新生訓練分享-如何做投影片 碩士班兩年及口試的經驗

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2. Powerpoint
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1.Top Guideline

4. 1.Top Guideline
• In the Audience’s Shoes
• Have A Skeleton
• Don’t Read Slides
• Don’t Inundate Your Listener
• Put Only Important Information
• Grammar and Spelling
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5. 1-1 In the audience’s shoes
• Who’s the listener?
• Can he/she remember my previous
work?
? ! ZZ
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6. 1-2 Have a skeleton
• Outline
• Remind audience where are we!
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7. 1-3 Don’t Read Slides
• Get the control of presentation!
• Extract the most important key words.
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8. Chih-Jie Yang
Introduction
There are two Possible Ways to Minimize Corrosion
 The first is to strengthening the corrosion of copper so that
copper would not be corroded easily. When it comes to
strengthen, nanotwins give people an image of strengthening.
Therefore, is it possible to strengthen material by nanotwins is
an interesting topic.
 Another possible way to increase corrosion resistance is to
shield the copper from contacting the corrosive agent. One of
the most effective protective agent for copper from corrosion is
BTA.
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9. Chih-Jie Yang
Introduction
Possible Ways to Minimize Corrosion
 Strengthen the corrosion resistance.(Strengthening)
 Shield copper from corrosive agents (Shield)
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10. 1-4. Don’t inundate your audience
• Too much information
• Unorganized information
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11. Chih-Jie Yang
DC PO BTADC BTAPO
(111) 0.16 0.10 0.32 0.28
(200) 0.08 0.05 0.18 0.20
(220) 2.76 2.85 2.50 2.52
Samples share similar preferred orientation Cu(220).→Corrosion difference from crystal. orient. is eliminated.

12. Chih-Jie Yang
Discussion
2.Cryst. Orientation
DC PO BTADC BTAPO
(111) 0.16 0.10 0.32 0.28
(200) 0.08 0.05 0.18 0.20
(220) 2.76 2.85 2.50 2.52
All samples share similar preferred orientation Cu(220).
→Corrosion difference from crystal. orient. is eliminated.
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13. Chih-Jie Yang
Discussion
3.G.S Analysis
Luo et al. J. Electrochem. Soc.2012, 159, C80-C85
We can not explain corrosion
behavior by grain size variation!!
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14. 1-5. Put Only Important Things
• Weight the importance of your info
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15. Chih-Jie Yang
Motivation
Review
Results
Discussion
Outline
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16. Chih-Jie Yang
Motivation
Why we are concerned about corrosion?
What are the possible ways to minimize corrosion?
Review
Results
A corrosion resistance relationship b/w specimens was found.
Reasoning for the Relationship
Study of possible factors.
Explanation of the observed results.
Outline
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17. 1-6. Grammar and Spelling
• Double check your unfamiliar words
nail oil-> nail polish
• Do not create special word usage.
• Beware of typos
Crystal lattice is destroyed╳
Crystal lattice is damaged
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2.Arrange Your Slides

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Arrange Your Slides
Individual
Object
Figure
Animation Illustration
Overall
Layout
Color
Alignment
Animation

20. 2-1-1 Literature Figure
• Clear
• Cite reference
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Zhigang et. al. IEEE Trans. Device Mater. Reliab. 2005,5,206

21. 2-1-2. Data Plot
• Easy to read
• Avoid ambiguity
• Unit and Legend
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22. 2-1-2. Data Plot
• Easy to read
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23. 2-1-2. Data Plot
• Avoid ambiguity
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24. 2-1-3 Mind map
• Avail the SmartArt objects
• Not to be limited
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25. 2-1-3 Mind map
• Avail the SmartArt objects
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Egun CVD ECD
Grain
• Grain size
• Grain orientation
Passive
• Passivation film
• Native oxide

26. 2-1-3 Mind map
• Not to be limited
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27. Chih-Jie Yang
Discussion
Corrosion
Surface
Roughness
Crystal
Orientation
Grain Size ?Twinning
BTA
Polish all samples
Twinned
BTA incorporated
Corrodes Slower
?Control to Cu(220)
by Cl- addition
Contradictory Trend

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Arrange Your Slides
Individual
Object
Figure
Animation/Figure Illustration
Overall
Layout
Color
Alignment
Animation

29. 2-2 Animation/Figure Illustration
• Use animation/Figure to illustrate your
idea
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30. 1.E-gun deposition: Ti 30nm Cu 300nm
2.Photolithography:spin coating AZ4620 5um
3.Electrodeposition:H2SO41M,pH=1,NaCl10- 3M
4.Mechanical Polish:2400 grit paper->clothing
5.Polarization test: Electrolyte:HNO3 0.1M
6. Immersion Test: Electrolyte:HNO3 0.1M
7. Characterization:TEM,SEM,AFM,XRD
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2-2 Animation/Figure Illustration

31. Chih-Jie Yang
Exp. Flow
Si
Cu Seed
Ti
Ti:30nm
Cu:300nm
E-Gun Deposition
Photolithography
AZ-4620
5㎛
Electrodeposition
H2SO4 1M
pH=1
NaCl 10-3M
BTA 10-4M
Mechanical Polish
2400 grit paper
↓
300 nm Al2O3
Immersion Test
Electrolyte:
HNO3 0.1M
Test time
12 hours
Characterization
SEM
XRD
AFM
TEM
Polarization Test
Electrolyte:
HNO3 0.1M
Sweep V:
-0.5~2V
Sweep rate:
0.05V/S

32. Chih-Jie Yang
1
1
2
Discussion
Better R. for BTA
Corrosion
1
11 1 1 1 1 1 12 2 2 2 2
Copper Oxidation
Protected Regions
Conclusion
Incorporated Amount:
BTAPO>BTADC
Corrosion Resistance
BTAPO>BTADC

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Arrange Your Slides
Individual
Object
Figure
Animation/Figure Illustration
Overall
Layout
Color
Alignment
Animation

34. 2-3. Color
• Use similar color through the ppt
• Simple background
• Avoid bright/fluorescent color

35. 2-3. Color
• Avoid bright/fluorescent color
Twin structures in specimen were
characterized by TEM technique.
Copper foil was stripped from
substrate first.
Then it was adhered to copper grid by
AB glue and placed still for 12 hours
for the glue to dry

36. 36
Arrange Your Slides
Individual
Object
Figure
Animation/Figure Illustration
Overall
Layout
Color
Alignment
Animation

37. 2-4. Alignment
• Alignment all the objects
(Centered/Left)
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38. Chih-Jie Yang
Exp. Flow
Si
Cu Seed
Ti
Ti:30nm
Cu:300nm
E-Gun Deposition
Photolithography
AZ-4620
5㎛
Electrodeposition
H2SO4 1M
pH=1
NaCl 10-3M
BTA 10-4M
Mechanical Polish
2400 grit paper
↓
300 nm Al2O3
Immersion Test
Electrolyte:
HNO3 0.1M
Test time
12 hours
Characterization
SEM
XRD
AFM
TEM
Polarization Test
Electrolyte:
HNO3 0.1M
Sweep V:
-0.5~2V
Sweep rate:
0.05V/S

39. Chih-Jie Yang
Exp. Flow
Si
Cu Seed
Ti
Ti:30nm
Cu:300nm
E-Gun Deposition
Photolithography
AZ-4620
5㎛
Electrodeposition
H2SO4 1M
pH=1
NaCl 10-3M
BTA 10-4M
Mechanical Polish
2400 grit paper
↓
300 nm Al2O3
Immersion Test
Electrolyte:
HNO3 0.1M
Test time
12 hours
Characterization
SEM
XRD
AFM
TEM
Polarization Test
Electrolyte:
HNO3 0.1M
Sweep V:
-0.5~2V
Sweep rate:
0.05V/S

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Arrange Your Slides
Individual
Object
Figure
Animation/Figure Illustration
Overall
Layout
Color
Alignment
Animation

41. 2-5. Animation
• Use animation to highlight your key
point.
• Get the control
• Keep it simple
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42. Chih-Jie Yang
Review
Benzotriazole (BTA)
BTA
CMP Corr.
Inhibitor
ED
Additives
 Inhibitive
Capability
 Roughness
 G.S.
 C.E.
 Inclusion
?
Mansfeld et al. Corrosion 1971,27, 289-293
Matjaz et al. Corrosion Science 2010,52, 2737–2749
BTA as additives
Discuss Corr. Ability
-Shield
W/O BTA
Protection
W/ BTA
Protection

43. Chih-Jie Yang
Review
Benzotriazole (BTA)
BTA
CMP Corr.
Inhibitor
ED
Additives
 Inhibitive
Capability
 Roughness
 G.S.
 C.E.
 Inclusion
?
Mansfeld et al. Corrosion 1971,27, 289-293
Matjaz et al. Corrosion Science 2010,52, 2737–2749
BTA as additives
Discuss Corr. Ability
-Shield
W/O BTA
Protection
W/ BTA
Protection

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3.The Most Important Thing

45. The Most Important Thing
• In the audience’s shoes
• Get the control of the present
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