Intelligent Solutions BVBA
Together we reach the goal
http://www.intelligentsolutionsbvba.com
7/11/2013 1Confidential
Organization
California
Belgium
Shanghai
Singapore
Japan
7/11/2013 2
Morocco
Confidential
Key Members
CEO: Dr. Hany Fahmy (EMEA)
• Director of SI/PI/EMC Engineering of NVIDIA
• Sr. Manager and Sr. Staff of Memory...
Who is Hany Fahmy?
More info pls. Click Here
A Director and Technologist of Signal Integrity and Electromagnetic
Compatibi...
Top Happy Customers
7/11/2013 5Confidential
Happy Customers work
Broadcom: High-speed Ethernet design guideline & EMC
solution space for Infotainment systems
GE-Intel...
Our Partners
7/11/2013 7
Kuljit Bains : Sr. memory
Architect and JEDEC rep
Paul Fahey: Dr. of PMO
(platform memory
operati...
Standardization Committees
JEDEC – Bill Gervasi ( x-Chairman)
PCIe-GEN3 – Mike Mirmak & Arpad Muranyi
UHS-II: Max Perri (C...
Develop
Guidelines
Our Expertise
7/11/2013 9
10%
Confidential
Fast Debug & Root Cause
Get failure data
Locate the suspect
Verify and analyze by sim. & meas.
Optimization in simulation
...
RX
TX
Failed Overdesign
Puzzled !
Solutions For Cost-Down
7/11/2013 11Confidential
Develop Guidelines
SAS
SATA
PCIe
Ethernet
DDR EMI
BP Interconnect
Smart phone
DVI/DP/HDMI Package
7/11/2013 12Confidential
Build Team and
SI/PI/EMC Process
New to SI/EMI
World
Ramp up
Handle general
project
To be Experts
EMEA & China & India & M...
Training
Fundamental
Circuit Simulation Measurement
Advanced
7/11/2013 14Confidential
Success Hall-Fame
Click-Here for Outlook of Success Stories
• 10G Ethernet Back plane root cause and optimization
for curr...
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Intelligent solutions Company Portfolio

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Intelligent solutions Company Portfolio

  1. 1. Intelligent Solutions BVBA Together we reach the goal http://www.intelligentsolutionsbvba.com 7/11/2013 1Confidential
  2. 2. Organization California Belgium Shanghai Singapore Japan 7/11/2013 2 Morocco Confidential
  3. 3. Key Members CEO: Dr. Hany Fahmy (EMEA) • Director of SI/PI/EMC Engineering of NVIDIA • Sr. Manager and Sr. Staff of Memory Architecture Group of Intel • WW Business Development Manager for High Speed Digital and RF Technology of Agilent Sr. Engineer: Vincent Yan (Asia) • Sr. SI and EMI engineer of NVIDIA • Sr. SI and EMI engineer of EMC2 Sr. Engineer: Kevin Cai (Asia) • Sr. SI and EMC engineer of GE Sr. Engineer: Stevin Shen (Asia) • Sr. SI and EMC engineer Sr. Engineer: Ahmed Zahid (Morocco) • Sr. SI/PI/EMC engineer LEAR Corporation 7/11/2013 3Confidential
  4. 4. Who is Hany Fahmy? More info pls. Click Here A Director and Technologist of Signal Integrity and Electromagnetic Compatibility with a wide experience in design and analysis of High- Speed Digital and Analog interconnects (Memory, Ethernet Backplanes, PCI-e, DVI/HDMI/LVDS/DP and USB). Innovative interconnect & High-Speed-Digital architect for I/O buffer design/modeling and electrical characterization of signal interconnects in the microwave/mm-wave frequency range. Group manager for SI/PI/EMC teams designing Smartphones/Tablets, GPU-cards and memory products chartered to simulate, model and lab characterize advanced high speed digital solutions. Expertise in designing Embedded, Mobile and Server platforms for complex CPU/GPU’s, chipsets and FPGAs with Synchronous Buses like DDR1/2/3, GDDR3/5, and SERDES interfaces. Dedicated, results- oriented and customer satisfaction are top priorities. A crucial player in JEDEC DDR1/2/3/4 and UHS-II for the development of SDRAM electrical & DIMM specifications. Watch my Seminar at IMEC Academy: The European Silicon Valley Holder of Nine-Patents & Many Publications @ DesignCon & IEEE- AP, IEEE-MTT, …etc. 7/11/2013 4Confidential
  5. 5. Top Happy Customers 7/11/2013 5Confidential
  6. 6. Happy Customers work Broadcom: High-speed Ethernet design guideline & EMC solution space for Infotainment systems GE-Intelligent Platforms: Single-Board-Computer System high-speed-digital interface design special focus on DDR3/4 memory, PCIE-GEN3, USB 3.0 & 10GBps Ethernet. SanDisk: SiP design of MCH-die talking with multiple SDRAM-dies 3D-Plus: 3D-Package design for DDR2/3 Memory interface (SDRAM package integration) Nvidia: RF-Antenna & Digital-2-RF coupling on Tegra3/4 Smartphones. Comtel: CPU Module & Ethernet-Backplane beyond 10GBps Avago: EMI suppression techniques for Optical- Transciever design 7/11/2013 6Confidential
  7. 7. Our Partners 7/11/2013 7 Kuljit Bains : Sr. memory Architect and JEDEC rep Paul Fahey: Dr. of PMO (platform memory operation) VNA & TDR & 3m EMI-pre-compliance EMI-lab: 5m & 10m chambers EMC PCB layout Tommy Lee Sr. VP Ross Jatou Sr. Director Charlie Shu Sr. SI/EMC Manager Romi Mayder: Sr. TME (Techncial Marketing Engineer) Confidential
  8. 8. Standardization Committees JEDEC – Bill Gervasi ( x-Chairman) PCIe-GEN3 – Mike Mirmak & Arpad Muranyi UHS-II: Max Perri (Chairman) USB 3.0 IEEE 803.3ba 7/11/2013 8Confidential
  9. 9. Develop Guidelines Our Expertise 7/11/2013 9 10% Confidential
  10. 10. Fast Debug & Root Cause Get failure data Locate the suspect Verify and analyze by sim. & meas. Optimization in simulation Achieve the Goal Successfully 7/11/2013 10Confidential
  11. 11. RX TX Failed Overdesign Puzzled ! Solutions For Cost-Down 7/11/2013 11Confidential
  12. 12. Develop Guidelines SAS SATA PCIe Ethernet DDR EMI BP Interconnect Smart phone DVI/DP/HDMI Package 7/11/2013 12Confidential
  13. 13. Build Team and SI/PI/EMC Process New to SI/EMI World Ramp up Handle general project To be Experts EMEA & China & India & Morocco local support Face to face mentor Face to face discussion Advanced training Experience sharing 10+ years mentor 10+ years team managing 7/11/2013 13Confidential
  14. 14. Training Fundamental Circuit Simulation Measurement Advanced 7/11/2013 14Confidential
  15. 15. Success Hall-Fame Click-Here for Outlook of Success Stories • 10G Ethernet Back plane root cause and optimization for current and next gen product • DDR2/3 package XTALK root cause and optimization • DDR2/3 PCB routing and termination root cause and optimization • DDR2/3 power deliver network root cause and optimization • Decoupling cap optimization for cost down project • EMI package issue root cause • EMI connector issue root cause • EMI board issue root cause • Smartphone antenna design and XTALK issue root cause 7/11/2013 15Confidential

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