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WP1 Gateway HW Design & Implementation

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AGILE 2nd F2F MEETING, 14-15 April 2016, Athens, GR

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WP1 Gateway HW Design & Implementation

  1. 1. WP1 Gateway HW Design & Implementation LEADER: EUROTECH INVOLVED PARTNERS: ATOS, SKYWATCH, BIOASSIST, MOBISTAR, LIBELIUM AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
  2. 2. WP1 Objectives (recap) Main objective: specification, design and implementation of the hardware of the modular gateway. The modular gateway: • will be available in two versions: • the “makers” version based on RaspberryPi; • the industrial version with a new HW design based on Intel architecture. • will be based on a set of core and expansion modules: • core modules: carrier module, cpu module, the storage module or the power supply, etc.; • extension modules: the communication modules, sensing modules, etc.. AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
  3. 3. WP1 Objectives (recap 2) Address two levels of modularity: • modularity for existing HW: an expansion module (shield) allows the RPi to be extended with new modules; • intrinsic modularity: in the industrial gateway any architectural element is a module. Hardware module interoperability: ❓ identify the HW technologies that simplify and promote interoperability; ❓ specify a set of rule to follow during modules design and development. Hardware prototypes development: • Implement a set of prototypes of the “makers” gateway; • Implement a set of prototypes of the industrial gateway; • implement a set of expansion modules that will be adopted in the pilots. AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
  4. 4. WP1 - Status T1.1 We have to start collecting the requirement from WP8: task ends at M5. T1.2 Maker’s Gateway design: ongoing. T1.3 Design of industrial Gateway: ongoing. Next deadlines: ◦ M6 - D1.1 AGILE Gateway architecture specifications and initial design ◦ Gateway requirements, design specification and initial architectural design for both the industrial and makers version. AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
  5. 5. WP1 - Timeline • D1.1 - AGILE Gateway architecture specifications and initial design Gateway requirements, design specification and initial architectural design for both the industrial and makers version. • D1.2 - AGILE Gateway hardware final prototypes 2nd AGILE Release – Hardware Platform Final designs, features and functional specifications of the hardware prototypes. Delivery of the final AGILE Gateway prototypes. • MS1 - AGILE Initial Design MS1 & Draft Framework Release Initial design of the AGILE platform (SW and HW) and release of a draft version of the AGILE framework (sw and basic hw built on existing prototyping platforms). • MS2 - AGILE Framework (SW and HW) release & Initial Integration Delivery of the AGILE platform (software components, makers and industrial gateway prototypes) and the initial integration of the software components. AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
  6. 6. Design methodology Design for modularity (DFM): DFM follows the emerging trend in HW design and manufacturing known as “Build to Order”. ◦ BTO products are not built until a confirmed order for products is received. ◦ We extend BTO also to the design phase (not only manufacturing). ◦ Traditionally, BTO is the most appropriate approach used for highly customized or low volume products. ◦ DFM allows to map a custom design in a design based on standard modules! Why BTO? Modularity has a cost and is only partially covered by the higher cost of a custom product. DFM & BTO objectives: ◦ reduce the effects of fixed costs; ◦ reduce the development costs; ◦ offer custom products with lower costs. Two different types of modularity: ◦ modularity for existing HW - an expansion module (shield) allows the RPi to be extended with new modules; ◦ intrinsic modularity - in the industrial gateway any architectural element is a module.
  7. 7. DFM Methodology (design &dev) 1. Analysis of the company expertise, background, vertical markets, customers, etc.. 2. Requirements definition in terms of: ◦ system functionalities, ◦ target price, ◦ lead time, ◦ life cycle. 3. Reference partitioning of the system architecture. 4. Design review and optimization based on the target verticals: 1. technical aspects, 2. manufacturing, stocking planning and operation aspects, 3. vertical evaluation. It provides a set of trade-off, adjustments and costs balancing. 5. Reference partitioning refinement. 6. Consolidated modular design (based on off-the-shelf modules and/or custom modules).
  8. 8. DFM Methodology (product implementation) Customer gateway design and manufacturing. 1. Customer requirements analysis. 2. Mapping/fitting of the requirements on the gateway consolidated design. 3. Implementation choices about modules: ◦ the functional module becomes a physical module; ◦ the functional module is integrated on the carrier; ◦ the functional module is integrated in SoC. 4. Potential custom modules development. 5. Final design of the customer gateway.
  9. 9. WP1 - Makers gateway AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT FIRST DESIGN •Architecture & Configuration defined •Shield for Raspberry Pi in design • Working on first prototype • 2 modules to be plugged on top of Rasp Pi • Raspberry Pi GPIOs accessible for sensors •Hot Swap à Allowed by pressing button • The gateway is able to recognize which module (among the list of supported modules) has been plugged
  10. 10. WP1 - Makers gateway AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT FIRST DESIGN
  11. 11. WP1 - Makers gateway AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT FIRST DESIGN •CONNECTIVITY • Raspberry Pi 2 • 2 modules to be plugged • Wifi & 3G/4G à USB Dongle • Raspberry Pi 3 • 2 modules to be plugged • Wifi & Bluetooth Low Energy à included in Raspberry • 3G/4G à USB Dongle
  12. 12. WP1 - Makers gateway AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
  13. 13. WP1 - Makers gateway AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT Other REQUIREMENTS •Getting Requirements from PILOTS • Communication technologies • Physical constraints (weight and volume) •Getting Requirements from IoT Survey • Communication technologies •According to D1.1 à definition of a plan for the elicitation of use case dependent requirements from WP8.
  14. 14. Industrial modular gateway: requirements Requirements elicitation from: ◦ Eurotech background; ◦ horizontal requirements; ◦ WP8: pollution & air quality monitoring use case. Main requirements: ◦ modular architecture; ◦ to grow a library of standard HW “building blocks” to be reused across verticals and system configuration; ◦ confine any customization outside the core “building blocks”, in particular User I/O, connectivity, mechanics & enclosure, thermal solutions. ◦ standard Computer On Module (COM) ◦ for embedded application, multivendor support, ◦ commercial grade and industrial grade versions available, ◦ with recognized roadmap until 2018, ◦ designed for Intel Architecture.
  15. 15. …main requirements: ◦ Use of standard BUSes providing peripheral enumeration support. ◦ Use of widely adopted standard peripheral interfaces for ES. ◦ Support for multiple WAN/LAN connectivity options. ◦ Verticals & certification driven power supply configuration. ◦ Fanless thermal design. ◦ Multiple storage solutions available. ◦ Support for a wide range of environmental sensing modules ◦ with pre-calibrated sensor conditioning. ◦ Timestamp and optional geo-localization information. ◦ Maximum power consumption 40W. ◦ Extended temperature range support (target -20 +70 °C). ◦ Maximum size: 250 x 200 x 88 mm (LxDxH, SBC footprint, 2 rack-mount unit). Industrial modular gateway: requirements (2)
  16. 16. I/O Expansion Module Modules physically independent and connected to the carrier with cabled connection Carrier Module CPU Module Board Management Module (BMM) Power supply module Internal Expansion Module 1 Internal Expansion Module 3 AUX I/O Module I/O Module for field bus Internal Expansion Module 2 Modules physically independent and connected to the carrier via a board to board connection Can be an external module or an internal expansion or integrated User I/O Storage module DFM Gateway modular design
  17. 17. Industrial Gateway Modules CPU Module: ◦ Intel Atom BayTrail or Apollo Lake families ◦ 10W TDP Class CPU ◦ COM Express Type 10 Board Management Module BMM: ◦ 32 Bit Microcontroller ◦ Manages system and modules status and related transitions (cold boot, warm boot, low power states such as suspend or hybernate). ◦ Manages system maintenance, e.g.: ◦ secure update, ◦ auto test, ◦ extended input wakeup & suspend, ◦ special features like injection sensing, timed procedure, etc.
  18. 18. Industrial Gateway Modules (2) Storage module: 1. storage integrated in the CPU module, e.g. eMMC Flash, SATA SSD (e.g. it is used in high rugged and reliable system to avoid vibration issue). 2. Internal expansion, e.g. mSATA SSD Drive or SD Memory Card. 3. External storage module, e.g. HDD/SDD Disk with optional Drive Bay. AUX I/O Module (e.g. PoE or panel display backlight): these modules have a power absorption that is not supported by the carrier and must be connected directly to the power supply module. The I/O modules are powered by the carrier.
  19. 19. Industrial Gateway Modules (3) I/O Expansion modules: ◦ they generate the signal that must be available on the external panel; ◦ implement I/O functionalities for a specific vertical; ◦ provide connectors for a specific vertical; ◦ allows to customize the external connections. ◦ Examples: ◦ BUS converter ◦ Expander, e.g. I2C-> 10 GPIO ◦ Isolated and protected I/O ◦ Special functions like a particular field bus for a Scada application. I/O Expansion Module USB EXTERNAL PANEL 3xRS485 Ethernet RJ45 ML2 MIL
  20. 20. Industrial Gateway Modules (3) User I/O Modules: it can be an external module or a set of functionalities implemented in the carrier. It’s cheaper than I/O expansion and satisfies mechanical requirements. ◦ SD Memory Card. ◦ Test, debug and development interfaces. ◦ Maintenance interfaces. ◦ Legacy interfaces, like mouse and keyboard. I/O Modules for fieldbus: ◦ integrated, provided by the CPU module or by the BMM, e.g. CANBus; ◦ internal expansion module, providing potentially any kind of fieldbus. Power module: it can be integrated or external and provide a wide range power for multiple domain application (24V-110V). ◦ Insulated and/or protected version available. ◦ Support for tensions lower than the nominal range (e.g. for automotive). ◦ Designed for EN50155, MIL-STD, FCC, CE.
  21. 21. Carrier Module CPU Module Standard COM Express Rev.2.1 Board Management Module (BMM) Integrated Power supply N x miniPCIe slots expansion GPS module (?) I/O Expansion Module (CANBus, I/O expander) Optional PoE custom internal expansion User I/O Alternate Power supply eMMC Flash SATA DRIVE (Drive bay?) Integrated MicroSD Card Slot Maintenance I/O Dumb I/O Panel (e.g. for user I/O) Consolidate AGILE modular gateway design Integrated module Internal expansion External expansion
  22. 22. Industrial gateway preliminary specifications Standard COM Express Rev.2.1 Intel Atom BayTrail and Apollo Lake CPU families. 8GB eMMC Flash 1x SATA internal connector on carrier (Drive Bay), 1x SATA internal connector, Micro SD slot (maintenance). I/O interfaces: 2x(10/100/100) Ethernet, 1USB 3.0 circular, 1USB 2.0 maintenance, 1xRS232, 3xRS485/RS422, 1xCANBus, 1xMiniDisplay, 8xDigital I/O, 1xAudio Line In, 1xAudio Line out. Radio interfaces: 3G/4G, 802.11b/g/n, Bluetooth 4.0 BLE, GPS. Power: 24V/110V, 4W-17W.
  23. 23. D1.1 Deliverable TOC and contents discussion. Requirements: ◦ we can start the identification of the use case independent requirements; ◦ definition of a plan for the elicitation of use case dependent requirements from WP8. Definition of a deadline for contributions. Document links: https://redmine.create-net.org/dmsf/files/6340/download https://drive.google.com/a/create- net.org/file/d/0B2wGNjDl_JNZeXFIakFwX1Btb3M/view?usp=sharing_ei d&ts=5703c734
  24. 24. Thanks for the attention. That’s all folks.

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