C e l l u l ar

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C e l l u l ar

  1. 1. Cellular Family GSM and CDMA Solutions for the New Cellular Generation
  2. 2. Why VLSI? VLSI’s Communication Products Group brings unique strengths to the communications marketplace. Our continued success in the rapidly expanding wireless communications market is due to our experience in complex systems development, combined with high- volume production excellence. VLSI Wireless customers benefit from our unique ability to combine analog and digital circuitry using our advanced CMOS process technology. ONE PLAT F ORu p p o r s M t s i t a l l System FSBs and Single-Mode DSP Firmware GSM CDMA DECT 3G/UMTS/ Analog Cells W-CDMA/CDMA-2000 Multi-Mode Micro-controller ARM7TDMI/ARM9T DSP Velocity ™ GSM/DECT CDMA/AMPS GSM/SAT GSM/CDMA OAK+/PALM Multi-Application GPRS/EDGE WAP, Windows CE, Embedded Processor EPOC, Bluetooth, GPS, Tools PDA, MPEG/Video Ve l o c i t y ™ S t a n d a rd VLSI is committed to wireless, with worldwide design, Communication manufacturing, test and assembly re s o u rces and P l a t f o rm ™ ( S C P ™ ) leading integration capabilities. VLSI’s Communication P roducts Group offers the most integrated, highest p e rf o rmance single-chip baseband solutions for the major digital wireless standards such as GSM and CDMA for cellular, converging toward Third Generation (3G); DECT for cordless; emerging Bluetooth; plus multi-mode and pro p r i e t a ry systems.
  3. 3. O n e P l a t f o r m S u p p o r t s I t A l l The wireless sector requires an ever-shrinking time-to- market with each new product. To profit from short windows of opportunity, our customers need integrated reusable hardware and software platforms, support for the latest design tools and fabrication processes, and accelerated prototype and production runs. We base our wireless capabilities on the Velocity ™ Standard Communication Platform™ (SCP ™), combining the Oak+DSPCore ™ and ARM7TDMI microprocessor into an all-powerful, flexible, dual-processor subsystem. ( ) Based on the Velocity SCP, our cellular innovations enable smaller, lower-cost, more e fficient cellular handsets with longer talk and standby times, enhanced speech quality, higher perf o rmance, richer feature sets and innovative industrial design. V L S I ’s Velocity SCP allows phone manufacturers to develop products for multiple wireless markets based on a common arc h i t e c t u re and tools enviro n m e n t . F u rt h e rm o re, VLSI’s Velocity design methodology p rovides a unique technology platform to integrate multiple, converging technologies in the most c o s t - e ffective way. The Velocity SCP comprises pro v e n building blocks that include VLSI-enhanced embeddable ARM ™ and DSP cores and a variety of peripherals including I/Os, caches, interru p t c o n t rollers, UARTs and analog cells. The Velocity SCP also includes CPU software and DSP firm w a re modules, along with integrated ARM and DSP software tools. All these elements, along with the Velocity HDL Integrator ™ ( H D L i ™) design methodology, allow the quick, eff i c i e n t development of complete system-on-a-chip solutions.
  4. 4. At the heart of the Velocity Standard Communication P l a t f o rm are powerful cores. VLSI’s enhanced 32-bit ARM RISC processor cores, ARM7TDMI and ARM9TDMI, a re ideal for cost-sensitive, high-perf o rmance low- power embedded applications. VLSI also offers a range of embedded DSP solutions including the Oak+DSP, and the PalmDSPCore ®, designed to meet the perf o rmance and flexibility needs of leading-edge applications such as CDMA, GSM, and f o rthcoming Third Generation (3G) standard s . Vel oci ty Multi-Core Technology ARM9T Enhanced 374 Mips – 340 MHz Enhanced ARM7TDMI 0.20µ ARM7TDMI 162 Mips – 180 MHz VVS4090 95 Mips – 105 MHz 0.25µ Bi-Processor 0.35µ VVS4071 VVS3771 Bi-Processor Bi-Processor VVS3670 PalmDSPCore® 450 Mips – 150 MHz Core Oak+ 0.20µ 130 Mips – 130 MHz Dev Chip OakDSPCore® 0.25µ 80 Mips – 80 MHz 0.35µ Performance: Typical: std process, Tj=25˚C, V nom 97 98 99 00 V L S I ’s embedded cores are supported by the J u m p S t a rt XE™, family. It provides one of the market’s most integrated sets of tools for simultaneous code generation and debugging for ARM, DSP and ARM/DSP m u l t i - c o re applications with a single user interf a c e . This tool suite includes a C-compiler, assembler, linker, libraries and debugger, as well as a flexible development platform. V L S I ’s cores are also supported by third - p a rty tool p roviders such as Hewlett Packard and Lauterbach.
  5. 5. OneC Family Features OneC Family Benefits Single-chip GSM baseband Low power, high performance Mixed-signal technology Low cost, size Tri-rate speech coding (EFR, FR, HR, AMR) Full GSM phase 2 speech compliance T/NT, EDGE & GPRS data (up to 8TX+8RX) Flexible evolution towards 3G Flexible architecture Customizable core and periphery Flexible radio interface Compatible with all 3rd party radio solutions RAM + ROM based versions Low risk, rapid DSP-code modification 180 FPBGA packaging Small footprint, 12x12mm Embedded processor tools System-level debug, best time-to-market Integrated ARM µC plus OAK DSP Extensive firmware, 3rd party support Development platform support HW/SW co-design, fast debug Availability of OAK+ Higher performance, more functionality Roadmap to 0.15µm and beyond Higher system integration (RAM, ROM) The GSM O n e C™ F a m i l y V L S I ’s second-generation GSM baseband single-chip devices provide the industry ’s highest integration level, based on our advanced 0.25µm CMOS process. The high level of integration, including the dual processor core , as well as the radio and voice front-ends, delivers t remendous power and cost savings. On average, thanks to VLSI’s ability to integrate analog and digital circ u i t s in a single chip, the OneC™ achieves 50% lower power consumption compared to today’s comparable two-chip solutions. The extensive feature set for voice and data s e rvices has put the GSM OneC solution at the heart of many industry players’ success stories. R F I n t e r f a c e S u p p o r t The OneC has a flexible RF interface allowing seamless compatibility with a wide range of industry- s t a n d a rd radios such as those from Siemens, Hitachi’s BRIGHT ™ RF family, and several upcoming solutions. VLSI is committed to continuous enhancements of the OneC’s RF interface flexibility to allow customers the widest choice of available RF solutions, reducing cost and development risks. S i m i l a r l y, the CDMA+ Processor is designed to interf a c e to a variety of RF chipsets including those from Sony, Conexant, Maxim, Mitel, and AKM.
  6. 6. Velocity 3G Platform Velocity GSM Velocity SCP Platform OneC VWS22600 GSM Velocity OneC VWS22500 CDMA+ Processor 400 CDMA+ Processor 300 ARM7/9, Oak+/Palm UMTS, W-CDMA, ARM7/9, Oak+/Palm CDMA-2000 3X GSM: GPRS, EDGE CDMA-2000 1X Computing, Bluetooth, GPS GSM OneC VWS22120 GSM OneC GSM OneC VWS22100 VWS22110 CDMA+ Processor 200 CDMA+ CDMA+ ARM7, Oak+ Processor 100 Processor 110 Memory Integration ARM7, Oak+ ARM7, Oak+ GSM: AMR, GPRS 0.35µ 0.25µ 0.15µ CDMA+ Family Features CDMA+ Family Benefits Chip + Software solution Minimizes development time and risk Integrated Audio Codec and PLL Low cost, small footprint Integrated ARM controller Provides performance needed for data and smart phone apps Downloadable DSP code Enables chip operation to be customized and features added Standard radio interface Compatible with all 3rd party radio solutions 180 FPBGA packaging Small footprint, 12x12mm Roadmap to 0.15µm and beyond Provides lower cost and power – more integration Can be customized Enables customer to further differentiate their products
  7. 7. The C D M A +™ F a m i l y The CDMA+ ™ P rocessor is a single-chip CDMA dual-core baseband solution. VLSI’s CDMA+ Processor platform p rovides a complete, verified and supported package including the cost-effective, low-power CDMA+ P rocessor 100 chip, software, and debug tools. This c o m p rehensive package simplifies mobile phone development, provides quick time to market and reduces development cost and risk. Since the CDMA+ baseband solution was developed, like the OneC, using the Velocity Standard Communication Platform, it f e a t u res an easily customizable arc h i t e c t u re that allows high-volume mobile phone manufacturers to c reate diff e rentiated products based on a common a rc h i t e c t u re and tools environment, enabling faster p roduct development and migration. Futur e Cellular Developments VLSI is dedicated to market-leading cost eff i c i e n c y. The availability of our VSC11 0.15µm (L e ff 0 . 1 2 µ m ) technology not only allows SRAM and Flash integration in future chipsets, but also provides the base for furt h e r radio integration. A major challenge in the migration t o w a rds 3G products and wireless technologies will be the upcoming convergence of communication technologies with many complementary applications. V L S I ’s Velocity design methodology has been developed to support and accelerate the conversion of this technology into highly integrated (and thus power- and c o s t - e ffective) devices. T h i r d P a r t y P a r t n e r s h i p s Strategic partnerships are necessary to complement i n t e rnal capabilities and re s o u rces. VLSI has a secure and credible history in forming and maintaining these relationships. Complementing the long-standing relationship with Wavecom for the GSM module solution, the Debis GSM protocol software has been fully integrated onto the VLSI OneC platform, now available for Type Approval. The full feature set for voice and handwriting recognition from ART is also implemented and is available in OneC-based pro d u c t s . For CDMA, VLSI and Dot Wi reless offer a complete s o f t w a re foundation and protocol stack that support s both CDMA and AMPS modes. Dot Wi reless also offers a complete CDMA transceiver re f e rence design.
  8. 8. The 3G challenge to phone manufacturers will be to develop consumer products featuring not only wire l e s s t e c h n o l o g y, but also a wide range of emerg i n g technologies in communication and computing as well as security and location. The convergence of multiple technologies and services will be the driver of future communications markets. The Road to 3G V L S I ’s Velocity design methodology, combined with a range of target market platforms, such as the Ve l o c i t y S t a n d a rd Communication Platform, provides a secure evolution path to real 3rd generation consumer p roducts: consumer products which are competitive in t e rms of cost and perf o rmance with today’s wire l e s s t e rminals, and thus will meet the consumer’s future p roduct expectations. VLSI is the only vendor providing CDMA as well as GSM p roducts to today’s market, and this positions VLSI ideally to develop the emerging Third Generation w i reless technologies UMTS, W-CDMA, and CDMA-2000 (IS-95C). Velocity SCP combines VLSI’s GSM and CDMA e x p e rtise to provide the industry with low-risk and cost- e ffective future 3G solutions. V L S I ’s unique technology and capability portfolio make us the ideal partner for industry players wishing to achieve a competitive advantage on the route toward s the third generation of new wireless standards and c o n v e rging technologies. Call the VLSI office nearest you today for our Cellular family information kit. Worldwide Headquart e r s : + 1- 4 0 8 / 4 3 4 - 3 1 0 0 E u ropean Headquart e r s : + 49/89/627 06-0 Japan Headquart e r s : + 81/3/5454-3800 Asian Headquart e r s : + 886/2/2719-5466 or visit us at w w w .vlsi.com on the web.
  9. 9. A d d r e s s e s N o rth American Headquarters VLSI Te c h n o l o g y, Inc. 1109 McKay Drive San Jose, CA 95131 USA Te l . +1- 4 0 8 / 4 3 4 - 3 1 0 0 F a x +1- 4 0 8 /4 74 - 5 0 9 7 E u ropean Headquart e r s VLSI Technology GmbH B a y e r waldstrasse 11 D-81737 Munich GERMANY Te l . +49/89/627 06-0 F a x +49/89/627 06-101 Asian Headquarters VLSI Te c h n o l o g y 15 Floor, Suite C, No 170 Tun Hwa Nor th Road (Hong Tai Worldwide Bldg.) Taipei, TA I WAN R.O.C. Te l . + 8 8 6 / 2 / 2 7 1 9 / 5 4 6 6 Fax +886/2/2718/3204 For more information and product bulletins on all Wi reless products, visit the VLSI web page, Japan Headquar ters VLSI Te c h n o l o g y, K.K. h t t p : / / w w w. v l s i . c o m . Nikko-Motoyoyogi Bldg. 1F 30 – 13 Motoyoyogi cho OneC, CDMA+, Ve l o c i t y, Standard Communication Platform, FSB, System-Level Silicon, HDLi, Shibu ya-ku, Tokyo 105 O a k + D S P C o re, and JumpStartX E a re trademarks of VLSI Te c h n o l o g y. All other trademarks and Japan Te l . + 8 1 / 3 / 5 4 5 4 - 3 8 0 0 re g i s t e red trademarks are the pro p e rty of their respective holders and should be treated as such. Fax +81/3/5454-3801 ©1999 VLSI Te c h n o l o g y, Inc. Printed in U.S.A. FLYER-CELLULAR-3/99 V. 1 . 0

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