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VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distr...
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VLSIresearch Report

  1. 1. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. The Chip Insider ® April 3, 2014 Equipment & Emerging Markets Applied Materials ENDURA: Over 20 Years of Metallization Leadership • Introduced in April 1990 • Aggressive Marketing around The World • Endura is the Most Successful Platform • Revenues exceed $20B • Extension from PVD to CVD/ALD • Complex Process Integrations • Success Endures Supporting Material • HB-LED Pricing • VLSIresearch Appears Next @
  2. 2. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. ENDURA Introduced in April 1990 • First staged vacuum architecture • First ultra-high vacuum (10-9 torr) production system – Electromigration reduced by factor of nine • Continuous vacuum between processes – Five stage vacuum with high integrity • Most complex platform to demonstrate >90% uptime – First platform to use magnetically coupled vacuum robots – Single central block of aluminum 4/3/2014 2 …and endorsed by Dr. Ohmi…
  3. 3. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Aggressive Marketing around The World 4/3/2014 3
  4. 4. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Sales Soared and Share went Vertical 4/3/2014 4
  5. 5. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Applied Materials’ Endura Over 20 years of metallization leadership • Undisputed leader across 3 decades • Expansion of applications and films • Original Endura specs included integration of processes: – CVD, WCVD – RTP – Etch & Cleaning 4/3/2014 5
  6. 6. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. ENDURA is the most successful platform The longest running major platform 4/3/2014 6 Standard PVD Collimation & Long Throw IMP SIP & EnCoRe RF PVD 1st Gen Ionized PVD 2nd Gen Ionized PVD 3rd Gen Ionized PVD
  7. 7. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Endura’s brought in more than $20B 4/3/2014 7
  8. 8. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Endura’s Extension from PVD to CVD/ALD 4/3/2014 8 Blanket PVD Films PVD for Film Coverage 20 Years of CVD/ALD
  9. 9. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Over 100 Processes Drive the Revenues 4/3/2014 9
  10. 10. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. More Than PVD Endura is driven by: • Device performance and yield solutions • Precision Materials Engineering leadership Key technologies available: • PVD • CVD – Thermal & Plasma Enhanced • ALD – Thermal & Plasma Enhanced • Chemical Cleans 4/3/2014 10
  11. 11. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Complex Process Integration Enables Challenging HVM applications Flexibility: • To meet demanding integration requirements – Results in both performance and cost benefits System reliability: • Enabled up to 7 integrated process steps – In high volume manufacturing for multiple nodes Metal Gate: • Integrated PVD, CVD, and ALD technologies that have enabled the first generation of metal gate in high volume production • ALD deposition for conformal films • RF PVD deposition for low damage high purity PVD metal • Integrated PVD or CVD wetting layers and CVD/PVD Al Fill 4/3/2014 11
  12. 12. VLSIresearch … intelligence to make better decisions faster Copyright © 2014 VLSI Research Inc. All rights reserved. Distribution rights contained in T&Cs. Endura Platform – Success Endures Continuous Refinement • Capability upgrades for manufacturing at 22nm node and below • Improvements for defect reduction and backside metal contamination – Minimum contact wafer transfer blades / electrostatic discharge control – Engineered lift pins and minimum contact points – Electrostatic chuck and pedestal contact points – High performance coatings on components – Coordinate system and chamber moves with optimized motion profiles – Advanced slit door materials with specialized movements to minimize defect creation – Optimized gas flow patterns, specialized diffusers and pressure equalization routines • Defect performance at 40nm defect size 4/3/2014 12
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