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Understanding The Vpx Redi
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Understanding The Vpx Redi

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The PPT will provide specific design inputs for Conduction cooled VPX system design

The PPT will provide specific design inputs for Conduction cooled VPX system design

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  • 1. Understanding ofREDI Kamal Raj Krishnan
  • 2. AGENDA INTRODUCTION To REDI FORM FACTORS INTRODUCTION - Air Cool Design  Design Considerations  Important Rules to remember INTRODUCTION – Conduction Cool Design  Design Considerations  Important Rules to remember Any Questions..
  • 3. INTRODUCTION - REDI REDI is the Mechanical specification of ruggedized electronics system and it is defined by VITA48 Standard. REDI – Ruggedized Enhanced Design Implementation This REDI standard defines the mechanical design Implementation for Plug in Units in VPX system Environment REDI defines Various Thermal Management Mechanical Design implementations namely the Air Cooling, Conduction Cooling, Liquid Cooling based on classified standards VITA 48.1, 48.2, 48.3.. REDI defines two types of Plug In Units namely TYPE1 and TYPE2 TYPE1 Plug-In Units are compatible for handling in 2 Level Maintenance Environments where TYPE2 Plug-In Units requires required precaution in handling Primary Difference between TYPE1 & TYPE2 units is the presence of External covers REDI supports the 0.8”, 0.85” and 1.0” Pitch Plugging on Back Plane
  • 4. REDI – FORM FACTORS REDI recommends two Board Sizes as 3U [100mm X 160mm] and 6U [233.35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0.8” & 0.85” plug-in unit scheme. It is 12mm where 1.0” pitch Plug-in unit scheme. In this Sufficient Package area to be planned for protective cover for TYPE1 Card
  • 5. REDI – Introduction to Air Cool Mechanism REDI Air cool mechanism defined by VITA48.1 standard specification For Conductive elements such as Frame Covers - Need not to connect toPCB electrically except connecting to Safety Ground
  • 6. REDI –Air Cool Mechanism This STD VITA48.1 defines Minimum PCB thickness as 0.06” It defines the mechanical interface specifications of components namely Main PCB, Main Frame, PMC/XMC, PMC/XMC Cover, and Secondary cover as it is indicated in the Image For main board Connector Protection, Primary Cover, PMC/XMC Cover and Secondary cover can be extended up to connector Edge
  • 7. REDI –Air Cool Mechanism Cover Thickness & extension specification is indicated in following tableNF – Not Feasible, FwR-Feasible with Risk, F-Feasible
  • 8. REDI –Air Cool Mechanism 3U Air Cooled Plug-in Unit – Form factors
  • 9. REDI –Air Cool Mechanism Primary side Cover provides following  Accepts PMC/XMC and Cover for PMC/XMC  EMC Compatibility & ESD Protection  Maintains the managed Air flow paths in air-cooled applications  Can contain Insertion / Extraction Features Secondary Side Cover provides following  EMC Compatibility & ESD Protection  Provides protection for secondary side components  Maintains the managed Air flow paths in air-cooled applications
  • 10. REDI –Air Cool Mechanism Secondary Side Cooling should be carefully evaluated particularly for 0.8” & 0.85” because of limited Gap between Secondary cover to PCB. This is likely to be High Pressure Flow path where cooling air requirements are high Component Layout can be critical to proper plug-in unit Cooling. The Layout should consider the flow direction, shadowing effect, air preheating, re-circulation etc.. The Direction of Airflow should be as shown in image
  • 11. REDI –Air Cool Mechanism – Important Rules to Remember Rule 7-4: Thickness of Plu-in unit that interface with sub Rack’s Card Guide shall be 1.6mm +-0.2mm. But if Thicker PCB is recommended, then the distance from Primary side of PCB to Outside of Secondary cover is to be maintained as per Pitch of Plug-in units Rule 7-5: Covers shall be electrically connected to safety ground with resistance not to exceed 100mohm Rule 7-9: Maximum Plug-in Width is defined by following Table Rule 7-11, 7-12: Primary & Secondary Side Cover is mandatory for TYPE1 and it is not required for TYPE2 implementations Rule 13-1: In Order to achieve 2 Level maintenance, Type1 Plu-in units shall comply with ESD requirements of VITA 47
  • 12. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism is defined by VITA 48.1 It defines the detailed mechanical implementation for conduction cool mechanism for PCB/Plug-In Units which is defined by VITA 46 In Conduction Cooled System, there are two important components namely Frame and Cover. Frame used to transfer the heat from PCB/components to Sub rack and Cover is used to cover the Both side of Plug-In units with support of ESD suppression Cover Plate differentiates the TYPE1 & TYPE2 Cards The PCB thickness can be variable from 0.06” [1.5mm] to 0.12”[3.048mm] and Even Thicker PCB also can be accommodated based on considering the Guide Rail Thickness and so PCB is limited on following  For Primary Side Retainer design – 0.137”[3.48mm]MAX  For secondary side Retainer Design – 0.112”[2.85mm]MAX
  • 13. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism defines 2 way implementation the Design based on retainer placement.  Primary Side Retainer  Secondary side Retainer
  • 14. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism Supports Connector Side Protections as it is indicated by image
  • 15. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism – Primary Side Retainer
  • 16. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism – Secondary Side Retainer
  • 17. REDI –Conduction Cool Mechanism REDI conduction Cool mechanism – Retainer Position  Plug-In Unit along with Retainer plugged on Guide Rail of Chassis with Gap of 13.34mm  In Retainer Relaxed State, thermal interface side should not have any gap with Rack Wall and Retainer side will have 0.76mm gap. Total Plug-in unit Thickness on Guide Rail is 12.57mm  In Retainer tightened state, Total Plug-in Unit Thickness will be 13.3mm  Card Guide Depth is 9.19mm to 10.41mm
  • 18. REDI –Conduction Cool Mechanism – Guidance on Cooling Component Layout can be critical to proper plug-in unit cooling. The layout should consider the how each component cooling, length and cross sectional area of heat transfer paths etc.. The conduction contact area for heat transfer from plug-in unit is dependant on several factors, including the depth of card, the presence of air cooled card guide projection.
  • 19. REDI –Conduction Cool Mechanism – Important Rules to Remember Rule 6-1: For Type1 Implementations, Both Primary & Secondary side covers shall be required Rule 6-12: Covers shall be electrically connected to safety ground with resistance not to exceed 100mohm Rule 6-11: Maximum Plug-in Width is defined by following Table Rule 7-11, 7-12: Primary & Secondary Side Cover is mandatory for TYPE1 and it is not required for TYPE2 implementations Rule 13-1: In Order to achieve 2 Level maintenance, Type1 Plu-in units shall comply with ESD requirements of VITA 47
  • 20. REDI - VPX Any Questions for Discussion..........