© IML 2012      MasterClass – Future of Conductive Printing      November 27 - BelgiumMaking a Material Difference …© IML ...
© IML 2012             •    Introduction             •    Technical Background – IML             •    Main factors        ...
© IML 2012    •        Founded as a QinetiQ corporate investment in             January 2002 – QinetiQ Nanomaterials Ltd  ...
© IML 2012© IML 2012
© IML 2012© IML 2012
© IML 2012             •  Major difference between conventional inks and PE                 •  Functionality of the ink an...
© IML 2012                  Materials                    Design / Integration             •     CuO             Substrate ...
© IML 2012                  Materials                    Design / Integration             •     CuO             Substrate ...
© IML 2012                                               Huge impact on low temperature                  Nano             ...
© IML 2012                                               Huge impact on low temperature                  Nano             ...
© IML 2012             Materials   Formulation   Printing     Drying      Sintering    Device             Requirement     ...
© IML 2012             •  Ovens                 •  Standard practice / conventional approach - Silver                 •  U...
© IML 2012                    •  Broadband flash                        •  High power densities / wide area of            ...
© IML 2012             •  High energy pulse - broadband or specific                wavelength             •  Targeted Rapi...
© IML 2012             Broadband             Laser             Pulsed                Pulsed or                            ...
© IML 2012   •  Example – Sinteron™ 2000   •  Features             •  Selectable pulse duration – 100 to                20...
© IML 2012   •  Example - Pulseforge™ 3300   •  For development and production –      R2R   •  Features             •  Bro...
© IML 2012             •  Limited commercial offering at   Laboratory System                this point             •  Wide...
© IML 2012             •  LOPE-C Conference Dusseldorf             2 m/min – nano copper ink deposited by a new           ...
© IML 2012    RFID on paper or PET / laser                   4µm lines / laser                                            ...
© IML 2012                                           CEMLED                                           •  Combination of IM...
© IML 2012             •  Broadband Flash             •  Novacentrix – software                development             •  ...
© IML 2012             •  To increase speed of adoption of low cost conductive inks, cost                effective sinteri...
© IML 2012                              Thank you!                                 Contact:                               ...
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2012 11-27-masterclass-conductive-inks-intrinsiq

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Masterclass conductive printing

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2012 11-27-masterclass-conductive-inks-intrinsiq

  1. 1. © IML 2012 MasterClass – Future of Conductive Printing November 27 - BelgiumMaking a Material Difference …© IML 2012
  2. 2. © IML 2012 •  Introduction •  Technical Background – IML •  Main factors •  Principle of Photonic Curing •  Process Options – Broadband Flash or Laser •  New Developments •  Examples •  Summary© IML 2012
  3. 3. © IML 2012 •  Founded as a QinetiQ corporate investment in January 2002 – QinetiQ Nanomaterials Ltd •  Spun out in 2007 •  Locations: •  Farnborough, UK (R&D, Production and BD Europe) •  Rochester, NYS, USA (Development and Production) •  Team of 30 - 80% technical/scientific •  Technology Platform •  Fabrication of Inorganic Nanoparticles© IML 2012
  4. 4. © IML 2012© IML 2012
  5. 5. © IML 2012© IML 2012
  6. 6. © IML 2012 •  Major difference between conventional inks and PE •  Functionality of the ink and the track it produces •  Must be capable of joining / folding / flexibility / survive environmental issues / multilayers / post processing / packaging •  Must be capable of integration with other technologies •  Will stretch the capabilities of print technology •  screen printing and Inkjet lead at this point •  And stretch to other applications - many and varied •  Conversion from a track to a conductive track is a key issue© IML 2012
  7. 7. © IML 2012 Materials Design / Integration •  CuO Substrate •  Coated Copper •  Silver Print Technology Application© IML 2012
  8. 8. © IML 2012 Materials Design / Integration •  CuO Substrate •  Coated Copper •  Silver Suite of Sintering Technologies are required to address the issues Print Technology Application© IML 2012
  9. 9. © IML 2012 Huge impact on low temperature Nano substrates with corresponding enabled cost implications Performance * Inks Cost Low Temp Screen Typical Screen Temperature * More than conductivity – adhesion, surface roughness etc© IML 2012
  10. 10. © IML 2012 Huge impact on low temperature Nano substrates with corresponding enabled cost implications Performance * Inks Cost ``` Low Temp Screen ```````````` Typical Screen Temperature * More than conductivity – adhesion, surface roughness etc© IML 2012
  11. 11. © IML 2012 Materials Formulation Printing Drying Sintering Device Requirement •  Conversion of printed ink to a conductive track •  High Performance •  Fast – suit R2R speeds •  No damage to substrate •  Flexible – multiple print types (inkjet, screen etc) •  Large area / thin tracks / large area + thin tracks •  Various substrate (glass, paper, ceramic, composites, high thermal mass) •  Compatible with industry standard practices© IML 2012
  12. 12. © IML 2012 •  Ovens •  Standard practice / conventional approach - Silver •  Uniformity •  Wide area of processing / •  Substrate limited to temperature •  Long residence time -> inert atmosphere •  UV Curing •  Wide area of processing •  Standard practice •  Lower intensity, continuous output Widely adopted proven technology© IML 2012
  13. 13. © IML 2012 •  Broadband flash •  High power densities / wide area of processing •  Less substrate limited and curing times short Photonic Curing •  Adjustable spectrum / tunable pulse lengths •  High capital cost for some systems / beam not uniform •  Laser •  High Power densities •  Exposure area smaller / •  Fixed wavelength but targeted wavelength to match ink requirements / uniform across the beam / Spatial selectivity - targeted© IML 2012 •  Cost / rastering
  14. 14. © IML 2012 •  High energy pulse - broadband or specific wavelength •  Targeted Rapid thermal heating of surface Energy layers •  Solvent / coating escape •  Converts nanomaterial into highly linked Wavelength structure •  Careful control of energy levels gives:- •  High conductivity •  No surface damage to substrate •  Compatibility with low temperature substrates© IML 2012
  15. 15. © IML 2012 Broadband Laser Pulsed Pulsed or Energy continuous Broadband – can Fixed narrow be modified - wavelength different lamp Wavelength options for modified output sintered Output varies by Precision control of wavelength output Energy delivered is Coherent beam not consistent therefore ease of unsintered focus, pointing and control© IML 2012
  16. 16. © IML 2012 •  Example – Sinteron™ 2000 •  Features •  Selectable pulse duration – 100 to 2000 µm •  Adjustable Pulse energy 27 to 2000 Joules •  Multiple modes – single, double, burst, continuous •  Sintering area 1.9 x 30.5cm •  www.xenoncorp.com© IML 2012
  17. 17. © IML 2012 •  Example - Pulseforge™ 3300 •  For development and production – R2R •  Features •  Broad spectrum 200nm to 1000nm •  Max peak power 100kW/cm2 •  Sustained peak greater than 5MW on 15cm wide •  Exposures down to 30 µsec •  Pulse repetition rate >1kHz •  www.novacentrix.com© IML 2012
  18. 18. © IML 2012 •  Limited commercial offering at Laboratory System this point •  Wide range of lasers and generic expertise available •  Some developments underway •  Commercial •  Government sponsored •  IML developing a range of approaches in response to customer demand LAPS 60 System© IML 2012
  19. 19. © IML 2012 •  LOPE-C Conference Dusseldorf 2 m/min – nano copper ink deposited by a new Fuji-Dimatix ink jet head, then dried & sintered using broadband flash© IML 2012
  20. 20. © IML 2012 RFID on paper or PET / laser 4µm lines / laser Test lines 75µm, on PET / laser Test on Kapton / laser Automotive sensor on composite panel / laser© IML 2012
  21. 21. © IML 2012 CEMLED •  Combination of IM ink and PROCID Cambridge Nanotherm high•  Antibody based disease detection performance substrates for programme LED’s•  Developed on gold/glass•  Not economical / difficult to take to product•  PROCID programme developing copper electrodes•  Screen / inkjet printed•  Laser / Broadband flash processed© IML 2012
  22. 22. © IML 2012 •  Broadband Flash •  Novacentrix – software development •  Enhanced Modelling & Control •  Laser •  LAPS60 supplied to customers for R&D development •  LAP1200 system in development •  Scale up of LAPS 60 •  High power laser screen to process wider images© IML 2012
  23. 23. © IML 2012 •  To increase speed of adoption of low cost conductive inks, cost effective sintering processes are needed •  Current sintering technologies achieve the required performance •  High performance tracks manufactured •  Sintering tools are available in both oven / broad band flash •  Barrier to uptake is lack of cost effective sintering systems at the R&D stage •  Growing interest in laser application •  IML has set out to support our customer base with a range of validated laser sintering tools •  These are now available ….© IML 2012
  24. 24. © IML 2012 Thank you! Contact: Dr Paul Reip Director, Government and Strategic Programmes paulreip@intrinsiqmaterials.com mobile: +44 (0)7785 382 293© IML 2012
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