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Dynamic & Proto Circuits Inc.  Corporate Presentation                                1
DAPC Facility54,000 Sq.ft./6,000 Sq.M                           2
Multilayer Process                     3
Solder Mask Options                                   BLUE                           BLACK                     RED        ...
Investing in TechnologyNew equipment to optimize our   production and delivery        capabilities                        ...
HASL MachineThe HAL5224 Hot Air Solder LevelingSystem is designed to provide thehighest quality solder leveling at highthr...
High Speed / Small Hole N/C Drilling Equipment                                        The Schmoll Drilling                ...
Mass VCP-5001 Via Plugging   MachineThis machine is designed tofill holes in printed circuitboards with conductive ornon-c...
Soldermask Coater                    The DP-1500 applies all                    types of liquid                    photoim...
Technology RoadmapsMaterials and Manufacturing        Capabilities                              10
Technology Roadmap        Attribute                              Standard       Advanced           2012  Minimum Line Spac...
Technology Roadmap continued  Attribute                                   Standard   Advanced   2012  Materials  FR4      ...
Substrate MaterialsStandard                                                     Dielectric                                ...
Substrate Materials                                     High Frequency Materials (core material only)                 Supp...
North AmericanTop Tier Customers                     15
Let the DAPC team get started    on your project today!                                16
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New corporate presentation july 2010

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Dynamic & Proto Circuits Corporate Presentation.

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Transcript of "New corporate presentation july 2010"

  1. 1. Dynamic & Proto Circuits Inc. Corporate Presentation 1
  2. 2. DAPC Facility54,000 Sq.ft./6,000 Sq.M 2
  3. 3. Multilayer Process 3
  4. 4. Solder Mask Options BLUE BLACK RED GREEN DRY FILMCLEAR 4
  5. 5. Investing in TechnologyNew equipment to optimize our production and delivery capabilities 5
  6. 6. HASL MachineThe HAL5224 Hot Air Solder LevelingSystem is designed to provide thehighest quality solder leveling at highthroughput rates while preserving thehighest reliability and serviceabilitystandards available.Argus International has been designing,building and operating HASL systemsfor over a decade. The experienceearned in a decade of dedication toengineering the HASL process isevident by the high quality workproduced. 6
  7. 7. High Speed / Small Hole N/C Drilling Equipment The Schmoll Drilling machines have 6 (six) stations per drilling machine and allow DAPC to be more efficient in drilling panels with a large volume of vias at a rapid speed and accuracy. We are able to mechanically drill holes as small as 6 mil. This greatly enhances the efficiency of high mix low volume production and mass production quantities of printed circuit boards. 7
  8. 8. Mass VCP-5001 Via Plugging MachineThis machine is designed tofill holes in printed circuitboards with conductive ornon-conductive paste. Thehole filling can be performedwith through-hole vias andblind vias. The machine isequipped with a full vacuumchamber and heated headsto ensure reliable via fillingfor the most demandingaspect ratios and a glasscover for visual qualitycontrol on both panel sides. 8
  9. 9. Soldermask Coater The DP-1500 applies all types of liquid photoimageable coatings, including soldermask, primary image, dielectric, and legend. This versatile machine incorporates more than eight years of experience of dual-sided coating with many new features designed to reduce cycle time, increase yields and improve process reliability. 9
  10. 10. Technology RoadmapsMaterials and Manufacturing Capabilities 10
  11. 11. Technology Roadmap Attribute Standard Advanced 2012 Minimum Line Spacing, Internal Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003” Minimum Line/Spacing, External Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003” Minimum drilled hole size 0.008” 0.006” 0.004” Aspect Ratio (Thickness to Drill) 8:1 16:1 25:1 Land Size Internal (Diameter over Drill) 0.012” 0.010” 0.010” Land size External (Diameter over Drill) 0.012” 0.008” 0.008” No Connect (Diameter over Drill) 0.020 0.016 0.015 Plated Hole Tolerance ± .003” ± 0.002” ± 0.002” Minimum Laser Via Hole N/A N/A .004” Laser Via Aspect Ratio N/A N/A 1.5:1 Laser Via Land Size (Diameter Over Drill) N/A N/A 0.008” Minimum Dielectric Thickness 0.004” 0.003” 0.002” Minimum core Thickness 0.004” 0.003” 0.002” Maximum PCB Thickness 0.125” 0.256” 0.256” Thickness Tolerance (%) 10 7 6 Maximum Board Dimensions 16.5”x22.5” 19.5”x22.5” 19.5”x22.5” Bow And Twist (Through Hole) % 1.50 1.25 1.00 Bow And Twist (SMT) % 0.75 0.75 0.75 Minimum Conductor to Edge 0.012 0.010 0.008 Layer-To-Layer Registration Tolerance 0.005” 0.004” 0.003” Component Pitch 0.020” 0.016” 0.010” Soldermask Clearance 0.005” 0.003” 0.002” Soldermask Dams 0.004” 0.003” 0.002” Impedance Tolerance (>50 Ohms) % ± 10 ±5 ±3 Maximum layers 22 36 36 Maximum Copper Weight Internal (oz.) 3 3 3 Maximum Copper Weight External (oz.) 4 5 5 11
  12. 12. Technology Roadmap continued Attribute Standard Advanced 2012 Materials FR4 Yes Yes Yes High Tg FR4 – (170C..) Yes Yes Yes BT Epoxy Yes Yes Yes Polyimide Yes Yes Yes Teflon Yes Yes Yes Duroid Yes Yes Yes RoHS Compliant Materials Yes Yes Yes Isola FR408 Yes Yes Yes Nelco N4000-13 Yes Yes Yes Heatsink Manufacturing and Lamination Yes Yes Yes Via Construction Through Hole Yes Yes Yes Blind (Mechanical) Sequential Lamination Yes Yes Yes Buried (Mechanical) Yes Yes Yes Blind Laser No No Yes Surface Finish ENIG Yes Yes Yes OSP Yes Yes Yes White Tin Yes Yes Yes HASL Yes Yes Yes Electrolytic Nickel/Gold Yes Yes Yes Silver Yes Yes Yes Quality System MIL-P-55110 Yes Yes Yes MIL-PRF-31032 Yes Yes Yes ISO-9001:2000 Yes Yes Yes AS9100B Yes Yes Yes Electrical Test Method Flying Probe Yes Yes Yes 12
  13. 13. Substrate MaterialsStandard Dielectric Constant Supplier/Material @ DissipationMaterial Type Tg (° .C) 1 MHZ Factor CTE-Z Axis CTE-X & Y AxisFR-4 Nelco N4000-2 140 4.4 0.027 45 PPM 12-16 PPMHi-Temp FR-4 Nelco N4000-6 180 4.4 0.023 37 PPM 10-14 PPMModified FR-4 Isola FR408 175-185 3.8 Typ. 0.01-0.015 <55 PPM 13-14 PPMModified FR-4 Nelco N4000-13 200 3.9 0.009 35 PPM 10-14 PPMHi-Temp FR4 Matsushita R-1755V 180 4.4 0.015-0.022 45 PPM 10-14 PPMHi-Temp FR4 Isola IS410 180 4.0 0.015-0.023 65 PPM 11-13 PPMHigh Temperature Materials Dielectric Supplier/Material Constant @ DissipationMaterial Type Tg (° .C) 1 MHZ Factor CTE-Z Axis CTE-X & Y AxisBT-Epoxy Isola G200 185 4.1 0.013 140 PPM 15-18 PPMCyanate Ester Nelco N8000 250 3.8 0.009 55 PPM 12 PPMPolyimide Nelco N7000-2V0 260 4.3 0.013 70 PPM 13 PPM 13
  14. 14. Substrate Materials High Frequency Materials (core material only) Supplier/Material Dielectric Dissipation CTE-X HASL ImmersionMaterial Type Constant Factor CTE-Z Axis & Y Axis Finish? Gold/Tin Finish? 2.75-3.20 +/- 0.0030 @ 10 YesTLC Taconic 0.05 @ 10 GHz GHz 70 9-12 Yes Taconic 2.45-2.65 +/- 0.0019 @ 10 Yes YesTLX 0.04 @ 10 GHz GHz 130-145 9-12 Taconic 0.0018 @ 1.9 Yes YesRF-35 3.50 @ 1.9 GHz GHz 64 19/24 2.94 +/- 0.04 @ 0.0012 @ 10 No YesRT/duroid 6002 Rogers 10 GHz GHz 24 16/16 No Yes RogersRT/duroid 5880 2.20 +/- 0.020 0.0009 237 31/48 3.38 +/- 0.05 @ 0.0022 @ 10 Yes YesRO4003 Rogers 10 GHz GHz 46 14/16 3.48 +/- 0.05 0.0040 @ 10 Yes YesRO4350 Rogers @10 GHz GHz 50 14/16 6.15 +/- 0.15 @ 0.0025 @ 10RO3006 Rogers 10 GHz GHz 24 17/17 Yes Yes 2.40-2.60 +/- 0.001 typ @Ultralam 2000 Rogers 0.04 10 GHz 120 9.5/9.5 Yes Yes 2.50-3.20 @ 10 0.0018-0.0038AD Series Arlon GHz @ 10 GHz 95 12/15 Yes Yes 14
  15. 15. North AmericanTop Tier Customers 15
  16. 16. Let the DAPC team get started on your project today! 16
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