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Tango systems axcela introduction
 

Tango systems axcela introduction

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    Tango systems axcela introduction Tango systems axcela introduction Presentation Transcript

    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential AXCELA ™ 200/300/450 By Tango Systems “Cost-Effective Metallization Solutions”
    • Tango Systems, Inc Confidential What is Tango Systems? •  PVD tool manufacturer incorporated in 2005 and located in San Jose, CA •  PVD Technology developed in 2002 from our sister company Hionix, a thin- film deposition company •  Over 40 people with expertise in system/hardware design, source technology, process technology and process integration •  Website: www.tangosystemsinc.com * Leading Innovator in PVD Equipment Manufacturing Tango tools in Asia and USA for production and R&D
    • Tango Systems, Inc Confidential Tango’s Broad Applications TSV Panels BSM WLP LEDs Advanced Packaging Thick Metal Depositions
    • Tango Systems, Inc Confidential Tango: PVD Products AXCELA SAPPHIRE TOPAZ Bumping, RDL, TSV, Barrier Seed layer Reactive & Advanced PVD Substrates, Panels, Integrated passives
    • Tango Systems, Inc Confidential Axcela: Unique Selling Points Flexible: •  Easily adaptable to any size: <150mm à 200mm à 300mm à 450mm •  Productivity benefits of batch systems without the process limitations •  Cluster tool for best in class process performance Extendable Technology: •  TSV, CIS, RDL, UBM and molded substrate processing Integrated DeGas: •  To eliminate contact resistance issues •  Proven high vacuum transfer module •  Enables good adhesion and prevents out-gassing issues Low Temperature Processing: •  Both PVD and Preclean chamber wafer platens can be cooled to -40C •  Temperature in Preclean will be below 120C •  Temperature in PVD will be below 150C for plated bump film stack
    • Tango Systems, Inc Confidential Architectural Advantages: Tango Lowest CoO in Industry High Throughput Cost of Maintenance Low CoC Cost of Spares Highly Reliable
    • Tango Systems, Inc Confidential AXCELA: Reliability •  MTBF: >250 hours •  MTTR: <4 hours •  MTBC: 5000 wafers •  Up-time: >85%
    • Tango Systems, Inc Confidential Key Customers •  SMIC (China) •  SEMCO (Korea) •  Western Digital Corporation (USA) •  D-Wave Systems (USA) •  JCAP (China) •  Unisem (China/Malaysia) •  ChipMOS (Taiwan) •  Nepes (Korea/Singapore)
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential AXCELA ™ Processes
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential 300 mm TiW NU = 2.26%
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential 300 mm Cu NU = 2.27%
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential 43Å Ta/Ru/Ta Film Stack 0.2% Uniformity A Look at Tango’s Excellent Thickness & Rs Control
    • Tango Systems, Inc Confidential Wafer ID : 1551-SLOT1 Test No. : 1 Test Date (M/D/Y): 06/08/2013 Notch Contour Map Std. Dev. : 0.2077176 Contour Interval : 0.183% 8.115610 8.100866 8.086123 8.071380 8.056636 Mean 8.041892 8.027148 8.012405 7.997661 0.21% 1 sigma Rs U% Test  Date/Time   6/8/13  19:35   Mean   8.056635857   Std  Devia:on  (%)   0.207717597   Min   8.012399673   Max   8.096999168   Range   0.084599495  
    • Tango Systems, Inc Confidential Wafer ID : 1551-SLOT9 Test No. : 1 Test Date (M/D/Y): 06/08/2013 Notch Contour Map Std. Dev. : 0.2167682 Contour Interval : 0.1695% 8.130415 8.116726 8.103038 8.089350 8.075662 Mean 8.061974 8.048285 8.034597 8.020908 0.22% 1 sigma Rs U% Test  Date/Time   6/8/13  17:32   Mean   8.075661659   Std  Devia:on  (%)   0.216768161   Min   8.034600258   Max   8.104200363   Range   0.069600105  
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential Lowest Contact Resistance
    • Tango Systems, Inc Confidential Customer Contact Resistance Data PVD1 Ti 1000+Cu 3000 unit: mΩ PVD1 T B L R Max Ave. Min P.1 8.62 10.00 10.86 9.20 10.86 9.24 8.45 P.2 8.46 9.74 8.45 8.62 PVD2 Ti 1000+Cu 3000 unit: mΩ PVD2 T B L R Max Ave. Min P.1 9.20 10.69 11.31 8.41 11.31 9.17 6.10 P.2 9.04 10.15 6.10 8.43
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential 10:1 Vias TSV Ti & Cu Step Coverage
    • Tango Systems, Inc Confidential ~15% Continuous Ti + Cu Coverage in 5x50um Vias Field = 9000A (Ti ~ 2500A; Cu ~ 6500A) Corner, 1050Å, ~11% Conservative measurement Bottom, 1360Å, ~14%
    • Tango Systems, Inc Confidential Demonstration of Continuous Ti/Cu Coverage in 5x50 um Vias by Conformal Cu Electroplating Field = 9000A (Ti ~ 2500A; Cu ~ 6500A) Before Plating Conformal Cu Plating on Wafer Pieces All the Way Down to the Via Bottom
    • Tango Systems, Inc Confidential Summary/Conclusions •  Tango has shown a highly encouraging 15% continuous bottom step coverage process for high AR TSV structures – 10:1 in particular •  Ti coverages are as high as 20% for only about 2000A metal on field! •  The step coverage should be sufficient to ensure good filling by Cu electroplating - demonstrated by Cu electroplating on wafer pieces
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential Efficient Batch Degassing
    • Tango Systems, Inc ConfidentialTango Systems, Inc Confidential Tango Degas Advantages •  Longer degas process time due to batch processing –  Up to 24 wafers per Load Lock •  Enhances ICP Preclean efficiency by reaching process start pressure quickly •  Improves film adhesion •  Contact resistance data from field tool running 300mm UBM TiW/Cu: –  Without degas: > 30 mOhm –  With degas: < 19 mOhm
    • Tango Systems, Inc Confidential Efficient Degassing on Organic Substrates
    • Tango Systems, Inc Confidential Thank You for Your Time “In Step with Technology” Tango Systems