 120c/240t IBM Power 780 POWER7+ 96c/384t IBM Power E870 POWER8 80c/640t 128c 120c 120c 96c 80c (1) IBM Power System E870 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 80 cores / 640 threads, POWER8; 4.19GHz, 2048GB memory, 79,750 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog response: 0.97 seconds, line items/hour:8,722,000, dialog steps/hour: 26,166,000 SAPS: 436,100 database response time (dialog/update): 0.013 sec / 0.026 sec, CPU utilization: 99%, Certification #: 2014033 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (2) IBM Power System 780 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 96 cores / 384 threads, POWER7+; 3.72GHz, 1536GB memory, 57024 SD benchmark users, running AIX® 7.1 and DB2® 10, dialog response: 0.98 seconds, line items/hour: 6,234,330, dialog steps/hour: 18,703,000 SAPS: 311,720 database response time (dialog/update): 0.009 sec / 0.014 sec, CPU utilization: 99%, Certification #: 2014024 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (3) IBM System x3950 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 120 cores / 240 threads, Intel Xeon Processor E7-8890 v2; 2.80GHz, 1024GB memory, 49,000 SD benchmark users, running Windows Server 2012 Standard Edition and DB2® 10, dialog response: 0.85 seconds, line items/hour: 5,421,670, dialog steps/hour: 16,265,000 SAPS: 271,080; database response time (dialog/update): 0.0083 sec / 0.022 sec, CPU utilization: 98%, Certification #: 2014024 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (4) Fujitsu PRIMEQUEST 2800E on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 120 cores / 240 threads, Intel Xeon Processor E7-8890 v2; 2.80GHz, 1024GB memory, 49,000 SD benchmark users, running Windows Server 2012 Standard Edition and SQL Server 12, dialog response: 0.97 seconds, line items/hour: 5,193,670, dialog steps/hour: 15,581,000 SAPS: 259,680; database response time (dialog/update): 0.015 sec / 0.030 sec, CPU utilization: 99%, Certification #: 2014003 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (5) (5) Oracle SPARC Server T5-8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors/128 cores/1024 threads, SPARC T5; 3.60 GHz, 2,048 GB memory; 40,000 SD benchmark users, running Solaris® 11 and Oracle 11g; Certification # 2012013008. Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. All other product and service names mentioned are the trademarks of their respective companies.
  22. 22. © 2014 IBM Corporation IBM Power Systems 26 Over twice the ERP users per core with Power E870/E880 than the best Intel Xeon and best Oracle SPARC results Nearly 1000 Users per Core with POWER8 based E870 26 SDBenchmarkUsersperCore SAP SD Standard Application Benchmark Results, 2-Tier: SD Benchmark Users per Core SAP enhancement package 5 for SAP ERP 6.0 As of April 28, 2014 Source: http//www.sap.com/solutions/benchmark/sd2tier.epx IBM E870 POWER8 80c/640t Oracle M5-32 M5 192c/1536t HP DL580 E7-4890 v2 60c/120t Oracle T5-8 T5 128c/1024t (1) IBM Power System E870 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors / 80 cores / 640 threads, POWER8; 4.19GHz, 2048GB memory, 79,750 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog response: 0.97 seconds, line items/hour:8,722,000, dialog steps/hour: 26,166,000 SAPS: 436,100 database response time (dialog/update): 0.013 sec / 0.026 sec, CPU utilization: 99%, Certification #: 2014033 Results valid as of 10/3/14. Source: http://www.sap.com/benchmark. (2) HP ProLiant DL380 Gen9, on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors/36 cores/72 threads, Intel Xeon Processor 2699v3; 2.30 GHz, 256 GB memory; 16,101 SD benchmark users, running RHEL 6.5 and SAP ASE; Certification # 2014032. Results valid as of September 8, 2014. Source: http://www.sap.com/benchmark. (3) Oracle SPARC Server M5-32 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 32 processors/192 cores/1536 threads, SPARC M5; 3.60 GHz, 4,096 GB memory; 85,050 SD benchmark users, running Solaris® 11 and Oracle 11g; Certification # 2012013009. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark. (4) HP ProLiant DL580 Gen8on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors/60 cores/120 threads, Intel Xeon Processor 4890 v2; 2.80 GHz, 1024 GB memory; 24,450 SD benchmark users, running Windows Server 2012 Standard Edition and SQL Server 2012; Certification # 2043004. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark. (5) Oracle SPARC Server T5-8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 8 processors/128 cores/1024 threads, SPARC T5; 3.60 GHz, 2,048 GB memory; 40,000 SD benchmark users, running Solaris® 11 and Oracle 11g; Certification # 2012013008. Results valid as of April 28, 2014. Source: http://www.sap.com/benchmark. SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. All other product and service names mentioned are the trademarks of their respective companies. HP DL 380p E5-2699 v3 36c/72t 2.2Xmore users per core than the best competitors!
  23. 23. © 2014 IBM Corporation IBM Power Systems 27 SAP Sales & Distribution 2-Tier ERP 6 Benchmarks IBM Power System S824 using DB2 10.5 vs. Competition Over 2 times better 24 core performance than nearest Intel competitive results Up to 2 times greater performance than previous Power generation Cisco UCS C240 M3 Fujitsu RX300 S8 HP ProLiant BL460c IBM Power S824 IBM Power S824 IBM p270 IBM p260 (1.0) IBM Power System S824 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors / 24 cores / 192 threads, POWER8; 3.52GHz, 512 GB memory, 21,212 SD benchmark users, running AIX® 7.1 and DB2® 10.5, dialog response: 0.98 seconds, line items/hour: 2,317,330, dialog steps/hour: 6.952,000 SAPS: 115,870 database response time (dialog/update): 0.011 sec / 0.019sec, CPU utilization: 99%, Certification #: 2014016 Results valid as of 3/24/14. Source: http://www.sap.com/benchmark. (1.1) Fujitsu RX300 S8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24 cores / 48 threads. Intel Xeon E5-2697 processor 2.70 GHz, 256 GB memory, 10.240 SD benchmark users, running Windows Server 2012 SE and SQL Server 2012, Certification #: 2013024 (1.2) Cisco UCS c240 M3 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24c ores / 48 threads. Intel Xeon E5-2697 processor 2.70 GHz, 256 GB memory, 10.045 SD benchmark users, running Windows Server 2012 DE and SQL Server 2012, Certification #: 2013038 (1.3) HP ProLiant BL460c Gen8 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 24 cores / 48 threads. Intel Xeon E5- 2697 processor 2.70 GHz, 256 GB memory, 10.025 SD benchmark users, running Windows Server 2012 DE and SQL Server 2012, Certification #: 2013025 (2.1 IBM Flex System p270 Compute Node on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 4 processors / 24 cores / 96 threads, POWER7+; 3.4GHz, 256 GB memory, 12.528 SD benchmark users, running AIX® 7.1 and DB2® 10 .5 Certification #: 3012019 Source: http://www.sap.com/benchmark. (1.1)IBM Flex System p260 on the two-tier SAP SD standard application benchmark running SAP enhancement package 5 for the SAP ERP 6.0 application; 2 processors / 16 cores / 64 threads, POWER7+; 4.1GHz, 256 GB memory, 10,000 SD benchmark users, running AIX® 7.1 and DB2® 10, Certification #: 2012035 2Xmore users
  24. 24. © 2014 IBM Corporation IBM Power Systems 28 IBM Power System S824 delivers Best of Breed eBS 12.1.3 Payroll performance Over 2 times more performance per-core than Cisco result with higher overall through-put on few cores Cisco UCS C240 M3 24-core Oracle BL460c 16-core IBM Power S824 12-core 2X ! • All results use Oracle eBS 12.1.3 Payroll Batch Extra Large Kit and are current as of 3/24/2014.  For more information go to http://www.oracle.com/us/solutions/benchmark/apps-benchmark/results-166922.html Cisco UCS C240 M3 24-core Oracle BL460c 16-core IBM Power S824 12-core
  25. 25. © 2014 IBM Corporation IBM Power Systems 29 IBM Power System S824 delivers New High-water Siebel CRM Release 8.1.1.4 performance Over 3 times the DB performance per-core than previous results Highest overall users supported on fewer cores! Oracle SPRAC T4-2 16-core Cisco UCS B200 M3 16-core IBM Power S824 6-core 3.3 X (1) All results use Siebel 8.1.1.4 PSPP Kit and are current as of 3/24/2014. For more information go to http://www.oracle.com/us/solutions/benchmark/white- papers/siebel-167484.html New #1 Oracle SPRAC T4-2 16-core Cisco UCS B200 M3 16-core IBM Power S824 6-core
  26. 26. © 2014 IBM Corporation IBM Power Systems 30 “Single-thread-oriented” Workloads and POWER8 Technology Good news Compared to POWER7/POWER7+, POWER8 chips with similar GHz run 20-25% faster from a wall clock perspective …… ASSUMING NOT I/O BOUND time POWER7 POWER8 20-25% reduction
  27. 27. © 2014 IBM Corporation IBM Power Systems 31 A New Generation of IBM Power Systems Designed for Big Data Superior Cloud Economics Open Innovation Platform Open Innovation to put data to work
  28. 28. © 2014 IBM Corporation IBM Power Systems 32 Collaborative innovation for highly advanced systems Produce open hardware, software, firmware and tools Expand industry skills and investment for Power ecosystem Provide alternative architectures OpenPOWER Consortium IBM Google NVIDIA TYAN Mellanox Open Innovation
  29. 29. © 2014 IBM Corporation IBM Power Systems 33 Google® Mother Board using POWER8 Technology Development board previewed by Google at April 2014 POWER8 announcement
  30. 30. © 2014 IBM Corporation IBM Power Systems 34 Building collaboration and innovation at all levels Boards / Systems I/O / Storage / Acceleration Chip / SOC System / Software / Services Implementation / HPC / Research Complete member list at www.openpowerfoundation.org
  31. 31. © 2014 IBM Corporation IBM Power Systems 35 Power 770+ Power 780+ Power 750+ / 760+ Power 710+/730+ Power 720+/740+ P460+ 1Q 2014 Portfolio: POWER7/POWER7+ IBM PureFlex System p260+ p24L PowerLinux 7R4+ PowerLinux 7R1+ / 7R2+ Power 795
  32. 32. © 2014 IBM Corporation IBM Power Systems 36 Power 770+ Power 780+ Power 750+ / 760+ Power 710+/730+ Power 720+/740+ P460+ 2Q 2014 Portfolio: POWER8/POWER7/POWER7+ IBM PureFlex System p260+ p24L PowerLinux 7R4+ PowerLinux 7R1+ / 7R2+ Power 795
  33. 33. © 2014 IBM Corporation IBM Power Systems 37 Power 770+ Power 780+ Power 750+ / 760+ Power 710+/730+ Power 720+/740+ P460+ 4Q 2014 Portfolio: POWER8/POWER7/POWER7+ IBM PureFlex System p260+ p24L PowerLinux 7R4+ PowerLinux 7R1+ / 7R2+ Power 795
  34. 34. © 2014 IBM Corporation IBM Power Systems 38 Scale-out
  35. 35. © 2014 IBM Corporation IBM Power Systems 39 Scale-out Servers (with POWER8 technology) S824 (2 socket, 4U) S814 (1 socket, 4U) S822 (2 socket, 2U) S812L (1 socket, 2U) Linux-only S822L (2 socket, 2U) Linux-only S824L not shown – Linux Ubuntu only for GPU currently
  36. 36. © 2014 IBM Corporation IBM Power Systems 40 Scale-out Servers (with IBM i or AIX or Linux support) S814 (1 socket, 4U) – 6 or 8 core (P10 IBM i software tier) – 4 core (P05 IBM i software tier) S824 (2 socket, 4U) – 6/12 or 8/16 or 24 core – P20 IBM i software tier
  37. 37. © 2014 IBM Corporation IBM Power Systems 41 POWER8 1S4U Scale-out System Power S814  Form Factor: 4U or Tower  Single Socket  Cores: 4 (3.0 GHz), 6 (3.0 GHz) or 8 (3.7 GHz)  Memory: Up to 512 GB  Slots: 7 PCIe Gen3 Full-high (Hotplug)  Ethernet: Quad 1 Gbt in PCIe slot  Integrated ports: USB (4/5), Serial (1), HMC (2)  Internal Storage  DVD  12 SFF Bays -- Split Backplane: 6 + 6  or 18 SFF Bays with 7GB write cache  Hypervisor: PowerVM  OS: AIX, IBM i 7.1 or later (P10 software tier), Linux 3 Yr Warranty
  38. 38. © 2014 IBM Corporation IBM Power Systems 42 POWER8 2S4U Scale-out System Power S824  Single Socket populated  Cores: 6 (3.8 GHz) or 8 (4.1 GHz)  Memory: Up to 512 GB (Up to 1TB Nov annc)  Slots: 7 PCIe Gen3 full-high (Hotplug)  Both Sockets populated  Cores: 12 (3.8 GHz), 16 (4.1 GHz), or 24 (3.5 GHz)  Memory: Up to 1 TB (Up to 2TB Nov annc)  Slots: 11 PCIe Gen3 full-high (Hotplug)  Ethernet: Quad 1 Gbt in PCIe slot  Integrated ports: USB (4/5), Serial (1), HMC (2)  Internal Storage  DVD  12 SFF Bays -- Split Backplane: 6 + 6  or 18 SFF bays & 8 SSD bays with 7GB write cache  Hypervisor: PowerVM  OS: AIX, IBM i 7.1 or later (P20 software tier), Linux 3 Yr Warranty
  39. 39. © 2014 IBM Corporation IBM Power Systems 45 Enterprise
  40. 40. © 2014 IBM Corporation IBM Power Systems 46 No Primary Node Midplane  Service Processors  Clocks  Oscillators Large Memory 19” Rack Modular design Up to 4 CEC drawers Blindswap IO Adapters POWER8 Enterprise Solutions Midplan e
  41. 41. © 2014 IBM Corporation IBM Power Systems 48 Power E880: 1, 2, 3 or 4 Nodes Node Node Node Node MidPlane 22U in 19” rack 3- and 4-node configurations planned availability June 2015
  42. 42. © 2014 IBM Corporation IBM Power Systems 49 Power E870: 1 or 2 Nodes Node Node MidPlane 12U in 19” rack
  43. 43. © 2014 IBM Corporation IBM Power Systems 50 Power Scale Perspective Power 770 Power 780 Power 795 50
  44. 44. © 2014 IBM Corporation IBM Power Systems 51 Power E870 & E880 servers • 8 to 128 cores @ 4.35 GHz • Up to 192 cores* in 2015 • 256 to 16TB Memory • 1 to 4 nodes • Built-in initial Elastic CoD days *Statement of Direction to support up to 8TB memory on E870 and up to 4 PCIe I/O Expansion Drawers per node on Power E870 & E880 in 2015. Initial GA in 4Q14 supports 4TB maximum on E870 and 0 or 2 PCIe I/O drawers per node on E870 & E880.  Increased performance and scale  Built-in PowerVM Enterprise Edition  Enterprise RAS  Active Memory Mirroring for Hypervisor  More performance per-watt  Capacity on Demand  Share resources in Power Enterprise Pool  Medium Software tier  24x7 Warranty Power E880Power E870 • 8 to 80 cores @ 4.19 GHz • 8 to 64 cores @ 4.0 GHz • 256 to 4TB Memory (8TB SOD*) • 1 or 2 nodes
  45. 45. © 2014 IBM Corporation IBM Power Systems 52 POWER8 E870 Compares: 2-Node/Drawer System 9117-MMD Power 770 POWER8 Enterprise 2 CEC Node- drawer CPU Sockets per Node/Drawer 4 4 Max processor nodes/Drawers 4 2 Max number sockets 16 8 Max Cores 64 64 or 80 Max Frequency 3.8 GHz 4 or 4.19GHz Max Memory 1 TB per CEC Drw 2 TB per CEC Drw Memory per core 64 GB 62 or 50 GB Memory Bandwidth (peak) 272 GB/s per CEC Drw 922 GB/s per CEC Drw I/O Bandwidth (peak) 80 GB/s per CEC Drw (GX) 256 GB/s per CEC Drw (PCIe Gen3) Max PCIe I/O drws 16 (4 per Node) 4 (2 per Node) Max PCIe I/O Slots 160 - in IO drws 24 - internal 48 in IO drws 8 - internal IBM i levels supported IBM i 6.1 and later IBM i 7.1 and later 2014 & currently
  46. 46. © 2014 IBM Corporation IBM Power Systems 53 POWER8 E870 Compares: 2-Node/Drawer System 9117-MMD Power 770 POWER8 Enterprise 2 CEC Node- drawer CPU Sockets per Node/Drawer 4 4 Max processor nodes/Drawers 4 2 Max number sockets 16 8 Max Cores 64 64 or 80 Max Frequency 3.8 GHz 4 or 4.19 GHz Max Memory 1 TB per CEC Drw 4 TB per CEC Drw Memory per core 64 GB 62 or 50 GB Memory Bandwidth (peak) 272 GB/s per CEC Drw 922 GB/s per CEC Drw I/O Bandwidth (peak) 80 GB/s per CEC Drw (GX) 256 GB/s per CEC Drw (PCIe Gen3) Max PCIe I/O drws 16 (4 per Node) 8 (4 per Node) Max PCIe I/O Slots 160 - in IO drws 24 - internal 96 – in IO drws 0 - internal IBM i levels supported IBM i 6.1 and later IBM i 7.1 and later Planned SOD * SOD * * SOD = statement of direction – represents IBM plans shared publically. As always plans subject to change.
  47. 47. © 2014 IBM Corporation IBM Power Systems 56 PCIe I/O Drawer
  48. 48. © 2014 IBM Corporation IBM Power Systems 57  4U in standard 19” rack  PCIe Gen3 x8 or x16 slots – Full-High, Full-Length slots  PCIe x16 Gen3 cable connection to POWER8 CEC  Dual fiber optic cables POWER8 PCIe Gen3 IO Drawer Today for Power E870 and E880 SOD for Scale-out
  49. 49. © 2014 IBM Corporation IBM Power Systems 58 IO Bandwidth (Comparing I/O Drawers) 0 10 2 0 3 0 4 0 5 0 6 0 7 0 #5877 #EMX0 Total drawer GB/Sec One PCIe Gen3 Drawer (12 PCIe slots) 10 or 20 slots POWER8 PCIe-attached Gen3 I/O drawer has two fan-out modules and each fan-out module has 32GB/s POWER7 12X-attached PCIe I/O drawer = #5877 or #5802 One or two #5877 or #5802 can share a single GX++ slot’s 20GB/s bandwidth POWER8 POWER7+
  50. 50. © 2014 IBM Corporation IBM Power Systems 61 DAS or SAN ?  Both options are strategic  Both options have their strengths  Can use both options on the same server  Application independent –Ignoring operational options Power System running IBM i DAS Direct Attached Storage (“internal”) SAN Storage Area Network (“external”)
  51. 51. © 2014 IBM Corporation IBM Power Systems Power Hardware Update Mark Olson olsonm@us.ibm.com
  52. 52. © 2014 IBM Corporation IBM Power Systems 63 This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area. Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA. All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied. All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions. IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice. IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies. All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally- available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment. Special notices
  53. 53. © 2014 IBM Corporation IBM Power Systems 64 IBM, the IBM logo, ibm.com AIX, AIX (logo), AIX 6 (logo), AS/400, BladeCenter, Blue Gene, ClusterProven, DB2, ESCON, i5/OS, i5/OS (logo), IBM Business Partner (logo), IntelliStation, LoadLeveler, Lotus, Lotus Notes, Notes, Operating System/400, OS/400, PartnerLink, PartnerWorld, PowerPC, pSeries, Rational, RISC System/6000, RS/6000, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, WebSphere, xSeries, z/OS, zSeries, AIX 5L, Chiphopper, Chipkill, Cloudscape, DB2 Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise Workload Manager, General Purpose File System, , GPFS, HACMP, HACMP/6000, HASM, IBM Systems Director Active Energy Manager, iSeries, Micro-Partitioning, POWER, PowerExecutive, PowerVM, PowerVM (logo), PowerHA, Power Architecture, Power Everywhere, Power Family, POWER Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2, POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER6+, System i, System p, System p5, System Storage, System z, Tivoli Enterprise, TME 10, Workload Partitions Manager and X-Architecture are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at "Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. UNIX is a registered trademark of The Open Group in the United States, other countries or both. Linux is a registered trademark of Linus Torvalds in the United States, other countries or both. Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both. Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or both. AMD Opteron is a trademark of Advanced Micro Devices, Inc. Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both. TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC). SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC). NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both. AltiVec is a trademark of Freescale Semiconductor, Inc. Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc. InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association. Other company, product and service names may be trademarks or service marks of others. Special notices (cont.)

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Compared to alternative products like Intel or Oracle, what makes POWER8 so great? In this one-hour webinar, IBM’s Power Systems Product Manager Mark Olson joins Tom Huntington to discuss the advantages of Power technology. You’ll get great information about: • Product specs for the S814, S824, E870, and E880 servers • What’s new and unique in these servers to the industry • Why IBM i users on POWER5, POWER6, or POWER7 should move to POWER8 • What to expect next, including storage area network (SAN) and direct access storage (DAS)

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