AMD Embedded G-Series Product Page


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AMD Embedded G-Series Product Page

  1. 1. AMD EMBEDDED G-SERIES PLATFORM The world’s first combination of low-power CPU and advanced GPU integrated into a single embedded device.PRODUCT OVERVIEW FEATURES AND BENEFITSThe AMD Embedded G-Series processor is the world’s first A flexible platform that in one package offers many choicesintegrated circuit to combine a low-power CPU and a discrete-level for power efficiency, visual experience with high resolution,GPU into a single embedded Accelerated Processing Unit (APU). and fully connected Internet experience with maximum multi-This unprecedented level of graphics integration builds a new media capability. Delivering unprecedented high definitionfoundation for high performance multi-media content delivery in a visual experience while still maintaining a low power design.small form factor and power efficient platform for a broad range of > DirectX® 11 support lets you enjoy awesome graphics performance,embedded designs. Based on a brand new power-optimized core, stunning 3D visual effects and dynamic interactivitythe AMD Embedded G-Series platform delivers new levels of > Advanced discrete-level GPU with OpenGL 4.0 and OpenCL™performance in a compact BGA package that is ideal for low support in an integrated device provides support to build thepower designs in embedded applications such as Digital Signage, designs of tomorrow, todayx86 Set-Top-Box (xSTB), IP-TV, Thin Client, Information Kiosk,Point-of-Sale, and Casino Gaming. > Unprecedented graphics performance/watt thru advanced graphics and hardware acceleration delivering over 3XLOW POWER, EXCEPTIONAL PERFORMANCE performance per watt of previous generation1.The AMD G-Series platform is a flexible solution that in the same Enabling Innovative Small Form Factor Designs - Smaller footpackage offers scalable choices for the level of CPU performance, print and low power solution reduces overall system costs.power efficiency, and visual experience. APU configurations are > The integration of the APU reduces the foot print of a traditionalavailable with single or dual x86 cores, at 9W or 18W thermal three-chip platform to two chips, the APU and its companiondesign power (TDP), and two levels of graphics and video controller hub. This simplifies the design, requiring fewerperformance. Each APU supports single or dual-independent board layers and a smaller power supply, further driving downhigh resolution displays and exceptional multi-media capability system costs.with hardware decode support for H.264, VC-1, MPEG2, WMV,DivX and Adobe Flash. When paired with the A50M I/O controller Reduced Costs over the Product Life Cycle - A single, scalablehub with support for advanced interfaces such as 6Gb/s SATA, platform design that allows OEMs to reduce development costs,Generation 2 PCI Express®, and HD Audio, the AMD G-Series optimize solutions and increase product stability.platform delivers a low power, value oriented solution for applications > A single APU architecture with an array of performancerequiring a better balance of CPU and multimedia performance. options, AMD Embedded G-Series platform lets OEMs utilizeFor high-end, full-featured platforms, the A55E I/O controller hub is a single board design to enable solutions that span froman alternative paring choice with added features of Gigabit Ethernet entry-level to high-end. The commonality of the scalableMAC, RAID (0/1/5/10) support with FIS-based switching, and PCI platform design across multiple product variants can helpLocal bus support. reduce development costs, simplify the supply chain and reduce operational complexity. > AMD’s embedded lifecycle, with planned availability of at least 5 years, helps to ensure a long life for an OEM design.Note 1: ATI Avivo HD is a technology platform that includes a broad set of capabilities offered by certain AMD Radeon graphics processors. Full enablement ofsome ATI Avivo HD capabilities may require complementary products.
  2. 2. Key Architecture Benefits APU FEATURES INTEGRATED DDR3 MEMORY CONTROLLER I/O ‣ High speed device interconnect ‣ Support for solder-down, SODIMM and DIMM ‣ 4x1, or 1x4 PCI Express (On APU) ‣ High performance integrated x86 core(s) memory, two slots, non-ECC type ‣ 4x1, or 1x4, PCI Express (On Controller Hub) ‣ Integrated cutting edge graphics processor ‣ 64-bit DDR3 SDRAM controller operating at ‣ 6X SATA 6Gbps ‣ High-bandwidth, low-latency integrated memory frequencies up to 1066 MT/s (533MHz) ‣ 14X USB 2.0 controller ‣ SPI, LPC and SMBus Interfaces ‣ Low-latency platform interface LARGE HIGH-PERFORMANCE ON-CHIP ‣ CIR CACHE ‣ HD Audio x86 CORE ARCHITECTURE ‣ 32KB I-Cache, 32KB D-Cache ‣ Integrated clock generation ‣ Single or Dual x86 Processor ‣ 512KB L2 per Core ‣ Fan Control ‣ Advanced Branch Predictor ‣ Up to 102 GPIO ‣ Out-of-Order Instruction Execution INTEGRATED DISPLAY INTERFACES ‣ Pin compatible options for A50M and A55E I/O - Full OOO Instruction Execution ‣ Dual independent display support Controller Hubs - Full OOO Load/Store Engine ‣ Dual-link or dual single-link DVI ‣ Additional I/O on A55E ‣ High Performance Floating Point ‣ HDMI™ - Gigabit Ethernet MAC ‣ AMD64 64-bit ISA ‣ Dual DisplayPort - RAID (0/1/5/10) support with FIS-based switching ‣ SSE1,2,3, SSSE3 ISA, SSE4A ‣ LVDS - PCIe® Generation 2 UMI connection to APU ‣ Secure Advanced Virtualization ‣ Analog VGA - 33MHz PCI Interface with support for 4 Masters GPU CORE ARCHITECTURE AMD VIRTUALIZATION™ TECHNOLOGY PACKAGE ‣ Dedicated graphics memory controller (AMD-V™) ‣ APU - High efficiency ring bus memory controller ‣ SVM lock and unlock - 413-pin lidless micro BGA - Direct connection to memory ‣ Nested paging - 19mm x 19mm ‣ 2D Acceleration ‣ Next RIP ‣ Controller Hub - Highly-optimized 128-bit engine, capable ‣ LBR virtualization - 605-pin lidless FCBGA of processing multiple pixels per clock ‣ 8 address space identifiers - 23mm x 23mm ‣ 3D Acceleration ‣ Performance counter guest/host bit - Full DirectX® 11 support, including full speed ‣ Nested page table fault info 32-bit floating point per component operations. - Shader Model 5 - OpenCL™ 1.1 support - OpenGL 3.2 and 2.1 support ‣ Motion Video Acceleration - Dedicated hardware (UVD 3) for H.264, VC-1 and MPEG2 decode - HD HQV and SD HQV support: noise removal, detail enchantment, color enhancement, cadence detection, sharpness, and advanced de-interlacing - Super up-conversion for SD to HD resolutions Clock DDR3 Model Cores Cache Graphics Max TDP Speed Speed T56N 1.6GHz 2 L1: 64KB AMD Radeon™ DDR3- 18W L2: 512KB x2 HD 6310 1066 T48N 1.4GHz 2 L1: 64KB AMD Radeon™ DDR3- 18W L2: 512KB x2 HD 6310 1066 T40N 1.0GHz 2 L1: 64KB AMD Radeon™ LVDDR3- 9W L2: 512KB x2 HD 6250 10662 T52R 1.5GHz 1 L1: 64KB AMD Radeon™ DDR3- 18W L2: 512KB x1 HD 6310 1066 T44R 1.2GHz 1 L1: 64KB AMD Radeon™ LVDDR3- 9W L2: 512KB x1 HD 6250 Internal testing of current vs. previous generation AMD processor-based embedded systems as of October 13, 2010 showed more than 3X graphics performance-per-watt advantage for the current generation. Current system: AMD G-T44R APU(9W TDP), Inagua development platform, 2 GB RAM, Windows 7. Previous generation: AMD Sempron™ 2010U processor (15W TDP), MSI 9858 motherboard, 2 GB RAM, Windows 7. Graphics performance-per-watt calculated based on 3DMark®06 benchmark divided by solution thermal design power (TDP).2: Low voltage (1.35V) DDR3 is assumed for the 9W TDP processors. The use of 1.5V DDR3 will incur a power adder. Always refer to the processor/chipset data sheets for technical specifications. Feature information in this document is provided for reference only.curr©2011 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, and combinations thereof, are trademarks of Advanced Micro Devices. DirectX is a registeredtrademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. HDMI is a trademark of HDMI Licensing, LLC. PCIe and PCI Express are registered trademarks of PCI-SIG. Othernames are for informational purposes only and may be trademarks of their respective owners. 49282A