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Metro IMAPS Vendor Day
Introduction to High Temperature Electronics

By Tom Terlizzi GM Systems
November 19, 2013 Clarion ...
PURPOSE
◆ 

A BRIEF INTRODUCTION INTO THE WORLD
OF HIGH TEMPERATURE ELECTRONICS

2
AGENDA
◆ 
◆ 

3

DEFINE HIGH TEMPERATURE ELECTRONICS
DESCRIBE SOME APLICATIONS
WHAT ARE TYPICAL INTEGRATED CIRCUIT
MILITARY OPERATING TEMPERATURE RANGES?
MIL-PRF-38535
MAXIMUM JUNCTION AND
STORAGE TEMP...
DEFINITION OF HIGH TEMPERATURE
ELECTRONICS?
◆ 

NO INDUSTRY STANDARDS OR AGREEMENT

◆ 

“ELECTRONICS OPERATING AT TEMPERAT...
JET ENGINE TEST
JET ENGINE TEST STAND

ROTOR

JET ENGINE CROSS SECTION

6
TELEMETRY HYBRID CROSS SECTION
ALUMINUM WIRE BONDABLE
THICK FILM GOLD

1 MIL GOLD WIRE
FROM SUBSTRATE TO PINS

1 MIL ALUMI...
JET ENGINE TELEMETRY SYSTEM

8

US PATENT 20080224845 A1
R. BIRES - PRATT AND WHITNEY

TELEMTRY HYBRID
COMMERCIALLY AVAILABLE TELEMETRY
SYSTEMS

9
DOWNHOLE APPLICATIONS

10
DOWNHOLE APPLICATIONS

APPROXIMATELY
~20oC INCREASE
IN TEMPERATURE
PER KILOMETER DEPTH

11
NASA HIGH TEMPERATURE ELECTRONICS

12
NASA HIGH TEMPERATURE ELECTRONICS
Wide Band Gap=GaN or SiC
BS = BULK SILICON
SOI=SILICON N INSOLATOR

High-Temperature Ele...
IMAPS HiTEC 2014

14
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Imaps presentation-high-temp-electronics-11-19-13

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Introduction to high temperature electronics
greater than 150 degree C.

Published in: Business, Technology
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Transcript of "Imaps presentation-high-temp-electronics-11-19-13"

  1. 1. Metro IMAPS Vendor Day Introduction to High Temperature Electronics By Tom Terlizzi GM Systems November 19, 2013 Clarion Hotel, Ronkonkoma, N.Y
  2. 2. PURPOSE ◆  A BRIEF INTRODUCTION INTO THE WORLD OF HIGH TEMPERATURE ELECTRONICS 2
  3. 3. AGENDA ◆  ◆  3 DEFINE HIGH TEMPERATURE ELECTRONICS DESCRIBE SOME APLICATIONS
  4. 4. WHAT ARE TYPICAL INTEGRATED CIRCUIT MILITARY OPERATING TEMPERATURE RANGES? MIL-PRF-38535 MAXIMUM JUNCTION AND STORAGE TEMPERATURE o 150 C MAXIMUM OPERATING o TEMPERATURE 125 C 4
  5. 5. DEFINITION OF HIGH TEMPERATURE ELECTRONICS? ◆  NO INDUSTRY STANDARDS OR AGREEMENT ◆  “ELECTRONICS OPERATING AT TEMPERATURES IN EXCESS OF THOSE NORMALLY ENCONTERED BY CONVENTIONAL SILICON-BASED SEMICONDUCTORS OR THEIR AUXILLARY COMPONENTS.”1 ◆  TYPICALLY >125oC OR >150oC BUT SOME REPORTED o LAB WORK TO 600 C. 1 5 “High Temperature Electronics” Richard Grzybowski, page 2 By F. Patrick McCluskey, Thomas Podlesak,
  6. 6. JET ENGINE TEST JET ENGINE TEST STAND ROTOR JET ENGINE CROSS SECTION 6
  7. 7. TELEMETRY HYBRID CROSS SECTION ALUMINUM WIRE BONDABLE THICK FILM GOLD 1 MIL GOLD WIRE FROM SUBSTRATE TO PINS 1 MIL ALUMINUM WIRE FROM IC’S, THIN FILM RESISTORS AND TRANSISTORS TO SUBSTRATE THICK FILM SUBSTRATE MOUNTED WITH THIXOTROPIC EPOXY TO PACKAGE PLUG IN METAL HYBRID HERMETIC SIDE WALL DIP PACKAGE 150oC & 20KG’S FOR >2000 HOURS ◆  7 ◆  MONOMETALLIC ON SEMI’S AND CHIP RESISTORS
  8. 8. JET ENGINE TELEMETRY SYSTEM 8 US PATENT 20080224845 A1 R. BIRES - PRATT AND WHITNEY TELEMTRY HYBRID
  9. 9. COMMERCIALLY AVAILABLE TELEMETRY SYSTEMS 9
  10. 10. DOWNHOLE APPLICATIONS 10
  11. 11. DOWNHOLE APPLICATIONS APPROXIMATELY ~20oC INCREASE IN TEMPERATURE PER KILOMETER DEPTH 11
  12. 12. NASA HIGH TEMPERATURE ELECTRONICS 12
  13. 13. NASA HIGH TEMPERATURE ELECTRONICS Wide Band Gap=GaN or SiC BS = BULK SILICON SOI=SILICON N INSOLATOR High-Temperature Electronics—A Role for Wide Bandgap Semiconductors PHILIP G. NEUDECK, SENIOR MEMBER, IEEE, ROBERT S. OKOJIE, MEMBER, IEEE, AND LIANG-YU CHEN 13
  14. 14. IMAPS HiTEC 2014 14
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