FLASH MEMORY

385 views

Published on

0 Comments
0 Likes
Statistics
Notes
  • Be the first to comment

  • Be the first to like this

No Downloads
Views
Total views
385
On SlideShare
0
From Embeds
0
Number of Embeds
2
Actions
Shares
0
Downloads
6
Comments
0
Likes
0
Embeds 0
No embeds

No notes for slide

FLASH MEMORY

  1. 1. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Document Title 64M x 8 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial issue. Apr. 24th 2004 Advance 0.1 1. Note 1 ( Program/Erase Characteristics) is added( page 14 ) Oct. 11th.2004 Preliminary 2. NAND Flash Technical Notes is changed. -Invalid block -> initial invalid block ( page 16 ) -Error in write or read operation ( page 17 ) -Program Flow Chart ( page 17 ) 3. Vcc range is changed -2.4V~2.9V -> 2.5V~2.9V -1.7V~1.95V ->1.65V~1.95V 4. Multi plane operation and Copy-Back Program are not supported with 1.8V device. 0.2 1. Icc 15mA -> 20mA for 1.8V device Apr. 22nd. 2005 0.3 1. The flow chart to creat the initial invalid block table is changed. May. 6th. 2005 Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site. http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near you. 1
  2. 2. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY 64M x 8 Bit NAND Flash Memory PRODUCT LIST Part Number Vcc Range PKG Type K9F1208R0B-G,J 1.65 ~ 1.95V FBGA K9F1208B0B-Y,P TSOP1 2.5 ~ 2.9V K9F1208B0B-G,J FBGA K9F1208U0B-Y,P TSOP1 K9F1208U0B-G,J 2.7 ~ 3.6V FBGA K9F1208U0B-V,F WSOP1 FEATURES • Voltage Supply • Fast Write Cycle Time - 1.8V device(K9F1208R0B) : 1.65~1.95V - Program time : 200µs(Typ.) - 2.7V device(K9F1208B0B) : 2.5~2.9V - Block Erase Time : 2ms(Typ.) - 3.3V device(K9F1208U0B) : 2.7 ~ 3.6 V • Command/Address/Data Multiplexed I/O Port • Organization • Hardware Data Protection - Memory Cell Array : (64M + 2048K)bit x 8 bit - Program/Erase Lockout During Power Transitions - Data Register : (512 + 16)bit x 8bit • Reliable CMOS Floating-Gate Technology • Automatic Program and Erase - Endurance : 100K Program/Erase Cycles - Page Program : (512 + 16)Byte - Data Retention : 10 Years - Block Erase : (16K + 512)Byte • Command Register Operation • Page Read Operation • Intelligent Copy-Back - Page Size : (512 + 16)Byte • Unique ID for Copyright Protection - Random Access : 15µs(Max.) • Package - Serial Page Access : 50ns(Min.) - K9F1208X0B-YCB0/YIB0 (*K9F1208R0B : tRC = 60ns(Min.)) 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch) - K9F1208X0B-GCB0/GIB0 63- Ball FBGA (8.5 x 13 , 1.0 mm width) - K9F1208U0B-VCB0/VIB0 48 - Pin WSOP I (12X17X0.7mm) - K9F1208X0B-PCB0/PIB0 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)- Pb-free Package - K9F1208X0B-JCB0/JIB0 63- Ball FBGA - Pb-free Package - K9F1208U0B-FCB0/FIB0 48 - Pin WSOP I (12X17X0.7mm)- Pb-free Package * K9F1208U0B-V,F(WSOPI ) is the same device as K9F1208U0B-Y,P(TSOP1) except package type. GENERAL DESCRIPTION Offered in 64Mx8bit the K9F1208X0B is 512M bit with spare 16M bit capacity. The device is offered in 1.8V, 2.7V, 3.3V Vcc. Its NAND cell provides the most cost-effective solutIon for the solid state mass storage market. A program operation can be performed in typical 200µs on the 528-byte page and an erase operation can be performed in typical 2ms on a 16K-byte block. Data in the page can be read out at 50ns(K9F1208R0B : 60ns) cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write control automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F1208X0B′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F1208X0B is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable appli- cations requiring non-volatility. 2
  3. 3. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY PIN CONFIGURATION (TSOP1) K9F1208U0B-YCB0,PCB0/YIB0,PIB0 N.C 1 48 N.C N.C 2 47 N.C N.C 3 46 N.C N.C 4 45 N.C N.C 5 44 I/O7 N.C 6 43 I/O6 R/B 7 42 I/O5 RE 8 41 I/O4 CE 9 40 N.C N.C 10 39 N.C N.C 11 38 N.C Vcc 12 37 Vcc Vss 13 36 Vss N.C 14 35 N.C N.C 15 34 N.C CLE 16 33 N.C ALE 17 32 I/O3 WE 18 31 I/O2 WP 19 30 I/O1 N.C 20 29 I/O0 N.C 21 28 N.C N.C 22 27 N.C N.C 23 26 N.C N.C 24 25 N.C PACKAGE DIMENSIONS 48-PIN LEAD/LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I) 48 - TSOP1 - 1220F Unit :mm/Inch MAX 20.00±0.20 0.004 0.10 0.787±0.008 +0.07 0.20 -0.03 #1 #48 ( 0.25 ) 0.010 +0.003 0.008-0.001 +0.07 0.16 -0.03 0.488 MAX 12.00 0.472 12.40 0.0197 0.50 #24 #25 1.00±0.05 0.05 0.039±0.002 0.002 MIN 1.20 0.010 TYP 18.40±0.10 0.047MAX +0.075 0.125 0.035 +0.003 0.005-0.001 0.724±0.004 0.25 0~8° 0.45~0.75 0.018~0.030 ( 0.50 ) 0.020 3
  4. 4. Package Dimensions FLASH MEMORY PIN CONFIGURATION (WSOP1) K9F1208U0B-VCB0,FCB0/VIB0,FIB0 N.C 1 48 N.C N.C 2 47 N.C DNU 3 46 DNU N.C 4 45 N.C N.C 5 44 I/O7 N.C 6 43 I/O6 R/B 7 42 I/O5 RE 8 41 I/O4 CE 9 40 N.C DNU 10 39 DNU N.C 11 38 N.C Vcc 12 37 Vcc Vss 13 36 Vss N.C 14 35 N.C DNU 15 34 DNU CLE 16 33 N.C ALE 17 32 I/O3 WE 18 31 I/O2 WP 19 30 I/O1 N.C 20 29 I/O0 N.C 21 28 N.C DNU 22 27 DNU N.C 23 26 N.C N.C 24 25 N.C PACKAGE DIMENSIONS 48-PIN LEAD PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE (I) 48 - WSOP1 - 1217F Unit :mm 0.70 MAX 0.58±0.04 15.40±0.10 #1 #48 +0.07 -0.03 0.16 +0.07 -0.03 12.40MAX 12.00±0.10 0.20 (0.50±0.06) 0.50TYP #24 #25 (0.01Min) 0.10 +0.075 -0.035 0°~ 8° 0.45~0.75 17.00±0.20 4
  5. 5. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY PIN CONFIGURATION (FBGA) K9F1208X0B-GCB0,JCB0/GIB0,JIB0 1 2 3 4 5 6 N.C N.C N.C N.C N.C N.C N.C A /WP ALE Vss /CE /WE R/B B NC /RE CLE NC NC NC C NC NC NC NC NC NC D NC NC NC NC NC NC E NC NC NC NC NC NC F NC I/O0 NC NC NC Vcc G NC I/O1 NC VccQ I/O5 I/O7 H Vss I/O2 I/O3 I/O4 I/O6 Vss N.C N.C N.C N.C N.C N.C N.C N.C Top View 5
  6. 6. Package Dimensions FLASH MEMORY 63-Ball FBGA (measured in millimeters) Top View Bottom View #A1 INDEX MARK(OPTIONAL) 8.50±0.10 A 0.80 x 9= 7.20 0.80 x 5= 4.00 8.50±0.10 0.80 B 6 5 4 3 2 1 #A1 (Datum A) 0.80 A B (Datum B) C 0.80 x 11= 8.80 0.80 x 7= 5.60 13.00±0.10 13.00±0.10 D E F 2.80 G H 63-∅0.45±0.05 ∅ 0.20 M A B 2.00 Side View 1.00(Max.) 0.25(Min.) 13.00±0.10 0.10MAX 0.45±0.05 6
  7. 7. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY PIN DESCRIPTION Pin Name Pin Function I/O0 ~ I/O7 DATA INPUTS/OUTPUTS (K9F1208X0B) The I/O pins are used to input command, address and data, and to output data during read operations. The I/ O pins float to high-z when the chip is deselected or when the outputs are disabled. COMMAND LATCH ENABLE CLE The CLE input controls the activating path for commands sent to the command register. When active high, commands are latched into the command register through the I/O ports on the rising edge of the WE signal. ADDRESS LATCH ENABLE ALE The ALE input controls the activating path for address to the internal address registers. Addresses are latched on the rising edge of WE with ALE high. CHIP ENABLE The CE input is the device selection control. When the device is in the Busy state, CE high is ignored, and CE the device does not return to standby mode in program or erase operation. Regarding CE control during read operation, refer to ’Page read’ section of Device operation . READ ENABLE RE The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid tREA after the falling edge of RE which also increments the internal column address counter by one. WRITE ENABLE WE The WE input controls writes to the I/O port. Commands, address and data are latched on the rising edge of the WE pulse. WRITE PROTECT WP The WP pin provides inadvertent write/erase protection during power transitions. The internal high voltage generator is reset when the WP pin is active low. READY/BUSY OUTPUT The R/B output indicates the status of the device operation. When low, it indicates that a program, erase or R/B random read operation is in process and returns to high state upon completion. It is an open drain output and does not float to high-z condition when the chip is deselected or when outputs are disabled. OUTPUT BUFFER POWER VccQ VccQ is the power supply for Output Buffer. VccQ is internally connected to Vcc, thus should be biased to Vcc. POWER Vcc VCC is the power supply for device. Vss GROUND NO CONNECTION N.C Lead is not internally connected. DO NOT USE DNU Leave it disconnected. NOTE : Connect all VCC and VSS pins of each device to common power supply outputs. Do not leave VCC or VSS disconnected. 7
  8. 8. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Figure 1-1. K9F1208X0B FUNCTIONAL BLOCK DIAGRAM VCC VSS A9 - A25 X-Buffers Latches 512M + 16M Bit & Decoders NAND Flash ARRAY A0 - A7 Y-Buffers Latches & Decoders (512 + 16)Byte x 131072 Page Register & S/A A8 Y-Gating Command Command Register I/O Buffers & Latches VCC/VCCQ VSS CE Control Logic RE & High Voltage I/0 0 WE Generator Global Buffers Output Driver I/0 7 CLE ALE WP Figure 2-1. K9F1208X0B ARRAY ORGANIZATION 1 Block =32 Pages = (16K + 512) Byte 1 Page = 528 Byte 1 Block = 528 Byte x 32 Pages 128K Pages = (16K + 512) Byte 1st half Page Register 2nd half Page Register (=4,096 Blocks) (=256 Bytes) 1 Device = 528Bytes x 32Pages x 4096 Blocks (=256 Bytes) = 528 Mbits 8 bit 512Byte 16 Byte I/O 0 ~ I/O 7 Page Register 512 Byte 16 Byte I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 1st Cycle A0 A1 A2 A3 A4 A5 A6 A7 Column Address 2nd Cycle A9 A10 A11 A12 A13 A14 A15 A16 Row Address (Page Address) 3rd Cycle A17 A18 A19 A20 A21 A22 A23 A24 4th Cycle A25 *L *L *L *L *L *L *L NOTE : Column Address : Starting Address of the Register. 00h Command(Read) : Defines the starting address of the 1st half of the register. 01h Command(Read) : Defines the starting address of the 2nd half of the register. * A8 is set to "Low" or "High" by the 00h or 01h Command. * L must be set to "Low". * The device ignores any additional input of address cycles than reguired. 8
  9. 9. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Product Introduction The K9F1208X0B is a 528Mbit(553,648,218 bit) memory organized as 131,072 rows(pages) by 528 columns. Spare sixteen columns are located from column address of 512 to 527. A 528-byte data register is connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each of the 16 cells resides in a different page. A block consists of two NAND structured strings. A NAND structure consists of 16 cells. Total 135168 NAND cells reside in a block. The array organization is shown in Figure 2. The program and read operations are executed on a page basis, while the erase operation is executed on a block basis. The memory array consists of 4,096 separately erasable 16K-byte blocks. It indicates that the bit by bit erase operation is pro- hibited on the K9F1208X0B. The K9F1208X0B has addresses multiplexed into 8 I/O's. This scheme dramatically reduces pin counts and allows systems upgrades to future densities by maintaining consistency in system board design. Command, address and data are all written through I/O's by bringing WE to low while CE is low. Data is latched on the rising edge of WE. Command Latch Enable(CLE) and Address Latch Enable(ALE) are used to multiplex command and address respectively, via the I/O pins. The 64M byte physical space requires 26 addresses, thereby requiring four cycles for byte-level addressing: column address, low row address and high row address, in that order. Page Read and Page Program need the same four address cycles following the required command input. In Block Erase oper- ation, however, only the three row address cycles are used. Device operations are selected by writing specific commands into the command register. Table 1 defines the specific commands of the K9F1208X0B. The device provides simultaneous program/erase capability up to four pages/blocks. By dividing the memory array into four 128Mbit separate planes, simultaneous multi-plane operation dramatically increases program/erase performance by 4X while still maintaining the conventional 512 byte structure. The extended pass/fail status for multi-plane program/erase allows system software to quickly identify the failing page/block out of selected multiple pages/blocks. Usage of multi-plane operations will be described further throughout this document. In addition to the enhanced architecture and interface, the device incorporates copy-back program feature from one page to another of the same plane without the need for transporting the data to and from the external buffer memory. Since the time-consuming burst- reading and data-input cycles are removed, system performance for solid-state disk application is significantly increased. The device includes one block sized OTP(One Time Programmable), which can be used to increase system security or to provide identification capabilities. Detailed information can be obtained by contact with Samsung. Table 1. Command Sets Acceptable Command Function 1st. Cycle 2nd. Cycle 3rd. Cycle during Busy Read 1 00h/01h(1) - - Read 2 50h - - Read ID 90h - - Reset FFh - - O Page Program (True) (2) 80h 10h - Page Program (Dummy)(2) 80h 11h - Copy-Back Program(True) (2) 00h 8Ah 10h Copy-Back Program(Dummy)(2) 03h 8Ah 11h Block Erase 60h D0h - Multi-Plane Block Erase 60h----60h D0h - Read Status 70h - - O Read Multi-Plane Status 71h (3) - - O NOTE : 1. The 00h command defines starting address of the 1st half of registers. The 01h command defines starting address of the 2nd half of registers. After data access on the 2nd half of register by the 01h command, the status pointer is automatically moved to the 1st half register(00h) on the next cycle. 2. Page Program(True) and Copy-Back Program(True) are available on 1 plane operation. Page Program(Dummy) and Copy-Back Program(Dummy) are available on the 2nd,3rd,4th plane of multi plane operation. 3. The 71h command should be used for read status of Multi Plane operation. 4. Multi plane operation and Copy-Back Program are not supported with 1.8V device. Caution : Any undefined command inputs are prohibited except for above command set of Table 1. 9
  10. 10. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Memory Map The device is arranged in four 128Mbit memory planes. Each plane contains 1,024 blocks and 528 byte page registers. This allows it to perform simultaneous page program and block erase by selecting one page or block from each plane. The block address map is configured so that multi-plane program/erase operations can be executed for every four sequential blocks. Figure 3. Memory Array Map Plane 0 Plane 1 Plane 2 Plane 3 (1024 Block) (1024 Block) (1024 Block) (1024 Block) Block 0 Block 1 Block 2 Block 3 Page 0 Page 0 Page 0 Page 0 Page 1 Page 1 Page 1 Page 1 Page 30 Page 30 Page 30 Page 30 Page 31 Page 31 Page 31 Page 31 Block 4 Block 5 Block 6 Block 7 Page 0 Page 0 Page 0 Page 0 Page 1 Page 1 Page 1 Page 1 Page 30 Page 30 Page 30 Page 30 Page 31 Page 31 Page 31 Page 31 Block 4088 Block 4089 Block 4090 Block 4091 Page 0 Page 0 Page 0 Page 0 Page 1 Page 1 Page 1 Page 1 Page 30 Page 30 Page 30 Page 30 Page 31 Page 31 Page 31 Page 31 Block 4092 Block 4093 Block 4094 Block 4095 Page 0 Page 0 Page 0 Page 0 Page 1 Page 1 Page 1 Page 1 Page 30 Page 30 Page 30 Page 30 Page 31 Page 31 Page 31 Page 31 528byte Page Registers 528byte Page Registers 528byte Page Registers 528byte Page Registers 10
  11. 11. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY ABSOLUTE MAXIMUM RATINGS Rating Parameter Symbol Unit 1.8V DEVICE 3.3V/2.7V DEVICE VIN/OUT -0.6 to + 2.45 -0.6 to + 4.6 Voltage on any pin relative to VSS VCC -0.2 to + 2.45 -0.6 to + 4.6 V VCCQ -0.2 to + 2.45 -0.6 to + 4.6 K9F1208X0B-XCB0 -10 to +125 Temperature Under Bias TBIAS °C K9F1208X0B-XIB0 -40 to +125 K9F1208X0B-XCB0 Storage Temperature TSTG -65 to +150 °C K9F1208X0B-XIB0 Short Circuit Current Ios 5 mA NOTE : 1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns. Maximum DC voltage on input/output pins is VCC,+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns. 2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability. RECOMMENDED OPERATING CONDITIONS (Voltage reference to GND, K9F1208X0B-XCB0 :TA=0 to 70°C, K9F1208X0B-XIB0:TA=-40 to 85°C) K9F1208R0B(1.8V) K9F1208B0B(2.7V) K9F1208U0B(3.3V) Parameter Symbol Unit Min Typ. Max Min Typ. Max Min Typ. Max Supply Voltage VCC 1.65 1.8 1.95 2.5 2.7 2.9 2.7 3.3 3.6 V Supply Voltage VCCQ 1.65 1.8 1.95 2.5 2.7 2.9 2.7 3.3 3.6 V Supply Voltage VSS 0 0 0 0 0 0 0 0 0 V 11
  12. 12. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY DC AND OPERATING CHARACTERISTICS(Recommended operating conditions otherwise noted.) K9F1208X0B Unit Parameter Symbol Test Conditions 1.8V 2.7V 3.3V Min Typ Max Min Typ Max Min Typ Max tRC=50ns (K9F1208R0B : 60ns), Sequential Read ICC1 - 8 20 - 10 20 - 10 20 Operating CE=VIL Current IOUT=0mA mA Program ICC2 - - 8 20 - 10 20 - 10 20 Erase ICC3 - - 8 20 - 10 20 - 10 20 Stand-by Current(TTL) ISB1 CE=VIH, WP=0V/VCC - - 1 - - 1 - - 1 Stand-by Current(CMOS) ISB2 CE=VCC-0.2, WP=0V/VCC - 10 50 - 10 50 - 10 50 Input Leakage Current ILI VIN=0 to Vcc(max) - - ±10 - - ±10 - - ±10 µA Output Leakage Current ILO VOUT=0 to Vcc(max) - - ±10 - - ±10 - - ±10 VCCQ VCCQ VCCQ VCCQ VCCQ I/O pins - - 2.0 - -0.4 +0.3 -0.4 +0.3 +0.3 Input High Voltage VIH* VCC VCC VCC VCC VCC Except I/O pins - - 2.0 - -0.4 +0.3 -0.4 +0.3 +0.3 Input Low Voltage, All VIL* - -0.3 - 0.4 -0.3 - 0.5 -0.3 - 0.8 inputs V K9F1208R0B :IOH=-100µA VCCQ VCCQ Output High Voltage Level VOH K9F1208B0B :IOH=-100µA - - - - 2.4 - - -0.1 -0.4 K9F1208U0B :IOH=-400µA K9F1208R0B :IOL=100uA Output Low Voltage Level VOL K9F1208B0B :IOL=100µA - - 0.1 - - 0.4 - - 0.4 K9F1208U0B :IOL=2.1mA K9F1208R0B :VOL=0.1V Output Low Current(R/B) IOL(R/B) K9F1208B0B :VOL=0.1V 3 4 - 3 4 - 8 10 - mA K9F1208U0B :VOL=0.4V NOTE : VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for durations of 20 ns or less. 12
  13. 13. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY VALID BLOCK Parameter Symbol Min Typ. Max Unit Valid Block Number NVB 4,026 - 4,096 Blocks NOTE : 1. The device may include invalid blocks when first shipped. Additional invalid blocks may develop while being used. The number of valid blocks is pre- sented with both cases of invalid blocks considered. Invalid blocks are defined as blocks that contain one or more bad bits. Do not erase or program factory-marked bad blocks. Refer to the attached technical notes for a appropriate management of invalid blocks. 2. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block, does not require Error Correction up to 1K program/erase cycles. 3. Minimum 1004 valid blocks are guaranteed for each contiguous 128Mb memory space. AC TEST CONDITION (K9F1208X0B-XCB0 :TA=0 to 70°C, K9F1208X0B-XIB0:TA=-40 to 85°C K9F1208R0B : Vcc=1.65V~1.95V , K9F1208B0B : Vcc=2.5V~2.9V , K9F1208U0B : Vcc=2.7V~3.6V unless otherwise noted) Parameter K9F1208R0B K9F1208B0B K9F1208U0B Input Pulse Levels 0V to VccQ 0V to VccQ 0.4V to 2.4V Input Rise and Fall Times 5ns 5ns 5ns Input and Output Timing Levels VccQ/2 VccQ/2 1.5V K9F1208R0B:Output Load (VccQ:1.8V +/-10%) K9F1208B0B:Output Load (VccQ:2.7V +/-10%) 1 TTL GATE and CL=30pF 1 TTL GATE and CL=30pF 1 TTL GATE and CL=50pF K9F1208U0B:Output Load (VccQ:3.0V +/-10%) K9F1208U0B:Output Load (VccQ:3.3V +/-10%) - - 1 TTL GATE and CL=100pF CAPACITANCE(TA=25°C, VCC=1.8V/2.7V/3.3V, f=1.0MHz) Item Symbol Test Condition Min Max Unit Input/Output Capacitance CI/O VIL=0V - 10 pF Input Capacitance CIN VIN=0V - 10 pF NOTE : Capacitance is periodically sampled and not 100% tested. MODE SELECTION CLE ALE CE WE RE WP Mode H L L H X Command Input Read Mode L H L H X Address Input(4clock) H L L H H Command Input Write Mode L H L H H Address Input(4clock) L L L H H Data Input L L L H X Data Output L L L H H X During Read(Busy) on K9F1208X0B-Y,P or K9F1208U0B-V,F During Read(Busy) on the devices except K9F1208X0B-Y,P and X X X X H X K9F1208U0B-V,F X X X X X H During Program(Busy) X X X X X H During Erase(Busy) X X(1) X X X L Write Protect X X H X X 0V/VCC (2) Stand-by NOTE : 1. X can be VIL or VIH. 2. WP should be biased to CMOS high or CMOS low for standby. 13
  14. 14. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY PROGRAM / ERASE CHARACTERISTICS Parameter Symbol Min Typ Max Unit Program Time tPROG (1) - 200 500 µs Dummy Busy Time for Multi Plane Program tDBSY 1 10 µs Number of Partial Program Cycles Main Array - - 1 cycle Nop in the Same Page Spare Array - - 2 cycles Block Erase Time tBERS - 2 3 ms NOTE : 1.Typical program time is defined as the time within more than 50% of the whole pages are programmed at Vcc of 3.3V and 25’C AC TIMING CHARACTERISTICS FOR COMMAND / ADDRESS / DATA INPUT Min Max Parameter Symbol Unit 1.8V 2.7V 3.3V 1.8V 2.7V 3.3V CLE setup Time tCLS 0 0 0 - - - ns CLE Hold Time tCLH 10 10 10 - - - ns CE setup Time tCS 0 0 0 - - - ns CE Hold Time tCH 10 10 10 - - - ns WE Pulse Width t WP(1) 40 25 25 - - - ns ALE setup Time tALS 0 0 0 - - - ns ALE Hold Time tALH 10 10 10 - - - ns Data setup Time tDS 20 20 20 - - - ns Data Hold Time tDH 10 10 10 - - - ns Write Cycle Time tWC 60 45 45 - - - ns WE High Hold Time tWH 20 15 15 - - - ns NOTE: 1. If tCS is set less than 10ns, tWP must be minimum 35ns, otherwise, tWP may be minimum 25ns. 2. TBD means "To Be Determinded". 14
  15. 15. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY AC CHARACTERISTICS FOR OPERATION Min Max Parameter Symbol Unit 1.8V 2.7V 3.3V 1.8V 2.7V 3.3V Data Transfer from Cell to Register tR - - - 15 15 15 µs ALE to RE Delay tAR 10 10 10 - - - ns CLE to RE Delay tCLR 10 10 10 - - - ns Ready to RE Low tRR 20 20 20 - - - ns RE Pulse Width tRP 40 25 25 - - - ns WE High to Busy tWB - - - 100 100 100 ns Read Cycle Time tRC 60 50 50 - - - ns RE Access Time tREA - - - 40 30 30 ns CE Access Time tCEA - - - 55 45 45 ns RE High to Output Hi-Z tRHZ - - - 30 30 30 ns CE High to Output Hi-Z tCHZ - - - 20 20 20 ns RE or CE High to Output hold tOH 15 15 15 - - - ns RE High Hold Time tREH 20 15 15 - - - ns Output Hi-Z to RE Low tIR 0 0 0 - - - ns WE High to RE Low tWHR 60 60 60 - - - ns Device resetting time(Read/Program/Erase) tRST - - - 5/10/500(1) 5/10/500(1) 5/10/500(1) µs Parameter Symbol Min Max Unit Last RE High to Busy(at sequential read) tRB - 100 ns K9F1208X0B- CE High to Ready(in case of interception by CE at read) tCRY - 50 +tr(R/B) (3) ns Y,V,P,F only CE High Hold Time(at the last serial read) (2) tCEH 100 - ns NOTE: 1. If reset command(FFh) is written at Ready state, the device goes into Busy for maximum 5us. 2. To break the sequential read cycle, CE must be held high for longer time than tCEH. 3. The time to Ready depends on the value of the pull-up resistor tied R/B pin.ting time. 4. TBD means "To Be Determinded". 15
  16. 16. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY NAND Flash Technical Notes Initial Invalid Block(s) Initial invalid blocks are defined as blocks that contain one or more initial invalid bits whose reliability is not guaranteed by Samsung. The information regarding the initial invalid block(s) is so called as the initial invalid block information. Devices with initial invalid block(s) have the same quality level as devices with all valid blocks and have the same AC and DC characteristics. An initial invalid block(s) does not affect the performance of valid block(s) because it is isolated from the bit line and the common source line by a select transistor. The system design must be able to mask out the initial invalid block(s) via address mapping. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block, does not require Error Correction up to 1K program/erase cycles. Identifying Initial Invalid Block(s) All device locations are erased(FFh) except locations where the initial invalid block(s) information is written prior to shipping. The initial invalid block(s) status is defined by the 6th byte in the spare area. Samsung makes sure that either the 1st or 2nd page of every initial invalid block has non-FFh data at the column address of 517. Since the initial invalid block information is also erasable in most cases, it is impossible to recover the information once it has been erased. Therefore, the system must be able to recognize the initial invalid block(s) based on the initial invalid block information and create the initial invalid block table via the following sug- gested flow chart(Figure 4). Any intentional erasure of the initial invalid block information is prohibited. Start Set Block Address = 0 Increment Block Address Check "FFh" at the column address * 517 of the 1st and 2nd page in the block Create (or update) No Check "FFh" ? Initial Invalid Block(s) Table Yes No Last Block ? Yes End Figure 4. Flow chart to create initial invalid block table. 16
  17. 17. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY NAND Flash Technical Notes (Continued) Error in write or read operation Within its life time, the additional invalid blocks may develop with NAND Flash memory. Refer to the qualification report for the block failure rete.The following possible failure modes should be considered to implement a highly reliable system. In the case of status read failure after erase or program, block replacement should be done. Because program status fail during a page program does not affect the data of the other pages in the same block, block replacement can be executed with a page-sized buffer by finding an erased empty block and reprogramming the current target data and copying the rest of the replaced block. In case of Read, ECC must be employed. To improve the efficiency of memory space, it is recommended that the read failure due to single bit error should be reclaimed by ECC without any block replacement. The block failure rate in thequalification report does not include those reclaimed blocks. Failure Mode Detection and Countermeasure sequence Erase Failure Status Read after Erase --> Block Replacement Write Program Failure Status Read after Program --> Block Replacement Read Single Bit Failure Verify ECC -> ECC Correction ECC : Error Correcting Code --> Hamming Code etc. Example) 1bit correction & 2bit detection Program Flow Chart Start Write 80h Write Address Write Data Write 10h Read Status Register I/O 6 = 1 ? No or R/B = 1 ? Yes * No Program Error I/O 0 = 0 ? Yes Program Completed * : If program operation results in an error, map out the block including the page in error and copy the target data to another block. 17
  18. 18. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY NAND Flash Technical Notes (Continued) Erase Flow Chart Read Flow Chart Start Start Write 60h Write 00h Write Block Address Write Address Write D0h Read Data Read Status Register ECC Generation I/O 6 = 1 ? No No or R/B = 1 ? Reclaim the Error Verify ECC Yes Yes * No Page Read Completed Erase Error I/O 0 = 0 ? Yes Erase Completed * : If erase operation results in an error, map out the failing block and replace it with another block. Block Replacement Block A 1st { ∼ (n-1)th 2 nth an error occurs. (page) Buffer memory of the controller. Block B 1st { 1 ∼ (n-1)th nth (page) * Step1 When an error happens in the nth page of the Block ’A’ during erase or program operation. * Step2 Copy the nth page data of the Block ’A’ in the buffer memory to the nth page of another free block. (Block ’B’) * Step3 Then, copy the data in the 1st ~ (n-1)th page to the same location of the Block ’B’. * Step4 Do not further erase Block ’A’ by creating an ’invalid Block’ table or other appropriate scheme. 18
  19. 19. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Pointer Operation of K9F1208X0B Samsung NAND Flash has three address pointer commands as a substitute for the two most significant column addresses. ’00h’ command sets the pointer to ’A’ area(0~255byte), ’01h’ command sets the pointer to ’B’ area(256~511byte), and ’50h’ command sets the pointer to ’C’ area(512~527byte). With these commands, the starting column address can be set to any of a whole page(0~527byte). ’00h’ or ’50h’ is sustained until another address pointer command is inputted. ’01h’ command, however, is effective only for one operation. After any operation of Read, Program, Erase, Reset, Power_Up is executed once with ’01h’ command, the address pointer returns to ’A’ area by itself. To program data starting from ’A’ or ’C’ area, ’00h’ or ’50h’ command must be inputted before ’80h’ command is written. A complete read operation prior to ’80h’ command is not necessary. To program data starting from ’B’ area, ’01h’ command must be inputted right before ’80h’ command is written. Table 2. Destination of the pointer Command Pointer position Area "A" area "B" area "C" area (00h plane) (01h plane) (50h plane) 00h 0 ~ 255 byte 1st half array(A) 01h 256 ~ 511 byte 2nd half array(B) 256 Byte 256 Byte 16 Byte 50h 512 ~ 527 byte spare array(C) "A" "B" "C" Internal Page Register Pointer select commnad Pointer (00h, 01h, 50h) Figure 5. Block Diagram of Pointer Operation (1) Command input sequence for programming ’A’ area The address pointer is set to ’A’ area(0~255), and sustained Address / Data input Address / Data input 00h 80h 10h 00h 80h 10h ’A’,’B’,’C’ area can be programmed. ’00h’ command can be omitted. It depends on how many data are inputted. (2) Command input sequence for programming ’B’ area The address pointer is set to ’B’ area(256~511), and will be reset to ’A’ area after every program operation is executed. Address / Data input Address / Data input 01h 80h 10h 01h 80h 10h ’B’, ’C’ area can be programmed. ’01h’ command must be rewritten before It depends on how many data are inputted. every program operation (3) Command input sequence for programming ’C’ area The address pointer is set to ’C’ area(512~527), and sustained Address / Data input Address / Data input 50h 80h 10h 50h 80h 10h Only ’C’ area can be programmed. ’50h’ command can be omitted. 19
  20. 20. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY System Interface Using CE don’t-care. For an easier system interface, CE may be inactive during the data-loading or sequential data-reading as shown below. The internal 528byte page registers are utilized as separate buffers for this operation and the system design gets more flexible. In addition, for voice or audio applications which use slow cycle time on the order of u-seconds, de-activating CE during the data-loading and reading would provide significant savings in power consumption. Figure 7. Program Operation with CE don’t-care. CLE CE don’t-care CE ≈ ≈ WE ALE 80h Start Add.(4Cycle) Data Input Data Input 10h I/OX tCS tCH tCEA CE CE tREA tWP RE WE I/OX out Figure 8. Read Operation with CE don’t-care. CLE On K9F1208X0B-Y,P or K9F1208X0B-V,F CE must be held low during tR CE don’t-care CE ≈ RE ALE R/B tR WE I/OX 00h Start Add.(4Cycle) Data Output(sequential) 20
  21. 21. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY I/O DATA Device I/Ox Data In/Out K9F1208X0B I/O 0 ~ I/O 7 ~528byte Command Latch Cycle CLE tCLS tCLH tCS tCH CE tWP WE tALS tALH ALE tDS tDH I/OX Command Address Latch Cycle tCLS CLE tCS tWC tWC tWC CE tWP tWP tWP tWP WE tWH tWH tWH tALH tALS tALH tALS tALH tALS tALH tALS ALE tDH tDH tDH tDH tDS tDS tDS tDS I/OX A0~A7 A9~A16 A17~A24 A25 21
  22. 22. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Input Data Latch Cycle tCLH CLE tCH CE tALS tWC ALE tWP tWP tWP ≈ WE tWH tDH tDH tDH tDS tDS tDS I/Ox DIN 0 DIN 1 ≈ ≈ DIN n Serial access Cycle after Read(CLE=L, WE=H, ALE=L) CE tRC ≈ tCHZ* tREH tREA tREA tREA tOH ≈ RE tRHZ* tRHZ* tOH I/Ox Dout Dout Dout ≈ tRR ≈ R/B NOTES : Transition is measured ±200mV from steady state voltage with load. This parameter is sampled and not 100% tested. 22
  23. 23. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Status Read Cycle tCLR CLE tCLS tCLH tCS CE tCH tWP WE tCEA tCHZ tWHR tOH RE tDH tREA tRHZ tDS tIR tOH I/OX 70h Status Output READ1 OPERATION (READ ONE PAGE) CLE 1) On K9F1208X0B-Y,P or K9F1208X0B-V,F tCEH ≈ ≈ CE must be held CE low during tR tCHZ tWC tOH ≈ WE tWB tCRY tAR ≈ ≈ ALE tRHZ tR tRC tOH ≈ RE N Address ≈ tRR ≈ ≈ ≈ I/OX 00h or 01h A0 ~ A7 A9 ~ A16 A17 ~ A24 A25 Dout N Dout N+1 Dout N+2 Dout m 1) Column Page(Row) tRB Address Address Busy R/B 1) ≈ X8 device : m = 528 , Read CMD = 00h or 01h NOTES : 1) is only valid on K9F1208X0B-Y,P or K9F1208X0B-V,F 23
  24. 24. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Read1 Operation (Intercepted by CE) CLE On K9F1208X0B-Y,P or K9F1208X0B-V,F ≈ ≈ CE must be held CE low during tR ≈ WE tWB tCHZ tAR tOH ≈ ≈ ALE tR tRC ≈ RE tRR ≈ I/OX 00h or 01h A0 ~ A7 A9 ~ A16 A17 ~ A24 A25 Dout N Dout N+1 Dout N+2 Column Page(Row) Address Address R/B Busy ≈ Read2 Operation (Read One Page) CLE On K9F1208X0B-Y,P or K9F1208X0B-V,F CE must be held low during tR CE WE tR tWB tAR ALE tRR ≈ RE Dout ≈ I/OX 50h A0 ~ A7 A9 ~ A16 A17 ~ A24 A25 n+M n+m R/B Selected M Address Row A0~A3 : Valid Address A4~A7 : Don′t care 512 16 Start address M 24
  25. 25. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Sequential Row Read Operation (Within a Block) CLE ≈ CE ≈ ≈ WE ALE ≈ ≈ ≈ ≈ ≈ RE Dout Dout Dout Dout Dout Dout ≈ ≈ ≈ ≈ I/OX 00h A0 ~ A7 A9 ~ A16 A17 ~ A24 A25 N N+1 527 0 1 527 Ready ≈ ≈ Busy Busy R/B ≈ ≈ M M+1 N Output Output Page Program Operation CLE CE tWC tWC tWC ≈ WE tWB tPROG ALE RE ≈ ≈ Din Din I/OX 80h A0 ~ A7 A9 ~ A16 A17 ~ A24 A25 N 10h 70h I/O0 527 Sequential Data Column Page(Row) 1 up to 528 Byte Data Program Read Status Input Command Address Address Serial Input Command Command R/B ≈ I/O0=0 Successful Program I/O0=1 Error in Program 25
  26. 26. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY BLOCK ERASE OPERATION (ERASE ONE BLOCK) CLE CE tWC WE tWB tBERS ALE RE I/OX 60h A9 ~ A16 A17 ~ A24 A25 DOh 70h I/O 0 Page(Row) Address Busy R/B I/O0=0 Successful Erase Auto Block Erase Setup Command Erase Command Read Status I/O0=1 Error in Erase Command 26
  27. 27. Multi-Plane Page Program Operation CLE K9F1208U0B K9F1208B0B K9F1208R0B ≈ ≈ CE ≈ ≈ ≈ ≈ tWC ≈ ≈ ≈ ≈ WE tDBSY tWB tPROG tWB ALE ≈ ≈ ≈ ≈ RE Din Din Din Din ≈ A25 11h 80h A0 ~ A7 A9 ~ A16 A17 ~ A24 A25 10h 71h I/O ≈ I/OX 80h A0 ~ A7 A9 ~ A16 A17 ~ A24 N m N 527 ≈ ≈ ≈ ≈ Program Program Confirm 27 Sequential Data Column Page(Row) 1 up to 528 Byte Data Command Command Read Multi-Plane Input Command Address Address (Dummy) (True) Status Command Serial Input R/B ≈ ≈ Max. three times repeatable Last Plane Input & Program tDBSY : typ. 1us max. 10us Ex.) Four-Plane Page Program tDBSY tDBSY tDBSY tPROG R/B Address & Address & Address & 80h Address & 10h 71h I/O0~7 80h 11h 80h 11h 80h 11h Data Input Data Input Data Input Data Input A0 ~ A7 & A9 ~ A25 A0 ~ A7 & A9 ~ A25 A0 ~ A7 & A9 ~ A25 A0 ~ A7 & A9 ~ A25 528 Byte Data 528 Byte Data 528 Byte Data 528 Byte Data FLASH MEMORY
  28. 28. K9F1208R0B K9F1208B0B K9F1208U0B FLASH MEMORY Multi-Plane Block Erase Operation CLE CE tWC WE tWB tBERS ALE RE I/OX 60h A9 ~ A16 A17 ~ A24 A25 DOh 71h I/O 0 Page(Row) Address R/B Busy Block Erase Setup Command Erase Confirm Command Read Multi-Plane Status Command Max. 4 times repeatable * For Multi-Plane Erase operation, Block address to be erased should be repeated before "D0H" command. Ex.) Four-Plane Block Erase Operation R/B tBERS I/O0~7 60h Address 60h A9 ~ A25 60h A9 ~ A25 60h A9 ~ A25 D0h 71h A9 ~ A25 28

×