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IBM Power 7 processor technology with focus on the IBM i.

IBM Power 7 processor technology with focus on the IBM i.

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Ibm power7 Ibm power7 Presentation Transcript

  • Tom Presotto - October 2010
  • A long walk … together IBM Vimercate S/38 manufacturing plant. February 79 S/38 August 79
  • Back to the basis SOA & Cloud 1979 – Mainframe and “dumb” terminals 2010 – Cloud Computing 1990 – 2010 and browser Windows client-server model
  • POWER7 POWER8 POWER6™ 45 nm POWER5™ 65 nm POWER4™ 130 nm 180 nm 2010 2007 2004 2001 POWER5 POWER5+™ POWER6 POWER7 Technology 130 nm 90 nm 60 nm 45 nm Size 389 mm2 245 mm2 341 mm2 567 mm2 Transistors 276 M 276 M 790 M 1.2 B Cores 2 2 2 4/6/8 Frequencies 1.65 GHz 1.9 GHz 3-5 GHz 3-4 GHz L2 Cache 1.9 MB Shared 1.9 MB Shared 4 MB / Core 256 KB / Core L3 Cache 36 MB 36 MB 32 MB 4 MB / Core Memory Cntrl 1 1 2/1 2/1 LPAR 10 / Core 10 / Core 10 / Core 10 / Core 4
  • Performance per Watt POWER4™ POWER4+™ POWER5™ POWER5+™ POWER6™ POWER6™ POWER7™ p670 p670 p5-570 p570 Power 570 Power 570 Power 780 1.1 GHz 1.5 GHz 1.65 GHz 1.9 GHz 4.7 GHz 4.2 GHz 3.8 GHz rPerf: 24.46 rPerf: 46.79 rPerf: 68.4 rPerf: 85.20 rPerf: 134.35 rPerf: 193.25 rPerf: 685.09 KWatts: 6.71 KWatts: 6.71 KWatts: 5.2 KWatts: 5.2 KWatts: 5.6 KWatts: 5.6 KWatts: 6.4 3.64 6.97 13.15 16.38 23.99 34.56 107.04
  • POWER7 Core • 4 Way SMT per core – up to 4 Eight threads per core • 32 Threads per chip processor • L1: 32 KB I Cache / 32 KB D Cache cores • L2: 256 KB per core • L3: Shared 32MB on chip eDRAM Binary Compatibility with POWER6 Transistors: 1.2 B 6
  • POWER7 Core POWER7 POWER7 POWER7 POWER7 12 Execution Units CORE CORE CORE CORE L2 Cache L2 Cache L2 Cache L2 Cache • 2 Fixed Point Units • 2 Load Store Units MC0 L3 Cache and MC1 • 4 Double Precision Chip Interconnect Floating Point Units L2 Cache L2 Cache L2 Cache L2 Cache • 1 Branch • 1 Condition POWER7 POWER7 POWER7 POWER7 Register CORE CORE CORE CORE • 1 Vector Unit • 1 Decimal Floating Point Unit 64-bit PowerPC architecture v2.07 Modes: POWER6, POWER6+ and POWER7 7
  • L3 Cache Local SMP Links POWER7 POWER7 POWER7 POWER7 6-to-1 F latency CORE A CORE CORE CORE improvement S L2 Cache T L2 Cache L2 Cache L2 Cache L3 REGION MC0 L3 Cache and MC1 Chip Interconnect L2 Cache L2 Cache L2 Cache L2 Cache On chip 2x POWER7 POWER7 POWER7 POWER7 20% energy of SRAM cache bandwidth improvement CORE CORE CORE CORE benefits Remote SMP & I/O Links eDRAM No off-chip drv & rcv Fast Local Regions Shared L3 Cache Intelligent cache management
  • POWER6 POWER7 Alti Alti Vec Core Core Vec P Core Core Core Core O S W L2 M L2 L2 L2 E P R L3 4 MB 4 MB L3 G F L3 Ctrl L2 L2 Ctrl L3 L3 Cache X A B B R U L2 L2 L2 L2 I S C Fabric Bus Core Core Core Core Controller Memory Memory Cntrl Cntrl Memory Interface GX Bus Cntrl Memory++ GX+ Bridge Memory+ Memory+ POWER7 delivers up to 3 - 4X the performance with less energy than POWER6
  • POWER5 POWER6 POWER7 2 memory controller Up to 256GB of memory D D D D D D D D D D D D D D D D D D D D R R R R R R R R R R 3 3 3 3 3 3 3 3 3 3 DDR2 @ 553 MHz DDR2 @ 553 / 667 MHz DDR3 @ 1066 MHz Effective Bandwidth: Effective Bandwidth: 1.1 GB/s 2.6 GB/s Effective Bandwidth: 6.4 GB/s 10
  • Less power requirements EDRAM Cell Fewer soft errors Enables POWER7 to provide 32MB of internal L3 Cache 1/5 the standby power 1/3 the space of conventional 6T SRAM implementation Better performance Greater density 1.5 Billion reduction in transistors 11
  • POWER7 TurboCore™ Mode TurboCore Chips: 4 available cores Power 780 TurboCore Aggregation of L3 Caches of unused Core Core Core Core cores. P S O W M L2 L2 L2 L2 TurboCore chips have a 2X the L3 Cache E P per Chip available R G 32 MB F 4 TurboCore Chips L3 = 32 MB X L3 Cache A B B L2 L2 L2 L2 R Provides up to 1.5X per core to core U S I Core Core Core Core C Chips run at higher frequency Memory Interface Power reduction of unused cores. With “Reboot”, System can be TurboCores Unused reconfigured to 8 core mode. Core 12
  • POWER7 Core / Cache options 6-Core Chip 4-Core Chip P Core Core Core Core S P Core Core Core Core S O O W M W M L2 L2 L2 L2 L2 L2 L2 L2 E P E P R R G F G 16 MB L3 Cache F X 24 MB L3 Cache X A A B B B L2 L2 L2 L2 R B L2 L2 L2 L2 R U U S I S I Core Core Core Core C Core Core Core Core C Memory Interface Memory Interface Power 750 / Power 770 PS700 13
  • Multi-threading Evolution Single thread Out of Order S80 Hardware Multi-thread FX0 FX0 FX1 FX1 FP0 FP0 FP1 FP1 LS0 LS0 LS1 LS1 BRX BRX CRL CRL POWER5 2 Way SMT POWER7 4 Way SMT FX0 FX0 FX1 FX1 FP0 FP0 FP1 FP1 LS0 LS0 LS1 LS1 BRX BRX CRL CRL No Thread Executing Thread 0 Executing Thread 1 Executing Thread 2 Executing Thread 3 Executing 14
  • POWER7 4 way SMT 2 1,5 1 Requires • POWER6 Mode supports SMT1 and POWER7 SMT2 Mode 0,5 Operating • AIX 6.1 and AIX 7.1 System • IBM i 6.1 and 7.1 Support • Linux 0 SMT1 SMT2 SMT4 Dynamic • Spread work among cores to execute in appropriate threaded mode Runtime SMT • Can dynamical shift between modes as Standard Cache Option scheduling required: SMT1 / SMT2 / SMT4 All cores active 15
  • Active Memory Expansion True True True Expanded Expanded Expanded Memory Memory Memory Memory Memory Memory True True True Expanded Expanded Expanded Memory Memory Memory Memory Memory Memory Expand memory beyond physical limits More effective server consolidation • Run more application workload / users per partition • Run more partitions and more workload per server Effectively up to 100% more memory
  • Active Memory Sharing Around the World 15 Memory Usage (GB) 10 Asia Americas Europe 5 Moves 0 Time AXI, IBM memory Day and Night i, and 15 from one Memory Usage (GB) Linux 10 partition Night Day partitions 5 to another 0 Time Infrequent Use 15 #10 #9 Memory Usage (GB) #8 10 #7 #6 #5 5 #4 #3 #2 0 Time #1
  • EnergyScale™ EnergyScale is used to dynamically optimizes the processor performance versus processor power and system workload IBM Systems Director is also required to manage AEM functions and supports the following functions: • Power Trending • Thermal Reporting • Static Energy Saver Mode • Dynamic Energy Saver Mode • Energy Capping • Soft Energy Capping • Processor Nap • Energy Optimized Fan Control • Altitude Input • Processor Folding 18 18
  • TPMD: Thermal Power Management Device TPMD monitor power usage and temperatures in real time TPMD function is Can adjust the comprised of a risk processor power processor and data and performance acquisition in real time If the temperature exceeds an upper TPMD card is (functional) threshold, TPMD actively part of the base reduces power consumption by reducing hardware processor voltage and frequency or configuration. throttling memory as needed. 19
  • POWER7 “Over Clock” Uplift Nominal Over Clock 4,4 If the temperature is lower than upper 4,2 (functional) threshold, TPMD will allows POWER7 cores to “Over clock” if 4 workloads demands are present. 3,8 3,6 3,4 3,2 3 20
  • Offerings - April 2010 Power 770 PS700 Express PS701 Express PS702 Express Power 780 Power 750 Express Power 755
  • New models August 2010 Power 795 Power 780 Power 770 Power 750 Power 720/740 HPC Power 755 Power 710/730 PS Blades
  • Power 710 4-6-8 core  1 socket  Processor module – pick ONE  4-core: 3 GHz 2U  6-core: 3.7 GHz  8-core: 3.55 GHz For 4-core (1 socket) For 6-/8-core (1 socket) – Zero 12X I/O loops – Zero 12X I/O loops – Max 1 4X IB Adapter – Max 1 4X IB Adapter – Max 64 GB memory – Max 64 GB memory – Disk-only drawers – Disk-only drawers – Fibre Channel cards ok – Fibre Channel cards ok – IBM i P05 tier (users) – IBM i P10 tier (users) – AIX small tier – AIX small tier
  • Power 730 8-12-16 core  2 sockets  Processor module – pick 2U TWO of the same feature  4-core: 3 GHz  4-core: 3.7 GHz  6-core: 3.7 GHz  8-core: 3.55 GHz For 8-/12-/16-core – Zero 12X I/O loops – Max 2 4X IB Adapters – Max 128 GB memory – Disk-only drawers ok – Fibre Channel cards ok – IBM i P20 tier (5250) – AIX small tier
  • Power 720 4-6-8 core  1 socket  Processor module – pick ONE 4U  4-core: 3 GHz  6-core: 3 GHz  8-core: 3 GHz For 4-core For 6-/8-core – Zero 12X I/O loops – Max 1 12X I/O loop – Max 64 GB memory – Max 128 GB memory – Zero disk-only drawers – Disk-only drawers – Fibre Channel cards ok – Fibre Channel cards ok – IBM i P05 tier (users) – IBM i P10 tier (users) – AIX small tier – AIX small tier
  • Power 740 4-6-8-12-16 core  1 or 2 sockets 4U  Pick processor modules  1 or 2: 4-core: 3.3 GHz  1 or 2: 4-core: 3.7 GHz  1 or 2: 6-core: 3.7 GHz  2: 8-core: 3.55 GHz For 4-,6-core (1 socket) For 8-,12-,16-core (2 socket) – Max 1 12X I/O loop – Max 2 12X I/O loops – Max 128 GB memory – Max 256 GB memory – IBM i P20 tier – IBM i P20 tier 5250 Entitlements 5250 Entitlements – AIX small tier – AIX small tier
  • POWER7 delivers outstanding performance CPW 80,000 60,000 40,000 20,000 525 550 520 550 720 740 POWER5 POWER5 POWER6 POWER6 POWER7 POWER7 Single core CPW 3800 4700 5950 NB CPW measured in maximum system and I/O configuration
  • Power 750 4 Socket 4U 6 or 8 cores per socket 3.0 to 3.55 GHz Energy-Star Qualified 28
  • Power 750 System Overview TPMD 3 PCIe & 2 PCI-X Slots Dual Power Supplies Half-High Bay Up to 4 (tape or removable disk Processor / Memory DVD Cards Fans 8 SFF Bays (Disk or SSD) 29
  • Power 750 System 6 Cores @ 3.3 GHz POWER7 Architecture 8 Cores @ 3. 0, 3.3, 3.55 GHz Max: 4 Sockets DDR3 Memory Up to 512 GB Up to 8 Drives (HDD or SSD) System Unit SAS SFF Bays 73 / 146 / 300GB @ 15k (2.4 TB) (Opt: cache & RAID-5/6) PCIe x8: 3 Slots (2 shared) System Unit PCI-X DDR: 2 Slots IO Expansion Slots 1 GX+ & Opt 1 GX++ 12X cards Integrated SAS / SATA Yes System Unit 3 USB, 2 Serial, 2 HMC Integrated Ports Quad 10/100/1000 Integrated Virtual Ethernet Optional: Dual 10 Gb System Unit Media Bays 1 Slim-line DVD & 1 Half Height IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = 8 MAX Cluster 12X SDR / DDR (IB technology) Redundant Power and Yes (AC or DC Power) Cooling Single phase 240 VAC or -48 VDC Certification (SoD) NEBS / ETSI for harsh environments Active Thermal Power Management EnergyScale 30 Dynamic Energy Save & Capping
  • Power 755 Power 755 and Power 750 hardware is very, very similar, but Power 755 offering is customized to High Performance Computing environment 31
  • Power 755 4 Processor Sockets = 32 Cores POWER7 Architecture 8 Core @ 3.3 GHz DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots System Unit Up to 8 disk or SSD SAS SFF Bays 73 / 146 / 300GB @ 15K (up to 2.4TB) PCIe x8: 3 Slots (1 shared) System Unit PCI-X DDR: 2 Slots Expansion GX++ Bus Integrated Ports 3 USB, 2 Serial, 2 HMC Quad 1Gb Copper Integrated Ethernet (Opt: Dual 10Gb Copper or Fiber) System Unit Media Bay 1 DVD-RAM ( No supported tape bay ) Up to 64 nodes Cluster Ethernet or IB-DDR Yes (AC or DC Power) Redundant Power Single phase 240vac or -48 VDC Certifications (SoD) NEBS / ETSI for harsh environments Active Thermal Power Management EnergyScale Dynamic Energy Save & Capping 32
  • The highest performing 4-socket system on the planet POWER7 continues to break the rules with more performance SPECint_rate Itanium SPARC x86 POWER7 HP rx6600 Sun T5440 HP DL585 Power 755 with PowerVM 33
  • The most energy efficient 4-socket system on the planet Most energy efficient systems Performance Per Watt Itanium SPARC Sun x86 POWER7 HP rx6600 T5440 HP DL585 Power 755 with PowerVM 34
  • Power 770 12 or 16 core 4U Nodes Up to 4 Nodes per system 3.1 and 3.5 GHz Capacity on Demand Enterprise RAS 35
  • Power 770 Power 770 6 Cores @ 3.55 GHz Processor Technology 8 Cores @ 3.1 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Hot Add Support Yes 4U x 32 inches Depth Hot Service Yes System Unit Single Enclosure 4 Enclosures Processors Up to 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2/1 8/4 PCIe bays 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Std: Quad 1Gb Std: Four Quad 1Gb Integrated Ethernet Opt: Dual 10Gb + Opt: Four x Dual 10Gb + Dual 1 Gb Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X 36
  • Power 780 New Modular High-End Up to 64 Cores TurboCore 3.86 or 4.14 GHz Capacity on Demand Enterprise RAS 24x7 Warranty PowerCare 37
  • Power 780 Power 780 4 Cores @ 4.1 GHz TurboCore Processor Technology 8 Cores @ 3.8 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Hot Add Support Yes Hot Service Yes System Unit Single Enclosure 4 Enclosures Processors 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays (CEC) 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2/1 8/4 PCIe (CEC) 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Std: Quad 1Gb Std: Four Quad 1Gb Integrated Ethernet Opt: Dual 10Gb + Dual Opt: Four x Dual 10Gb + 1 Gb Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X 38
  • Power 795 ✓New High-end ✓24 to 256 Cores ✓8 TB memory ✓TurboCore ✓3.7, 4.0 or 4.25 GHz ✓1,000 VMs* with PowerVM ✓Capacity on Demand ✓Enterprise RAS ✓24x7 Warranty ✓PowerCare On October 7, IBM published a new SAP 2-tier Sales and Distribution benchmark result on the Power 795. The result is 70,032 users on a 128-core Power 795 running AIX and DB2. This is the highest result ever attained on this benchmark.
  • Power Systems Blades ✓PS700 1 socket 4 core ✓PS701 1 socket 8 core ✓PS702 2 socket 16 core ✓3.0 GHz
  • POWER7 PS700 Blade 4 Cores Architecture 4 Core Single Socket Fiber Support Yes (via BladeCenter chassis) L2 & L3 Cache On Chip Media Bays 1 BladeCenter chassis DDR3 Memory Up to 64 GB Redundant Yes BladeCenter chassis Power DASD / Bays 0 - 2 SAS (300/600GB) Redundant Yes BladeCenter chassis Cooling Daughter Card CIOv & CFFh Service Options ( PCIe Adapters ) Yes Processor Integrated Dual Port Gbt Ethernet Power & Options Ethernet, USB POWER Save / Power Cap Thermal 41
  • POWER7 PS701 Blade 8 Cores Architecture 8 Core Single Socket Fiber Support Yes (via BladeCenter chassis) L2 & L3 Cache On Chip Media Bays 1 BladeCenter chassis DDR3 Memory Up to 128 GB Redundant Yes BladeCenter chassis Power DASD / Bays 0 - 1 SAS (300/600GB) Redundant Yes BladeCenter chassis Cooling Daughter Card CIOv & CFFh Service Options ( PCIe Adapters ) Yes Processor Integrated Dual Port Gbt Ethernet Options Ethernet, USB Power & Thermal POWER Save / Power Cap 42
  • POWER7 PS702 Blade 16 Cores Architecture 8 Cores/Socket Two Socket Fiber Support Yes (via BladeCenter chassis) L2 & L3 Cache On Chip Media Bays 1 BladeCenter chassis DDR3 Memory Up to 256 GB Redundant Yes BladeCenter chassis Power DASD / Bays 0 - 2 SAS (300/600GB) Redundant Yes BladeCenter chassis Cooling Daughter Card CIOv & CFFh Service Options ( PCIe Adapters ) Yes Processor Integrated Quad Port Gbt Ethernet Power & Options Ethernet, USB POWER Save / Power Cap Thermal 43
  • i Edition Express for BladeCenter S i Edition Express for BladeCenter S BladeCenter PS700 or JS12 IBM i PowerVM Express BladeCenter S IBM i preloaded The i Edition Express for BladeCenter S is the perfect alternative to a traditional rack or tower server with comparable starting prices and enables clients to run their i applications and consolidate x86 servers into a single BladeCenter S chassis that supports up to six blades and over 7 terabytes of disk storage 44
  • Power Systems Virtualization Hypervisor •Support for multiple operating environments Dynamic Logical •Micro-partitioning, resource movement Partitioning Multiple Shared •Cap processor resources for a group of partitions Processor Pools Virtual I/O Server •Virtualizes resources for client partitions Integrated Virtualization •Simplifies partition management for entry systems Manager Lx86 •Supports x86 Linux applications Live Partition Mobility •Move running AIX and Linux partitions Active Memory Sharing •Share a memory pool among partitions VIOS Power Hypervisor
  • IBM i 7.1 Highlights  DB2  Support for XML and column level encryption VIOS  PowerHA  Async Geographic Mirroring & LUN-level switching IBM i 6.1 IBM i 7.1  Virtualization Power Systems  IBM i 6.1 virtualization for i 7.1 partitions  Solid State Drives  Automatic movement of hot data to SSDs  Workload Capping  Limit # of cores used by middleware within a partition  Open Access for RPG  Extend application reach to pervasive devices  Zend Server Community Edition  PHP environment preloaded with IBM i  Systems Director  Richer management of IBM i via Systems Director
  • Traditional IBM i Workload management  IBM i Workload Management  Subsystems provide workload isolation  Priorities are used to schedule work  No way to cap a given application to a subset of the processor resources in a partition  All workloads can access the full number of Cores in the Partition Application 1 = 8 Cores Application 2 = 8 Cores Application 3 = 8 Cores IBM i System / Partition
  • IBM i Workload Capping  IBM i workload capping can control workloads by limiting the number of cores that can be used by an application Application 1 = 3 Cores Application 2 = 6 Cores Application 3 = 8 cores IBM i System / Partition
  • Back to the basis Back to the future
  • IBM i and Cloud Computing • Best platform for “private cloud” • Centralized model • Server consolidation • Bring back the complexity into the “computer room” • No more “personal” workstations and company’s data stored on users’ disks • Low-TCO terminals • SOA approach to integrate third party “SaaS” solutions A rack with a single Power 750 server and 32 processor cores can run up to 160 IBM refreshes CloudBurst line virtual machines, while the top end with Power7 chips - 14 October system, with 11 Power 750 servers in five 2010 racks, can run up to 2,960 virtual machines, 50
  • tom.presotto@evog.it