CCD OPERATORS TRAINING PPT (1).pptx

1. DEFECTS – RED WIRE OVERLAP – PRE WCM INSPECTION CAUSE OF FAILURE RED WIRE MISALIGNMENT NG RED WIRE ALIGNMENT Functional failures:  T1,T2 shorts  In pre-hot bar wire cut  Core wire sleeves tear down  T1, T2 Open failures  Red wire excess soldering  Dcr_HCHV:VBUS_I: 0.2A fail in NIATE  Open:pin_top_to_bottom  Open:vbus_A4 to Vbus_A9  Open:A1 to A4 GOOD IMPACT  Red wire improper fixing by operator  Improper alignment in the fixture  Damaged fixture slot  Improper closing of the fixture door

2. DEFECTS – BLUE WIRE IMPROPER PLACING – PRE WCM INSPECTION CAUSE OF FAILURE NG  Blue wire improper fixing by operator  Blue wire short  Improper alignment in the fixture Functional failures:  CCI_to_CC0_CONNECT  CCI_to_CCO_Disconnect  CCDT  Open:A1 TO A5  Open:B1 TO B5  Blue wire cut  In pre-hot bar wire cut  Core wire sleeves tear down  T1, T2 short  T1, T2 Open  Blue wire excess soldering GOOD BLUE WIRE MISALIGNMENT BLUE WIRE ALIGNMENT IMPACT

3. DEFECTS – GREY WIRE IMPROPER PLACING – PRE WCM INSPECTION NG  Gnd wire improper fixing  Gnd wire improper alignment  Gnd wire improper twisting GOOD GREY WIRE MISALIGNMENT GREY WIRE ALIGNMENT CAUSE OF FAILURE IMPACT Functional failures:  Open:DPA_top_to_bottom  DP_forward_2mA  Open:CCO_top_to_DPA_top  UMDP:0nf_Unmated_voltage  Short:DPA_WS to DPA TOP PS  T1,T2 shorts  T1, T2 open

4. DEFECTS – WHITE WIRE IMPROPER PLACING– PRE WCM INSPECTION CAUSE OF FAILURE NG GOOD WHITE WIRE MISALIGNMENT WHITE WIRE ALIGNMENT Functional failures:  White_wire(DNA_wire)  Open:DNA_top_to_bottom  Open:CCO_top_to_DNA_top  T1 short  T2 short  Core wire sleeves tear down  In pre-hot bar wire cut Visual:  Improper soldering  Less soldering  White wire improper fixing  Improper alignment in the fixture  Damaged fixture slot IMPACT

5. DEFECTS – GREEN WIRE OVER LAP – PRE WCM INSPECTION CAUSE OF FAILURE NG GOOD GREEN WIRE MISALIGNMENT GREEN WIRE ALIGNMENT Functional failures:  Open:DPA_top_to_bottom  DP_forward_2mA  Open:CCO_top_to_DPA_top  UMDP:0nf_Unmated_voltage  Short:DPA_WS to DPA TOP PS  Core sleeves tear down  Improper alignment in the fixture  Damaged fixture slot  Green wire improper fixing  In pre-hot bar wire cut  Improper alignment in the fixture  Damaged fixture slot IMPACT

6. DEFECTS – improper dipping and wire cuts – PRE HBS CAUSE OF FAILURE BLUE WIRE CUT NG PROPER ALIGNMENT Functional failures:  CCI_to_CC0_CONNECT  CCI_to_CCO_Disconnect  CCDT  Open:A1 TO A5  Open:B1 TO B5  Open:A5 to A1  Open:B5 to GND TOP PS  CCDCR Visual failures:  loss Contact with pad GOOD  Blue wire dipping issue  Improper alignment of the peeling blades in pre wire cut  Excess mold in WCM  Improper alignment of the blue wire in WCM IMPACT

7. DEFECTS – improper dipping and wire cuts – PRE HBS CAUSE OF FAILURE RED WIRE IMPROPER TIN DIPPING NG RED WIRE PROPER ALIGNMENT Functional failures:  Dcr_HCHV:VBUS_I: 0.2A fail in NIATE  Open:pin_top_to_bottom  Open:vbus_A4 to Vbus_A9  Open:A1 to A4  Open:A1 to A9  T1 Open  T2 Open Visual failures:  loss Contact with pad  Causes soldering joints GOOD IMPACT  Malfunctioning of Tin dipping mechanism

8. DEFECTS – improper dipping and wire cuts – PRE HBS CAUSE OF FAILURE GREY WIRE CUT NG GREY WIRE PROPER ALIGNMENT  Grey wire dipping issue  Improper alignment of the peeling blades in pre wire cut  Excess mold in WCM  Improper alignment of the Grey wire in WCM Functional failures:  Open And Short failure in T1,T2.  Open:DPA_top_to_bottom  DP_forward_2mA  Open:CCO_top_to_DPA_top  UMDP:0nf_Unmated_voltage  Short:DPA_WS to DPA TOP PS Visual failures:  loss Contact with pad GOOD IMPACT

9. DEFECTS – improper dipping and wire cuts – PRE HBS CAUSE OF FAILURE GREEN WIRE CUT NG GREEN WIRE PROPER ALIGNMENT  Green wire dipping issue  Improper alignment of the peeling blades in pre wire cut  Excess mold in WCM  Improper alignment of the Green wire in WCM Functional failures:  Open:DPA_top_to_bottom  DP_forward_2mA  Open:CCO_top_to_DPA_top  UMDP:0nf_Unmated_voltage  Short:DPA_WS to DPA TOP PS Visual failures:  loss Contact with pad GOOD IMPACT

10. DEFECTS – improper dipping and wire cuts – PRE HBS CAUSE OF FAILURE WHITE WIRE CUT NG WHITE WIRE PROPER ALIGNMENT  White wire dipping issue  White wire dipping issue  Improper alignment of the peeling blades in pre wire cut  Excess mold in WCM  Improper alignment of the White wire in WCM Functional failures:  White_wire(DNA_wire)  Open:DNA_top_to_bottom  Open:CCO_top_to_DNA_top  UMDP:420nF_Unmated voltage  Short:DNA_WS to DNA TOP PS  T1, Open  Visual failures:  loss Contact with pad GOOD IMPACT

11. DEFECTS – improper SOLDERING OF CABLE – POST HBS CAUSE OF FAILURE BLUE WIRE LESS SOLDERING NG BLUE WIRE PROPER SOLDERING  Improper alignment off the Blue wire in Pre HBS.  Mother carrier disturbance  HBS Head issue  Tin feeding puller arm issue Functional failures:  CCI_to_CC0_CONNECT  CCI_to_CCO_Disconnect  CCDT  Open:A1 TO A5  Open:B1 TO B5  Open:A5 to A1  Open:B5 to GND TOP PS  CCDCR  T1, T2 Open Visual failures:  Blue wire soldering strength will reduced  loss Contact with pad GOOD IMPACT

12. DEFECTS – improper SOLDERING OF CABLE – POST HBS CAUSE OF FAILURE GREY WIRE LESS SOLDERING NG GREY WIRE PROPER SOLDERING  Improper alignment off the Grey wire in Pre HBS.  Mother carrier disturbance  HBS Head issue  Tin feeding puller arm issue Functional failures:  DP_forward_2mA  Open:CCO_top_to_DPA_top  UMDP:0nf_Unmated_voltage  Open:DPA_top_to_bottom  T1, T2 Open failures Visual failures:  Grey wire soldering strength will reduced  loss Contact with pad GOOD IMPACT

13. DEFECTS – improper SOLDERING OF CABLE – POST HBS CAUSE OF FAILURE WHITE WIRE LESS SOLDERING NG WHITE WIRE PROPER SOLDERING  Improper alignment off the white wire in Pre HBS.  Mother carrier disturbance  HBS Head issue  Tin feeding puller arm issue Functional failures:  White_wire(DNA_wire):  Open:DNA_top_to_bottom  Open:CCO_top_to_DNA_top  T1, T2 Open Visual failures:  white wire soldering strength will reduce  loss Contact with pad GOOD IMPACT

14. DEFECTS – improper SOLDERING OF CABLE – POST HBS CAUSE OF FAILURE GREEN WIRE LESS SOLDERING NG GREEN WIRE PROPER SOLDERING  Improper alignment off the Green wire in Pre HBS.  Mother carrier disturbance  HBS Head issue  Tin feeding puller arm issue Functional failures:  Open:DPA_top_to_bottom  DP_forward_2mA  Open:CCO_top_to_DPA_top  UMDP:0nf_Unmated_voltage  T1,T2 OPen Visual failures:  Green wire strength will reduced  loss Contact with pad GOOD IMPACT

15. DEFECTS – improper SOLDERING OF CABLE – POST HBS CAUSE OF FAILURE RED WIRE LESS SOLDERING NG RED WIRE PROPER SOLDERING  Improper alignment off the Red wire in Pre HBS.  Mother carrier disturbance  HBS Head issue  Tin feeding puller arm issue Functional failures:  Dcr_HCHV:VBUS_I: 0.2A fail in NIATE  Open:pin_top_to_bottom  Open:vbus_A4 to Vbus_A9  Open:A1 to A4  Open:A1 to A9  T1, T2 Open Visual failures:  Red wire strength will reduced  loss Contact with pad GOOD IMPACT

16. DEFECTS – DIOADE DAMAGE – POST HBS CAUSE OF FAILURE COMPONENT DAMAGE NG COMPONENT OK  Spill out PCBAs  Improper handling of PCBA while aligning Functional failures:  CCI_to_CC0_CONNECT  DP_forward_2mA  Missing diode in T2 stage GOOD IMPACT

17. DEFECTS – SOLDER BRIDGES – POST HBS CAUSE OF FAILURE GREEN WIRE LESS SOLDERING NG GREEN WIRE PROPER SOLDERING  Improper tin dipping  Solder derbies present in HBS mother carriers  Solder head Temperature issue Functional failures:  T1 short  T2 short  Open:pin_top_to_bottom  DP_forward_2mA GOOD IMPACT

18. DEFECTS – LESS GLUE– UV GLUE INSPECTION CAUSE OF FAILURE NG Functional failures:  OPEN:pin_top_to_GND top Visual failures:  Soldering disturbe  Components damage  Short with Shell GOOD LESS GLUE OK GLUE IMPACT  Glue dispenser pressure issue  Glue bottle become almost Empty  Conveyor speed problem

19. DEFECTS – OVER GLUE –UV GLUE ISPECTION CAUSE OF FAILURE NG  Glue dispenser issue  Conveyor speed issue Visual failures:  Shell alignment issue  Shell gap  Shell overlap GOOD EXCESS GLUE OK GLUE IMPACT

20. DEFECTS – COMPONENT DAMAGE– UV GLUE INSPECTION CAUSE OF FAILURE NG Functional issue:  DP_forward_2mA  CCDT  Missing Diode in T2  Capacitor damage GOOD COMPONENT DAMAGE COMPONENTS OK IMPACT  Component damage because of spillage  Improper Handling of the operator  Mother carriers issue in HBS

21. DEFECTS – SHELL GAP– SHELL CRIMPING INSPECTION CAUSE OF FAILURE NG  Excess glue  Fixture issue  OP loading issue Visual failures:  Inner molding material filled and covers all over the pcba  Boot assembly issue  Faceplate gap issue GOOD SHELL GAP SHELL OK IMPACT

22. DEFECTS – LEAKAGE LENGTH - SHELL CRIMPING INSPECTION CAUSE OF FAILURE NG  Fixture problem  OP loading Issue  Dust present in the fixture  Spring issue in the fixture Visual failures:  Offset issue in faceplate & boot assy  Faceplate alignment issue  Exposure length issue Functional failures:  AOI stage causes offset GOOD SHELL LEAKAGE LENGTH NOT OK SHELL LEAKAGE LENGTH OK IMPACT

23. DEFECTS – REVITING ISSUE– SHELL CRIMPING INSPECTION NG  Cable damage Functional Failures:  Dcr_HCHV:VBUS_I: 0.2A fail in NIATE  Open:pin_top_to_bottom  Open:vbus_A4 to Vbus_A9  Open:A1 to A4  Open:A1 to A9 Visual fails:  SR od increases  Offset occured  SR damage GOOD REVITING ISSUE PERFECT REVITING IMPACT CAUSE OF FAILURE

24. DEFECTS – BAD WELDING– SHELL CRIMPING INSPECTION NG  High Power in Shell laser welding  Excess glue on the PCBA GOOD CAUSE OF FAILURE IMPACT WELDING OK BAD WELDING Visual fails:  Shell damage Fuctional failures:  Dcr_HCHV:VBUS_I: 0.2A fail in NIATE  Pcba damage

25. DEFECTS – Not ok ESD bin NG  Ink marks GOOD CAUSE OF FAILURE IMPACT OK ESD BIN NOT OK ESD BIN Visual fails:  causes cables dirty  cable damage

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