2012 11-27-masterclass-conductive-inks-kth
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Masterclass conductive printing

Masterclass conductive printing

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2012 11-27-masterclass-conductive-inks-kth Presentation Transcript

  • 1. Applications withLow-Cost Conductive Inks iPack Center Royal Institute of Technology (KTH) Stockholm, Sweden
  • 2. Outline Fundamental requirements for flexible electronic applications Applications DC and RF interconnections & reliability Narrowband and wideband printed antennas Printed chipless RFID Printed wireless sensor Hybrid system for flexible electronics Masterclass Future of Conductive Printing Nov 27, 2012
  • 3. Fundamental Requirements of Low-cost Conductive Inks Good printability/wettability on different substrate Good adhesion/reliability to substrates High conductivity  Typical sheet resistance < 0.1 Ohm/square for radio frequency application  Application-dependent (DC applications) Low sintering temperature: < 150-200℃ required for paper and low-cost plastic substrate High printing resolution and line edge control Masterclass Future of Conductive Printing Nov 27, 2012
  • 4. DC and RF Interconnections Substrate-dependence: material, surface roughness, pore size Sintering temp and time strongly affect the sheet resistance 100°C Kordak Inkjet photo paper Schoeller Inkjet photo paper PEL Electronic grade paper for inkjet UV Package paper from Korsnäs AB PE Package paper from Korsnäs AB4-point sheet resistance testpattern printed on PEL paper Masterclass Future of Conductive Printing Nov 27, 2012 [L. Xie et al., Mater. Lett. 2012]
  • 5. DC and RF Interconnections Coplanar Wave Guides (CPW) as RF interconnections  No double side printing needed  Easy to adjust the RF characteristic impedance  on both plastic and paper substrate  Characterized by VNA and TDR  50 impedance achieved, open the door for RF interconnection on paper substrate CPW CPS g Ws Wg Wg Ws t G S G G S H (a) (b) [Y. Feng et al., Digital Fabrication 2011] Masterclass Future of Conductive Printing Nov 27, 2012
  • 6. DC and RF Interconnections CPW as RF testing vehicles to measure  Line resistance, inductance, conductance and capacitance at microwave frequencies  Conductance and capacitance are related to substrate propertiesMeasured CPW parameters Extracted AC properties Electrical properties of the paper substrate[B. Shao et al., ESTC, 2008] Masterclass Future of Conductive Printing Nov 27, 2012
  • 7. Interconnection Reliability Interconnection reliability is always an important issue in Printed lines initially sintered all at 90 ℃ applications   Aging the printed lines in 85℃/ 85%RH environment up to 6 weeks  Monitor the resistance change  Resistances decreased after one week and kept stable afterwards  Results show that UV package paper shows better reliability than inkjet paper in the aging test PEL paper UV package paper Masterclass Future of Conductive Printing Nov 27, 2012 [L. Xie et al., Mater. Lett. 2012]
  • 8. Printed Narrowband UHF RFID Antennas UHF RFID Meander Line Antennas (866-868 MHz)  Simulated by HFSS  Printed by inkjet & flexo  Experimentally measured in “dark” room  Results match well with design  High robustness  Low ink-consumption [Y. Amin et al., J Electromagnet. Wave. 2012] Masterclass Future of Conductive Printing Nov 27, 2012
  • 9. Printed Narrowband UHF RFID Antennas UHF RFID Bowetie Antennas (860- 960 MHz)  Simulated by HFSS  Printed by inkjet & screen  Experimentally measured in “dark” room  Results match well with design  larger bandwidth [Y. Amin et al., Prog. Electromagn. Res. 2012] Measured Read Range Input Return Loss Masterclass Future of Conductive Printing Nov 27, 2012
  • 10. Printed Wideband Antennas Wideband Log-Spiral Antennas  Log-spiral antennas inkjet printed on paper  Experimentally measured in “dark” room  Operational range of 0.8-3.0 GHz  Accommodate several modules of wireless sensing or other applications in addition to an RFID tag [Y. Amin et al., J Electromagnet. Wave. 2012] Input Return Loss 2D Radiation Pattern Masterclass Future of Conductive Printing Nov 27, 2012
  • 11. Printed Wideband Antennas Wideband Archimedean Spiral Antennas  Archimedean spiral antennas inkjet printed on paper  Experimentally measured in “dark” room  Operational range of 0.8-3.0 GHz  Simultaneously implementing a wide range of different modules in addition to an RFID tag [Y. Amin et al., Prog. Electromagn. Res. 2012] Input Return Loss 2D Radiation Pattern Masterclass Future of Conductive Printing Nov 27, 2012
  • 12. Printed Chipless RFID Inkjet printed Chipless RFID on Paper  Time doming reflection principle  UWB impulse as interrogation signal  1.67 Gbps data rate  Tapered microstrip line to overcome the relative higher series resistance of inkjet printed lines [B. Shao et al., Micro. Opt. Techn. Let., 2011] Masterclass Future of Conductive Printing Nov 27, 2012
  • 13. Printed Chipless RFID Chipless RFID based on LC-tank  Etched or Inkjet printed on plastic and paper substrate  Sympathetic Oscillation Principle  Possible to work for liquid-bearing applications [B. Shao et al., Micro. Opt. Techn. Let., 2012] Masterclass Future of Conductive Printing Nov 27, 2012 [Y. Feng et al., LOPE-C 2012]
  • 14. Integration With Printed Sensors for Wireless Sensing  Printed Wireless Humidity Sensor  f-MWCNTs as sensing material  Passive sensor, fully-printable  Design adapted for both UHF and UWB applications [Y. Feng et al., IEEE Sens. J., 2012] for UHF application, monitor return loss for UWB application, monitor the reflected pulse energy 200 150 100 Voltage (mV) 50 0 -50 -100 -150 Interrogation UWB 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Time (ns) impulse Masterclass Future of Conductive Printing Nov 27, 2012[Y. Feng et al., IEEE Sens. Conf., 2011]
  • 15. Hybrid system integration using Inkjet Printing Hybrid Interconnection Platform  Using adhesive to form a smooth step transition between substrate and packaged components or bared Si IC dies  This smooth ensures that printed metal lines will not break when it crosses over the step difference To connect bared Si IC dies To connect packged components [M. Mämtysalo et al., IEEE ECTC, 2012] Masterclass Future of Conductive Printing Nov 27, 2012
  • 16. Hybrid System for Bio-Medical Applications Bio-patch Implemented with SoC and Paper-based Inkjet Printing  Bio-chip IC SoC  Inkjet printed interconnection and electrodes  Inkjet printed flexible cables  Wearable Bio-patch on paper substrate Printed Interconnects [G. Yang et al., IEEE T. Inf. Technol B., in Press] Measured ECG signals and FFT using Printed Bio-Patch Masterclass Future of Conductive Printing Nov 27, 2012
  • 17. Low Cost Conductive Ink for Flexible Cables for Wearable ECG Monotoring Inkjet Printed Flexible Cable for ECG Monitoring  Inkjet printed flexible cable on paper for wearable ECG monitoring  The cable consists of printed metal lines and a shielding line in the middle  The experimental results show that a reliable performance with high quality ECG data is possible on the inkjet printed cable on flexible cable [Q. Wan et al., IEEE EPEPS, 2011] Measured digitalized ECG Future of Conductive Printing Nov 27, 2012 Masterclass signals @ 150 MHz
  • 18. Acknowledgements• Thank you for the financial support from Vinnova (The Swedish Governmental Agency for Innovation Systems) through the Vinn Excellence centers program and the EU Commission under the FP7 CLIP (Conductive Low-cost Ink Project) project. Masterclass Future of Conductive Printing Nov 27, 2012
  • 19. Thank You!! Questions?Masterclass Future of Conductive Printing Nov 27, 2012