Workshop - Voorkomen van faling door vibraties - introductie-vis-prosperita-imec


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Workshop - Voorkomen van faling door vibraties - introductie-vis-prosperita-imec

  1. 1. Met steun vanIntroduction by cEDMFilip PonsaertsMay 30, 2013Sirris Workshop“Voorkomen van faling door vibraties”
  2. 2. © imec 2013 | www.edmp.beTo support industry in the development of highquality, reliable and cost-effective electronic modules(PBA) by means of knowledge creation and sharing,scientifically sound methodologies andcollaboration throughout the electronic supply chain.Collective• Awareness creation• Design Guidelines• PBA development tools• Seminars - trainingBilateral• Consultancy• Knowledge transfer• Implementation•TrainingBetter electronics at reduced cost throughscience based design & production methodologies.cEDM Mission and Objectives2
  3. 3. © imec 2013 | www.edmp.becEDM Approach1. Scientific basisQuantitative physical modeling.PBA X-factor = f(design, production)2. Collaboration with representatives of thedifferent parts of the supply chain via thecEDM partner group.3. Helicopter view,commercial independenceand scientific objectivity.Product conceptOEMProduct designOEM-ODMPhysical designOEM-ODM-designhouseManufacturingOEM-ODM-EMSDistributionOEM-ODM-EMSCustomerQualificationOEM-ODM-TestlabPCBComponentsMaterialsPackaging3
  4. 4. © imec 2013 | www.edmp.becEDM industry partners and members• Founding partner: Sirris (WTCM)• 17 cEDM partners– 28 cEDM members– >50 Benelux companies represented– Majority of PCB/EMS turn-over in Benelux– >20000 employees – >€8 Billion turn-overcEDMPartnerscEDMLeden4
  5. 5. © imec 2013 | www.edmp.becEDM’s CROSS-Disciplinary teamMultidisciplinary research and industrial backgroundGeert Willems – Team leader (1/7/2005)• Dr. ir. Electronics Engineering - PhD• 10 years research in micro-electronics: SOI, Integrated Ferro-electrics• 10 years industrial experience: PBA technology, assembly, NPIAlain Carton – PCB/PBA Design-for-X (15/1/2008)• Ing. Electronics Engineering• >15 years of industrial PCB/PBA design experience• IPC certified: CID – IPC-A-600 & IPC-A-610 inspectorWesley Van Meensel – PBA information engineering (26/4/2010)• ir. Chemical Engineering• >3 years experience in PBA industrialisation and related automation• Our IT & software wizardFilip Ponsaerts – EDM operations & business development (18/7/2011)• Ing. Electronics Engineering – Computer Science• Master in Multi-Media Technology and Virtual Reality• 10 years experience in electronics design• 10 years experience in design, R&D and Q management in large and smallenterprises.5
  6. 6. © imec 2013 | www.edmp.becEDM’s CROSS-Disciplinary teamMultidisciplinary research and industrial backgroundBoris Leekens – PCB/PBA DfX – Industrial projects (14/9/2011)• Ing. Electronics engineering - MBA• 20 years industrial experience in electronic assembly: Functional test engineering,NPI project management and account management.Steven Thijs – R&D project leader (1/11/2011)• Dr. ir. Electronics Engineering – PhD• >10 years of research experience in ESD of CMOS devicesBart Vandevelde – R&D project leader (1/4/2013)• Dr. ir. Mechanical Engineering – PhD• >15 years Package and PBA reliability and thermo-mechanical research expertise– 70 years of experience in the electronics industry– 40 years of advanced research experience6
  7. 7. Met steun vanIntroduction VIS-ProsperitaSteven Thijs – project leader ProsperitaMay 30, 2013Sirris Workshop“Voorkomen van faling door vibraties”
  8. 8. © imec 2013 | www.edmp.beVIS-PROSPERITAPRoductverbetering dankzij Ontwerp– en Specificatie-richtlijnen voor Elektronica Realisatie en InTegrAtiegebaseerd op fysische modellering(Product improvement through design and specification guidelines forrealization of electronics and integration, based on physical modeling)Goal:Design-for-X guidelines to design, manufacture and integrate costeffective PBA’s with controlled quality and reliability, aiming forcompetitive electronic based products and systems on theinternational market in a cost effective manner and with a shorttime-to-marketDuration:January 2011 – December 20148
  9. 9. © imec 2013 | www.edmp.beGuidelinesTwo groups:1. Design-for-Manufacturing• focus on cost effective manufacturing of PBA’s• controlled quality• basic aspects of reliability• Specification of PCB, components, materials and PBA2. Integration• focus on the correct installation of the PBA in a system• impact of the load conditions of the system onto the PBA(‘s)9
  10. 10. © imec 2013 | www.edmp.beVIS-PROSPERITAPBA realization: DfM-DfR-DfTD1: PCB SpecificationD2: Component SpecificationD3: Assembly materialD4: Design-for-AssemblyD5: PCB density classesD6: PCB LayoutD7: Design-for-Test PBA integrationI1: Mechanical interactionI2: Thermal interactionI3: EMC interactionI4: integration10
  11. 11. © imec 2013 | www.edmp.beGuideline status11D1 - PCB specificationD2 - Component specificationD3 - Assembly material spec.D4 - Design-for-AssemblyD5 - PCB classificationD6 - Layout rulesD7 - Design-for-TestI1 - Mechanical interactionI2 - Thermal interactionI3 - EMC interactionI4 - IntegrationStatus Prosperita guidelinesStarted First draft Under review Released
  12. 12. © imec 2013 | www.edmp.beEDM-D-001: PCB specification• What laminates to select in order to:– Avoid delamination during lead-freesoldering– Avoid via cracking during lead-freesoldering– Avoid via cracking before product’sexpected end-of-life– How to select and specify?• What solderable finish to be used?• What to do regarding PCB andmoisture uptake?12
  13. 13. © imec 2013 | www.edmp.beEDM-D-002: Component specification• How to get a (lead-free) soldering compatible BOM?– Moisture Sensitivity requirements: J-STD-20– How to deal with temperature and other process sensitivitiesof passive components: J-STD-075, PSL, what if no PSL?– Predicting BOM dependent reflow temperature differenceacross the PBA. Identifying reflow process critical designs• How to select a BOM for high yield/quality assembly?• How to deal with component related reliability aspects?– Solder joint reliability critical component types– Sn-whisker mitigation13
  14. 14. © imec 2013 |• What assembly materials are acceptable on professionalequipment?– Solder, flux, wire, paste,...– Adhesives– Conformal coating• How to specify?• What are the quality risks?• What about cleaning?EDM-D-003: Assembly Materials14
  15. 15. © imec 2013 | www.edmp.beEDM-D-004: Design-for-Assembly• Basic DfA rules: fiducials, component free areas,...• How to select PBA build-up: SS, DS, SMT, TH?• How to align component placement to assembly flow?• How to optimize for yield, cost, logistical risks,...?• Solder process compatibility of component selection andplacement15
  16. 16. © imec 2013 | www.edmp.beEDM-D-005: PCB Build-Up and Density ClassificationPCB Build-Up:• What determines PCB build-up: layer count,use of through-, buried-, micro-, filled vias,copper thickness, laminates,...?• Basic PCB build-up rules for yield, cost, quality,reliability optimizationDensity Classification:• How to align PCB routing needsand PCB manufacturing capability?• How to quantify interconnection density?• How to optimize?16EARExternalvia landViaplatingIARInternalvia landViaplatingEL IL
  17. 17. © imec 2013 | www.edmp.beEDM-D-006: Layout solutionsProvide layout solutions for commonly occurring cases:• BGA fan-out• QFN footprint• Impedance controlled PCB build-up• Thermal relief• Selective soldering keep-out areas• ...17
  18. 18. © imec 2013 | www.edmp.beEDM-D-007 : Design-for-Test guideline• How to set-up a test strategy?• Basic Design-for-Test rules: providing test access• How to quantify the impact of production tests on PBAyield/Zero Hour Defect Rate18
  19. 19. © imec 2013 | www.edmp.beEDM-I-001: Mechanical interactionSee this workshop19
  20. 20. © imec 2013 | www.edmp.beEDM-I-002: Thermal interactionHow to obtain sufficient on-board cooling?• PBA level thermal resistance models• How to design the PBA?– Embedded heat sink planes– Thermal vias– Heat sinks– Component package selection• Impact on PBA of systemlevel solutions20
  21. 21. © imec 2013 | www.edmp.beEDM-I-003: EMC interaction• How to design for signal integrity and EMC?– Quantification of impact of PCB structures: track length,vias, thermal relief, test pads,...– Positioning of power integrity passives– Elementary design rules• How to deal with manufacturability and other DfXconflicts?21
  22. 22. © imec 2013 | www.edmp.beEDM-I-004: PBA system integration• How to integrate PBA’s in systems?– comply with mechanical demands– comply with thermal demands– comply with EMC demands– while being cost-effective– while retaining quality– while retaining reliability22
  23. 23. © imec 2013 | www.edmp.beQuantification: DfX supporting toolsWebsite tools available for EDM members and partners• Via reliability calculator• PCB delamination calculator• PCB laminate overview (>200 laminates)• PB Assembly checklist (PBA materials and processes)• Failure risk assessment (DfR FMEA)• BOM DfM Checklist (component properties to be known)• NPI Questionnaire (industrialization support)• IPC standards guide (where do I find it at IPC?)www.edmp.be23
  24. 24. © imec 2013 | www.edmp.beQuantification: DfX supporting toolsWebsite tools under development• Mechanical response calculator• Assembly production flow calculator• DfM quality evaluator• Solder joint lifetime calculator• PCB production flow calculator• Thermal resistance calculator• Recyclability rating• ...Everything will be executable without special software tools24
  25. 25. © imec 2013 | www.edmp.beQuantification: Pred-X• Offline tool for PBA design evaluation• Supports design from concept phase (first estimates) up toproduction deployment (yield evaluation)• No special software tools required• Core version:– PBA description– DPMO error rate zero order model– Test coverage zero order model– Customization of models– Yield-Test Coverage calculation25
  26. 26. © imec 2013 |