A Journey Into the Emotions of Software Developers
How to Build Hardware Lean
1. How to Build Hardware Lean
By Joo Aun Saw and Zoran Angelovski
YOW! Connected
2. Who we are?
Our background (combined):
§ Telecoms, Smart Energy, IoT.
§ DiUS.
§ Products.
§ Current.
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3. Our talk
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$
Starter Kits / SBC
Production
Module
Evaluation
Module
NRE
Per Unit Cost
Chip Level
1 - 3
3 - 10
10 – 500(?)
Prod
4. Building hardware
§ What you needed – yesterday.
§ How it was done – yesterday.
§ How it is done – today.
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5. What you needed - yesterday
Capabilities:
§ Specialist skills and tools.
What was ‘hardware’:
§ Discrete → some level of integration.
§ Complex PCB.
§ Equipment was expensive.
Barriers were higher but still doable.
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6. How it was done - yesterday
§ Assembling a prototype.
§ Bread board.
§ Your own PCB.
§ Buy parts.
§ Time consuming.
Barriers were higher but still doable.
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7. How it is done - today
§ SoC’s, Eval Modules, Starter Kits
(+Breakout boards) and Prod
Modules.
§ Lower Cost and availability.
§ Tools and building.
Cypress PSoC® is the world's first
programmable embedded system-on-chip
integrating configurable analog and digital
peripheral functions
Arduino Uno Starter Kit
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Breakout Board
8. From concept to proof-of-value
§ What is available today?
§ Which approach and why?
§ Exploring opportunities.
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9. What is available today?
Open source kit, SBC → Custom design:
§ Arduino, Rasp Pi with breakout boards.
§ Evaluation modules (most chip vendors).
§ Schematic and layout (Eagle, KiCAD).
§ Parts (Digi-Key, Mouser, Element14).
§ PCB (OshPark).
§ Mechanical - print your own.
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11. Which approach and why?
ESI / IoT gateway:
§ Proof-of-Value.
§ Direct to PCB.
§ Mechanical.
PowerVu:
§ Why did we choose a partner?
§ Specialist hardware, industrial design.
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15. Before you start
Consider:
§ Why, what, where?
§ How many?
§ Tools?
§ Skills?
§ Software stack and licensing?
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$
NRE
Per Unit Cost
16. Multispectral imager
Low cost high resolution multispectral imager.
Challenges:
§ First airborne device, inexperience.
§ Unproven hardware and software.
§ Size and weight constraints.
§ Difficult to test (highly dependent on weather).
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17. Multispectral imager (the lean way)
§ Defer custom PCB.
§ Don’t reinvent the wheel.
§ Iterate.
§ Test cycles.
§ UX (User Experience).
1st prototype:
3rd prototype:
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18. Issues to consider
Experimentation
Production
Work Environment – smells and fumes,
noise, common sense – 240V.
ü
ü
Certification - ZigBee, USB, Wi-Fi.
? ü
ü
Safety and Regulatory - EMC, RCM
(regulatory compliance mark), CASA
certificate.
?
ü
Parts - EoL, hard to get, changes in spec.
ü
ü
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19. Lastly…
§ Some words about manufacturing.
§ What’s the opportunity for business?
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20. Experimenting à Manufacturing
Here you have to do more that just the fun stuff…
…get the factory and partners involved early
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Process
Regulatory
approvals
Leadtimes
Procurement
Records
Revision control
Components
Changes
Alternative Parts
Warranty
21. What’s the opportunity for business?
§ Explore Opportunities.
§ Our brand.
§ Consultancy service.
§ Dedicated development team.
§ Product range.
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22. DiUS product range
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Smart Energy
ChargeIQ
Smart Energy ESI
(Software)
Sensor / IoT
Local Smoke Alert
Presentation
Cloud Based Data Service
LiveVu
23. Get in touch
e. zangelovski@dius.com.au
e. jasaw@dius.com.au
@dius_au
Linkedin.com/company/dius-computing
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