11. david pope

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  • The presentation should address the following: Key Process Capabilities – improvements over current processes and areas of commonality across businesses How we are Organized – Who is leading the program. Phases and Timing – When will this occur. SAP R/3 – Answers what is the enabling solution. Implementation – Answers how.
  • The presentation should address the following: Key Process Capabilities – improvements over current processes and areas of commonality across businesses How we are Organized – Who is leading the program. Phases and Timing – When will this occur. SAP R/3 – Answers what is the enabling solution. Implementation – Answers how.
  • 11. david pope

    1. 1. Session III The View From The Top Supply Chain Challenges in Developing Markets
    2. 2. Agenda <ul><li>Rohm and Haas Today – Markets and Technologies </li></ul><ul><li>Air Freight at Rohm and Haas </li></ul><ul><li>Electronic Materials </li></ul><ul><li>An Approach to shipment visibility </li></ul>
    3. 3. The markets we serve <ul><li>Building and Construction </li></ul><ul><li>Electronics and Electronic Devices </li></ul><ul><li>Packaging </li></ul><ul><li>Household and Personal Care </li></ul><ul><li>Industrial </li></ul><ul><li>Water </li></ul><ul><li>Automotive </li></ul><ul><li>Food and Retail </li></ul>
    4. 4. Technology Polyurethanes <ul><ul><li>Amines </li></ul></ul>Sodium Chloride Borohydrides SiC, ZnSe, ZnS Structures MgO Acrylic, Styrenic & Vinyl Acetate Copolymers and Multipolymers Biocides Acrylic Monomers Mercaptans & Sulfides Polyesters Photoactive Materials Organometallics Plating Systems Water Soluble Polymers Abrasives Pigment Dispersions Photoactive Materials Functionalized Polymers Polybutadiene, PVDC Organic Synthesis Inorganics Radical Polymerization Condensation Polymerization
    5. 5. Technology Organic Synthesis Radical Polymerization Process Chemicals Automotive Coatings Coatings Consumer/ Industrial Specialties Powder Coatings Coatings Microelectronics Technologies Adhesives & Sealants Plastics Additives Process Chemicals Microelectronics Automotive Coatings Monomers Process Chemicals Plastics Additives Adhesives & Sealants Functional Coatings Plastics Additives Morton Salt Adv. Materials CMP Technologies Circuit Board Technologies Circuit Board Technologies Organic Synthesis Inorganics Radical Polymerization Condensation Polymerization
    6. 6. Rohm and Haas Today
    7. 7. Rohm and Haas Today <ul><li>2005 Sales – $ 7.9 B, 2006 P - $8.3 B </li></ul><ul><li>2005 EPS - $2.85/share, 2006 P - $3.30-$3.45/share </li></ul><ul><li>Investing in Electronic Materials, Coatings and Performance Chemicals </li></ul><ul><li>Growth plans focused in Asia Pacific and Central and Eastern Europe/Turkey </li></ul>
    8. 8. Agenda <ul><li>Rohm and Haas Today – Markets and Technologies </li></ul><ul><li>Air Freight at Rohm and Haas </li></ul><ul><li>Electronic Materials </li></ul><ul><li>An Approach to shipment visibility </li></ul>
    9. 9. Logistics’ Priority: <ul><li>Be a source of competitive advantage for our businesses by exceeding customer expectations in the execution of product delivery </li></ul>
    10. 10. Rohm and Haas Inter-Regional Logistics <ul><li>Annual Freight Spend: $460MM </li></ul><ul><li>Maritime: Approximately 35,000 TEU and $55MM spend </li></ul><ul><li>Air: $10MM annually </li></ul><ul><li>Growth areas </li></ul><ul><ul><li>Asia – shift from net importer to exporter </li></ul></ul><ul><ul><li>North America – growing import volumes </li></ul></ul><ul><ul><li>Intra-Asia (maritime and air) </li></ul></ul>
    11. 11. Air Freight <ul><li>Chemicals: Used sporadically – generally emergency customer orders where marine has failed </li></ul><ul><li>SOP for Electronic Materials, where air comprises around 80% of freight spend </li></ul>
    12. 12. Agenda <ul><li>Rohm and Haas Today – Markets and Technologies </li></ul><ul><li>Air Freight at Rohm and Haas </li></ul><ul><li>Electronic Materials </li></ul><ul><li>An Approach to shipment visibility </li></ul>
    13. 13. Electronic Materials <ul><li>Markets • Printed Circuit Boards • Printed Wiring Boards • Embedded Passives </li></ul><ul><li>Optoelectronics </li></ul>Markets • Semiconductors • ICs • Microprocessors • Wafer Substrates • Disk Drives • Optics Markets • Electronic Components • Electronic Packaging • High Performance Finishes • Optoelectronics • Tin Mill Products Markets • ASICS • Logic • DRAM • Flash • Compound Semiconductors • Thin Film Head
    14. 14. Microelectronic Technologies Today - ATC Cleanroom The ATC is currently outfitted with 1,500 ft² for cleanroom space, which is configured with one of the industry's most advanced 193 nm lithography cells. Another 3,500 ft² of cleanroom space is available for expansion and the ballroom-style cleanroom space enables easy access for demo and tool rotation.
    15. 15. Chemical Mechanical Polishing (CMP) Hsinchu Plant
    16. 16. Market Priorities <ul><li>Exceeding the expectations of a demanding market </li></ul><ul><li>Keeping the customer supplied </li></ul><ul><li>High supplier qualification costs, but poor supplier reliability would open the door </li></ul>
    17. 17. Challenges <ul><li>Technology traditionally US-based </li></ul><ul><li>Market shifting from Taiwan/Korea/Singapore to China </li></ul><ul><li>New CMP plant in Taiwan to supply Singapore, China and Taiwan </li></ul><ul><li>Managing expectations in high demand period – allocations and “rush” orders </li></ul>
    18. 18. Current Issues - China <ul><li>Cold Chain Requirements 2 – 8 degrees C </li></ul><ul><li>Haz Mat restrictions on Class 3 and 8 (flammables and oxidizers)= Cargo aircraft only </li></ul><ul><li>Precise documentation/labeling </li></ul><ul><li>No visible damages to cartons </li></ul><ul><ul><li>Forwarder role </li></ul></ul><ul><li>Shipment Visibility – Forwarder provided </li></ul>
    19. 19. Current Issues – Shipment Status
    20. 20. Shipment Visibility – In House or Out Source?? <ul><li>No 3PL-driven global platform today </li></ul><ul><li>In House solution complex and time consuming </li></ul><ul><li>Elemica as carrier communications hub </li></ul><ul><li>3PL/Forwarder as filler of information “data gaps” </li></ul>
    21. 21. Evolution of information tools <ul><li>Regional Freight Forwarder Alerts </li></ul><ul><ul><li>Pilot In Use, by International Trade Group NAR </li></ul></ul><ul><li>Global “one stop shopping” </li></ul><ul><ul><li>Carriers integrated and providing EDI messages </li></ul></ul><ul><ul><li>Alert Management (Management By Exception) </li></ul></ul><ul><ul><li>Global (INTL) view </li></ul></ul><ul><li>Regional Freight Forwarder / Broker “Track and Trace” tools </li></ul><ul><li>Calling the Export / Import group for Shipment Status info. </li></ul>
    22. 22. Thank You!

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