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an Alent plc Company
Preform Product
Elimination of Wave
Exactalloy T&R Preforms
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Introduction of “Elimination of Wave”
• The ...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Alpha’s Tape and Reel Preforms can enable Pi...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Exactalloy T&R Solder Preform Sizes
0.020
mm...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Notemperaturedifferential=nothermalshock
215...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Reflow Wave
Hole fill Comparison
Reflow vs. ...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Hole Fill Reflow
T&R Preforms allow precise ...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Value Proposition
• What would be the value ...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Savings by Elimination of Wave
$$
SMT1
SMT2
...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Implementing
Paste-plus-Preform
to Eliminate...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
General Guidelines
1. Overprinting should al...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Checklist for Success
(Identifying a Candida...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
 Components Can Tolerate the Reflow
Tempera...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
 Component Standoff Height is Adequate
• St...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Calculating Allowable Preform Height
Allowab...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Highly Confidential and Privileged Information of Alpha an Alent plc Company
 Standoff Built into Pin is Not Desirable
•...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Comparing Standoff Styles
Both components ha...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Improved Pin Standoff Design
With notched st...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
 No paste is printed underneath standoffs
•...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
 Pin Protrusion is Not Excessive
• Excessiv...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Pin Protrusion
It is possible to use a stenc...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
 Pin to Hole Ratio Acceptable
• A wide vari...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Checklist for Success
Summary
 Components c...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Parameters Needed:
1. Board thickness - Th
2...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Steps for Selecting a Preform
1. Calculate t...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
Get your Alpha Reference bulletin entitled “...
Highly Confidential and Privileged Information of Alpha an Alent plc Company
28
Summary
• Alpha Tape and Reel Preforms ca...
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Elimination of Wave Exactalloy Tape and Reel Preforms

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Elimination of Wave Exactalloy Tape and Reel Preforms -Tape & Reel Solder Preforms enable your ability to selectively increase solder volume using standard assembly equipment, and improve your PCB’s first pass yield, time to market, and product reliability.

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Elimination of Wave Exactalloy Tape and Reel Preforms

  1. 1. an Alent plc Company Preform Product Elimination of Wave Exactalloy T&R Preforms
  2. 2. Highly Confidential and Privileged Information of Alpha an Alent plc Company Introduction of “Elimination of Wave” • The desire to reduce cost and improve reliability in assembly for our customers continues to drive Alpha’s marketplace today. Transitioning mixed technology or traditional wave applications to SMT or what we like to call the “elimination of wave” is a value proposition demonstrating both cost, reliability, and environmental benefits. • The most common methodology to accomplish a transition from wave to surface mount technology is known as pin-in-paste or P-i-P. Pin-in-Paste provides manufacturers with a high-yield process that simultaneously reflows solder for surface mount and through hole components - without the need for wave soldering. By eliminating that step of the assembly process altogether, pin-in-paste not only saves time, reduces production costs, and increases throughput, but also enhances solder reliability while reducing dross in the manufacturing environment • Once a PiP application has been identified, there are a number of challenges that can arise which can be overcome by using Alpha T&R preforms with PiP. In this presentation, we will focus on those applications. Upon completion, you will have the ability to assess your mixed technology process quickly and determine if it is a candidate for elimination of wave using Alpha Exactalloy Tape and Reel (T&R) preforms. Let’s get started!
  3. 3. Highly Confidential and Privileged Information of Alpha an Alent plc Company Alpha’s Tape and Reel Preforms can enable PiP technology Overprinting Typical Thru-hole Connector Alpha’s Exactalloy T&R Preforms can supplement solder volume when overprinting is not possible or insufficient
  4. 4. Highly Confidential and Privileged Information of Alpha an Alent plc Company Exactalloy T&R Solder Preform Sizes 0.020 mm inch mm inch mm inch mm^3 in^3 0201 0.51 0.020 0.25 0.010 0.25 0.010 0.03 0.000002 0202 0.51 0.020 0.51 0.020 0.25 0.010 0.07 0.000004 03015 0.76 0.030 0.38 0.015 0.25 0.010 0.07 0.000005 0402H 1.00 0.039 0.60 0.020 0.25 0.010 0.15 0.000008 0402 1.00 0.039 0.50 0.020 0.50 0.020 0.25 0.000016 0402B 1.00 0.039 0.55 0.022 0.55 0.022 0.30 0.000019 0603H 1.60 0.063 0.80 0.031 0.50 0.031 0.64 0.000061 0603 1.60 0.063 0.80 0.031 0.80 0.031 1.02 0.000061 0805 2.01 0.079 1.30 0.051 0.76 0.028 1.99 0.000113 1406 3.56 0.140 1.52 0.060 0.77 0.030 4.17 0.000252 VolumePart Type Part Dimensions a b c Free 1,000 piece reels available for testing Other standard sizes available, contact you salesperson for more information
  5. 5. Highly Confidential and Privileged Information of Alpha an Alent plc Company Notemperaturedifferential=nothermalshock 2150C (>2350C) >2300C (>2450C) Sn/Pb Soldering (Pb-Free Soldering) 1100C Temperaturedifferentialcreatesthermalshock Internal planes act as heat-sinks inhibiting barrel fill during wave solder ONLY, not PIP reflow 215oC (>2350C) Preform in Paste Process Comparison Wave Soldering Less than 75% hole fill 100% hole fill SMT Reflow Soldering
  6. 6. Highly Confidential and Privileged Information of Alpha an Alent plc Company Reflow Wave Hole fill Comparison Reflow vs. Wave
  7. 7. Highly Confidential and Privileged Information of Alpha an Alent plc Company Hole Fill Reflow T&R Preforms allow precise solder volume control • Multiple preforms can be placed at each pin location • Fillet generation can be controlled
  8. 8. Highly Confidential and Privileged Information of Alpha an Alent plc Company Value Proposition • What would be the value of eliminating wave soldering or selective wave and re-work in a “mixed technology” process? SMT1 SMT2 WAVE Re-Work •Print Paste •Pick & Place •Reflow •Flip PCBA •Print Paste •Pick & Place •Reflow •Inspect •Place Comp. •Flux •Wave Solder •Inspect •Inspect •Rework/Touch-up (optional)
  9. 9. Highly Confidential and Privileged Information of Alpha an Alent plc Company Savings by Elimination of Wave $$ SMT1 SMT2 Cost of Wave Cost of Preforms $$ SAVINGS $$ Cost Stack for Elimination of Wave Solder WAVE is an expensive additional process which most would eliminate if possible ¢¢
  10. 10. Highly Confidential and Privileged Information of Alpha an Alent plc Company Implementing Paste-plus-Preform to Eliminate Wave
  11. 11. Highly Confidential and Privileged Information of Alpha an Alent plc Company General Guidelines 1. Overprinting should always be considered the first option for filling plated through holes. 2. Preforms are placed in solder paste to accurately increase solder volume to the plated through hole component. • Inadequate solder volume from overpinting. • Limited space around the throu hole component. 3. Preforms are placed first with chip caps and resistors. SMT components are placed next, and through hole components are placed last, automatically or manually. 4. Through hole components are soldered pin down during the SMT2 process.
  12. 12. Highly Confidential and Privileged Information of Alpha an Alent plc Company Checklist for Success (Identifying a Candidate for Elimination of Wave)  All through-hole components can tolerate the reflow temperature  All components meet the minimum standoff heights for the selected preforms.  Pins do not have a shoulder that blocks hole  No paste is printed underneath standoffs  Pin protrusion is not excessive  Pin to hole ratio is reasonable
  13. 13. Highly Confidential and Privileged Information of Alpha an Alent plc Company  Components Can Tolerate the Reflow Temperatures Component Temperature: – The Through Hole components must withstand SMT reflow temperature. • For SnPb, it must withstand 230 °C for 10 to 20 seconds • For Pb-Free, it must withstand 260 °C for 10 to 20 seconds – Check with connector supplier to determine if the component is SMT rated.
  14. 14. Highly Confidential and Privileged Information of Alpha an Alent plc Company  Component Standoff Height is Adequate • Standoff = clearance between bottom of the component and the board. • Minimum Standoff Clearance – Paste height (stencil thickness) + Preform thickness + tolerance (0.003”) – Preform must be allowed to move freely to the hole (under the component body) during reflow. Insufficient clearance under the body of the component will prevent preforms from flowing to the plated through hole. Resulting in large solder sphere defects outside the hole Through-hole Component
  15. 15. Highly Confidential and Privileged Information of Alpha an Alent plc Company Calculating Allowable Preform Height Allowable Preform Height = Comp. Standoff Height – Stencil Thickness – 3 mils Component Standoff Height Allowable preform Height Paste on Pad Preform
  16. 16. Highly Confidential and Privileged Information of Alpha an Alent plc Company
  17. 17. Highly Confidential and Privileged Information of Alpha an Alent plc Company  Standoff Built into Pin is Not Desirable • Example component with pin standoff – Standoff built into the pin will block the hole during reflow Standoff on pin
  18. 18. Highly Confidential and Privileged Information of Alpha an Alent plc Company Comparing Standoff Styles Both components have identical standoff height Permits paste printing and Preform Placement Pin standoff blocks the hole, preventing top side hole fill Standoff built into the component body Standoff built into the component pin
  19. 19. Highly Confidential and Privileged Information of Alpha an Alent plc Company Improved Pin Standoff Design With notched standoffs in the pin, the pad and plated through hole are exposed, allowing solder to flow to the hole.
  20. 20. Highly Confidential and Privileged Information of Alpha an Alent plc Company  No paste is printed underneath standoffs • Components with multiple standoffs can interfere with solder paste printing • Components with standoff at the end of the component body are preferred Minitek Header
  21. 21. Highly Confidential and Privileged Information of Alpha an Alent plc Company  Pin Protrusion is Not Excessive • Excessive pin protrusion can reduce hole fill • Paste can fall off during handling or reflow • Stranded paste can cause large solder balls to form at the tip of the pin. – Pin protrusions longer than 60 mils (1.5 mm) can cause solder balls to form at the tip of the pin. • Blunt ended pins are not desirable. – Worsen excessive pin protrusion issues – Used tapered or rounded pin whenever possible Solder ball formed at the tip of a pin after reflow Solder ball (shown in X-ray) BLUNT ENDED PIN INSUFFICIENT SOLDER
  22. 22. Highly Confidential and Privileged Information of Alpha an Alent plc Company Pin Protrusion It is possible to use a stencil that totally blocks the hole to enable paste plus preforms with very long or blunted ended pin protrusions.
  23. 23. Highly Confidential and Privileged Information of Alpha an Alent plc Company  Pin to Hole Ratio Acceptable • A wide variety of pin to hole ratios can be reflow soldered using paste plus preforms • Pin to Hole Ratios: – Minimum Pin to Hole Ratio: Pin + 15 mils (0.38 mm). • Going lower will create problems of solder flow and placement issues. – Maximum Pin to Hole Ratio: Pin + 40 mils (1 mm) • Exceeding this value may create voids or gaps in barrel.
  24. 24. Highly Confidential and Privileged Information of Alpha an Alent plc Company Checklist for Success Summary  Components can tolerate the reflow temperature  All components have a minimum standoff height  Pins do not have a shoulder that blocks hole  No paste is printed underneath standoffs  Pin protrusion is not excessive  Pin to hole ratio is reasonable ** If you can confirm all the items in the checklist, you surely have an excellent candidate for a preform application.
  25. 25. Highly Confidential and Privileged Information of Alpha an Alent plc Company Parameters Needed: 1. Board thickness - Th 2. Hole diameter - Hd 3. Lead diameter - Ld 4. Solder pad diameter Pd Th Ld Hd Solder Volume Calculation Pd
  26. 26. Highly Confidential and Privileged Information of Alpha an Alent plc Company Steps for Selecting a Preform 1. Calculate the total solder volume needed (Vsldr): Vsldr = (Vhole – Vpin) + 2(Vfillet) 2. Calculate the paste volume (Vpaste) from the allowable stencil aperture: Vpaste = Aapp x THstncl 3. If, Vsldr > ½ Vpaste, then Preform(s) is needed. 4. Calculate the target Preform volume: Vpf = Vsldr – ½ Vpaste 5. Check PF / Paste Ratio (4X and 8X rules): Vpf / Vpaste < 4* (Air) < 8* (Nitrogen) * Values less than 4 or 8, indicate inadequate flux volume 6. Calculate target PF height: Comp. Standoff Hgt. – THKstncl – 0.003” 7. Select the most appropriate Preform(s) from the list of available standard sizes Fillets
  27. 27. Highly Confidential and Privileged Information of Alpha an Alent plc Company Get your Alpha Reference bulletin entitled “Checklist for Success” from your Alpha Sales representative
  28. 28. Highly Confidential and Privileged Information of Alpha an Alent plc Company 28 Summary • Alpha Tape and Reel Preforms can be used to aid in the Elimination of Wave in a mixed technology process. • Tape and Reel Preforms are an economical alternative to increasing solder volume when overprinting solder paste is not adequate. • There are a wide variety of Alpha T&R preform sizes to address most every through hole application. • The implementation of Alpha T&R Preforms into an existing SMT process is not complicated. • Alpha T&R preforms are a more reliable solution then overprinting: – Very little flux residue – 100% hole fill is routinely achieved – A large overprint can be reduced or eliminated – Random solder balls can be significantly reduced. • Not all Wave applications can benefit from preform in paste techniques. Use the Checklist for Success tool to help you decide.

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