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Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
Lecture24
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Lecture24
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Lecture24

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  • 1. Design and Implementation of VLSI Systems (EN1600) Lecture 24: Computer-Aided Design using Tanner ToolsS. Reda EN1600 SP’08
  • 2. S-Edit: A tool for schematic entryS. Reda EN1600 SP’08
  • 3. Add a library (SCMOS) to your designS. Reda EN1600 SP’08
  • 4. The library content (cells show up)S. Reda EN1600 SP’08
  • 5. Add a view to your designS. Reda EN1600 SP’08
  • 6. You can draw your circuit in the view canvasS. Reda EN1600 SP’08
  • 7. How to add components to the view?S. Reda EN1600 SP’08
  • 8. Create an input portS. Reda EN1600 SP’08
  • 9. Create busses (bundles) Wire Wire (net) (net) labelS. Reda EN1600 SP’08
  • 10. Then label the individual wires and the busesS. Reda EN1600 SP’08
  • 11. Repeat for other signals. Make sure to label the input/output pads correctly Check your schematicS. Reda EN1600 SP’08
  • 12. Export your netlistS. Reda EN1600 SP’08
  • 13. Switch to L-Edit Load the setup and libraryS. Reda EN1600 SP’08
  • 14. P & R setupS. Reda EN1600 SP’08
  • 15. Then P & RS. Reda EN1600 SP’08
  • 16. Everything gets done for you! Where are the pins?S. Reda EN1600 SP’08
  • 17. Make things easier by specifying pin locationsS. Reda EN1600 SP’08
  • 18. Redo P & R → the IO pads to the boundary You can extract to SPICE and continue as usualS. Reda EN1600 SP’08
  • 19. Hierarchical design in S-Edit Create a symbol out of your register schematicS. Reda EN1600 SP’08
  • 20. Now create a new view schematic in your design (slide 5)S. Reda EN1600 SP’08
  • 21. Start adding your registers as instancesS. Reda EN1600 SP’08
  • 22. Then interconnect your placed componentsS. Reda EN1600 SP’08
  • 23. Now P & R the whole thingS. Reda EN1600 SP’08
  • 24. Overall flow design entry Schematic capture using S-Edit IC layout/ P&R Cell library area using L-Edit SPICE Verification timing/ powerS. Reda EN1600 SP’08
  • 25. Final project • Your project should fit on a 1.5 x 1.5 mm 40-pin MOSIS “TinyChip” fabricated in a 0.5 µm AMI process your project must not exceed 5000 x 5000 λ including I/O pads. • Therefore, the core of your project must fit in a 3400 x 3400 λ box and have no more than 40 pins. Six pins should be dedicated to VDD/GND, so only 34 are available as I/Os. • Fabrication schedule is 6th of June. Only projects that have demonstrated to work perfectly have a chance to get fabricated. Chips come during the Fall so you have to commit to testing them when they come back. • We might be limited to one design submission, so priority will be given to projects that are perfect (DRC is 100% OK, electrical verification is 100% OK, etc).S. Reda EN1600 SP’08
  • 26. Project logistics • There is a project report and presentation per group at the last lecture of the semester (5/5). • Class project is worth 20% of your grade. You are allowed to work in groups of 2 or 3. – Grading: • 15% specification • 20% design schematics • 10% layout • 30% verification and SPICE simulations • 10% final report organization • 15% presentationS. Reda EN1600 SP’08
  • 27. Class project suggestions and milestones • Possible projects: small programmable FPGA, cache memory, error detection and correction circuits, a small CPU, digital signal processing circuits, high speed arithmetic circuits, etc. • Milestones: – Wed April 9: Team and project finalization – Wed April 16: Specifications for your project well documents (block diagrams, functionality specification using pseudo-code or C/MATLAB, I/O pads, chip area estimation, etc) – Wed April 23: schematics and layouts are finalized – Wed April 30: simulations and verification is finalized – Mon May 5: Report and final presentationS. Reda EN1600 SP’08

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