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Thermal Management In Electronic Components – Can Polymers Replace Metals Or Ceramics Jun08
 

Thermal Management In Electronic Components – Can Polymers Replace Metals Or Ceramics Jun08

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    Thermal Management In Electronic Components – Can Polymers Replace Metals Or Ceramics Jun08 Thermal Management In Electronic Components – Can Polymers Replace Metals Or Ceramics Jun08 Presentation Transcript

    • Thermal Management in Electronic Components – Can Polymers Replace Metals or Ceramics? Aravind Chander, Senior Research Analyst, Technical Insights, Chennai, June 3, 2008
    • Focus Points • Introduction to Thermally Conductive Polymers (TCPs) • Technology Challenges and Drivers • Current Trends and Future Trends • Material Technologies Analysis • Technological Innovations in this Arena • Key Industry Participants 2
    • Introduction • Electronic devices are getting smaller and thinner • Conventional plastic components overheat often and develop localized quot;hot spotsquot; • Development of TCP’s has paved way to significant breakthrough for thermal management applications as they carry the same heat transfer capacity as metals or ceramics • TCP’s have good chemical resistance and give up heat faster during molding than conventional plastics 3
    • Challenges – Thermally Conductive Polymers There is a demand for newer compounds that could compete with the existing thermoplastic compositions. Concern for Passive Component Manufacturers Thermal high-temperature conditions Manufacturing Fatigue and for a long period of time Cost Heat can damage or change Lack of New their organic properties. Dissipation Polymer Compounds Elevated Temperature Due to the polymer properties such as High CTE and Low High initial cost is the biggest Thermal Conductivities. obstacle to wider acceptance of Demand for thermally conductive compounds. More Power The increase in activities of the Note: Size of the ball is not related to components has led to demand for more power importance or weight of the factor in order to maintain the existing performance. 4
    • Drivers – Thermal Conductive Polymers Compounds can be used as Polymers can be more easily custom manufactured to a wider range encapsulates in of sizes and shapes when compared to conventional materials. electronic component This enables them to be deployed for a broader range of applications. packaging making it suitable for smaller and thinner without Easy material compromising on process ability Polymers, particularly bio-based polymeric mechanical properties. compounds are gaining importance which can be effectively recycled with no harmful effect on the environment. Miniaturization of electronic components Continued focus on Recyclability Weight Excellent Reduction Mechanical Properties Weight reduction by means of using plastics for manufacturing safer, lighter and high performance devices. Thermally Conductive Polymers possess higher flexural strength, tensile Note: Size of the ball is not related to stiffness, and low-impact strengths. importance or weight of the factor 5
    • Current Trends Thermally conductive adhesives for lighting application High viscosities make molding Custom-molded heat over a large surface area sinks on circuit boards difficult Current Trends Carbon nanofibers and boron nitride filler is gaining more Laser Diode Encapsulation is in attraction the developmental phase 6
    • Future Trends Composites will target flip chips and solder joint applications New compounds from Tailorable CTEs with low natural resources high manufacturing cost temperature stability Future Trends PCB itself can act as heat sink Elastomers is expected to get more treatment 7
    • Parameters for Technology Performance CTE Chemical resistance Mechanical Strength Technology Performance Processing ease and Temperature range Workability 8
    • Parameters for Application Potential Light Weighted ness Miniaturization of Thermal Stability components Application Potential Design Cost 9
    • Technology Performance Vs Application Potential (Present Scenario) Electronics Sector- Present Scenario 10 Carbon Nanofibres Silicone Application Potential Epoxies Urethanes Acrylics 5 0 0 5 10 Technology Performance 10
    • Technology Performance Vs Application Potential (7- 10 years from Now) Electronics Sector-10 years from now 10 Carbon Nanofibres Application Potential Epoxies Acrylics Silicones Urethanes 5 0 0 5 10 Technology Performance 11
    • Noteworthy Innovations Development of a polycarbonate compound (Nemcon- H) by Ovation Polymers Inc. National Starch and Chemical Company, NJ, USA have demonstrated fusible particles can enhance thermal conductivity. A broad range of Vectra liquid crystal polymer (LCP) grades using several polymer systems with various fillers and reinforcements was developed by Ticona Technical Polymers, KY, US Development of a new thermally conductive line of compound by Dow Corning Corporation, US. Development of a series of boron nitride filler grades under the name PolarTherm by Momentive Performance Materials GmbH. 12
    • Key Industry Participants Cool Polymers Inc Momentive Ovation Polymers Performance Materials Fujipoly American Kunze Folien GmbH Corporation Shin-Etsu CYTEC Inc Pronat Cast-Coat Inc Industries Chemical Timtronics Ltd. Co. Ltd Diemat Inc. Ticona Technical Polymers 13
    • Your Feedback is Important to Us What would you like to see from Frost & Sullivan? Growth Forecasts? Competitive Structure? Emerging Trends? Strategic Recommendations? Other? Please inform us by taking our survey. 14
    • For Additional Information Steve Lee Strategic Account Manager Chemicals, Materials and Food, Asia Pacific (65) 6890 0914 steve.lee@frost.com 15