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Applied Logix Intro Oct2012
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Applied Logix Intro Oct2012


AppliedLogix Overview

AppliedLogix Overview

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  • 1. Company Overview
  • 2. AppliedLogix: At-a-Glance Founded in 2006 Product & Application Silent-Partner Engineering Development Services & Consulting Senior staff of expertsServices & Delivery Model are tailored to fit each customer’s unique needs 2
  • 3. Engagement Options Standard Options AL Client AL Client Client AL Complete Project Outsource Collaborative Integration On-Site Presence • Turn-key product development • Deliver early and often • Rapid staffing capability • Subsystem and module design • Direct stakeholder access • Deep-dive collaboration • Decouple specialized disciplines • Reduce decision turn-time • Integration support Specialized Options Group/1-on-1 Peer-to-Peer Tiger Team Training Design Review Leader • High speed design techniques • Detailed parametric analysis • Critical EMC issues • Electromagnetic compatibility • On-site or off-site reviews • Expert analysis • Embedded Linux & real-time • Cross-disciplinary attention • Rapid diagnosis/resolution • Agile software development • Written report of findings • “Fresh eyes” perspective • Customized content available • Suggested improvements • Best practices integration 3On-site co-location limited to sites within ~75 miles of Rochester, NY
  • 4. Flexible Project ManagementMultiple project approaches address the cost and risk spectrum. 4
  • 5. Hardware Skills and Capabilities Advanced PWB Layout Signal Integrity Analysis, Sim.Generalized Application High Voltage • Controlled Z Stackup • Routing • PDN • Microcontroller Performance DSP High Speed FPGA Control • Comms. Filtering • Analysis Mixed-Mode Designs Networking & Wireless GHz+ Serial Links 802.11a/b/g/n • Zigbee • IrDA • Ethernet LVDS • Xilinx GTP Mixed Signal Micro Power Precision Analog Technology & Performance 5
  • 6. Image Path Skills & CapabilitiesTransducer Conditioning Conversion Post-Process Transmit • Precision Analog • ADC & DAC • FPGA Signal Processing • Multi-Gbps links • Passive Filters • High speed • Parallel Processing & • LVDS / SerDes Pipelining • Active Filters • High precision • PCIe 2.0 / 3.0 • High perf. memory • Adaptive Filters • Many interface (DDRx, sync-SRAM,…) • PCIe backplane • Transimpedance and topology • Advanced DMA • PC drivers Amplifiers types (scatter/gather, chaining) • Application SW • Closed-loop ctrl. • AC timing closure • Data visualization • Signal & power integrity Signal Integrity • Design for EMC • Design for Manufacturability • Design for Test 6
  • 7. Software Skills and Capabilities Modeling & Design • Safety Critical • Fail-Functional Smartphone & Tablet PC Applications, GUI Comm. ProtocolsIntegration Level Board Support Pkgs. Web Services Board Support Pkgs. Server Daemons Bare Metal Firmware Shared Libraries, APIs Hard RT µPower Device Drivers Mobile & Embedded Form Factor PC & Server 7
  • 8. We Have Implemented Microprocessors & DSPs: Freescale 85xx, 83xx, 82xx, 740, 604e, 603e and ColdFire AMCC 440GX, IBM 750CXe Texas Instruments TMS570, TMS320, Piccolo, MSP430 Analog Devices ADSP21369 (SHARC) Microchip dsPIC, PIC16 and PIC18 families ARM: TI Stellaris (Cortex), NXP ARM 7 and, Freescale MXL & iMX Atmel AVR (Tiny, Mega, AT90S) Cypress PSoC FPGAs Xilinx, Actel, Altera, Lattice and Microsemi device families Industry standards: DDR3 / DDR2 / DDR / SDR SDRAM, RLDRAM-II, SyncSRAM HDMI, DVI, PCI Express 1.0 & 2.0, PCI/X-133,10/100/1000 Mbit Ethernet, SATA, SAS-2.0, VME, SCSI, Fibre Channel, USB 2.0, FireWire, CAN, Camera Link, SPI, I2C, Arcnet. 8
  • 9. Specialized CapabilitiesSystem Architecture Analysis and Definition Design Technology Disciplined approach to system engineering View View Use Tie requirements to system functions, interfaces Cases Process Deployment Apportion functions to system components View View Define critical behavioral characteristics and processes Plan for critical aspects (safety, security, scalability, etc.) Multi-Discipline Agile Development Provide a framework for evolving requirements Iterative and incremental processes for all disciplines Deliver hardware, software, firmware early and often Iteration and release plans for all system components Direct stakeholder involvement to validate deliverables Provide sustainable commercial support for agile practices 9
  • 10. Domain Expertise Medical device design Concept and Feasibility Systems Requirements Safety Critical Systems Analysis and Design Hazards/Risk Analysis Defensive Design Redundancy/Diversity and Self Checking Intrinsically Safe Design Quantitative Fault Tree Analysis (QFTAs) Failure Modes and Effects Analysis (FMEA and DFMEA) Safety Critical Software FDA 510K Premarket Approvals IEC 60601 / 62304, Programmable Medical Devices, Plus Particular and Collateral Specifications 10Image Credit: Sigma International
  • 11. Domain Expertise Digital Imaging Hardware-accelerated FPGA pipeline Low-level printer operating software Multi-core processing pipelines Image management software Digital workflow applications Raster image processing servers Wireless image transmission from point-of-capture (camera interface) Geotagging, data association and metadata manipulationImage Credit: Print Ready 11
  • 12. Domain Expertise Automotive device design Considerable Alternative-fuels Expertise Concept / Architecture / Feasibility studies Automotive System & Interface Requirements Component Evaluation & Selection AEC-Q100 Design of Safety and Real-Time Systems DFMEA following SAE J1739 best-practices AUTOSAR Automotive RTOS Deployment Orthogonal Computational Assurance High-voltage / High-energy Systems (i.e. HVIL) CAN/LIN Bus Design, Analysis & Integration Environmental / Reliability testing HALT testing & HASS screening Automotive Electromagnetic Compatibility 12Image Used Under License
  • 13. Product Development 2012 Lean, Distributed Powerful, Secure Quality Core Toolset Team Remote Collaboration Investment Manufacturing & Testing Alliances Just-in-Time Specialized Test 13Image Credit: Google, IEEE, Tektronix
  • 14. High Performance PWBA Design Expertise 14
  • 15. High Performance PWBA Design Expertise PWBA Design 2012: Rigorous analysis and specification of the stack-up and physical interconnects combined with “SI aware” component selection and circuit design Pre-Route Analysis: Post-Analysis: Component SI-Aware HyperLynx LineSim HyperLynx BoardSim Selection, Design PWB Stackup What-if Analysis / & Routing Post-route Verification Constraints Doc. Optimization & Cross-talk Analysis AppliedLogix is the most widely known and highly respected Signal Integrity and EMC consulting group in WNY Numerous Peer Reviews and “Design Rescues” – functional and EMI Ongoing formal training (Robust Electronics Design) to OEM design teams 2012 IEEE International Symposium on Electromagnetic Compatibility – Global EMC University SI Track - Presenter 15
  • 16. High Performance PWBA Design Expertise GHz+ Serial links, e.g., PCIe, require unique expertise and tools Lossy transmission line analysis and S-parameter extraction Skin-effect losses and dielectric losses Via modeling – via stubs – beware of the ¼ wave resonator 16
  • 17. AppliedLogix: Value Stack Integrity & Professionalism Senior Level Team • “Top 5% Engineers” Best Practices • Advanced Technologies Domain Knowledge • Regulatory Experience Hardware Software SI Safety Core Engineering Skills • Active Practitioners 17
  • 18. “Walk the Talk”“Im glad to say that our high risk area - the DDR2 interface, is workingflawlessly. Thanks again for all your help”. Design Service Bureau Senior Design Engineer“Thank you for all the help that you have shared with the team. Much of ourlayout success can be attributed to the wealth of knowledge and experiencethat you’ve shared with us over the past couple quarters”. Fortune 200 HW Development Team Leader“AppliedLogix has earned special recognition for having exceeded ourexpectations…AppliedLogix was the driving force behind the architecturespecification…board detailed design, PWB layout, and prototype designvalidation of this high-performance image path subsystem”. Fortune 500 HW/SW Product Development Manager“Over my 35 years in the business I have worked with design engineers fromalmost every company in New York and I have to say that you are one of thefinest I have ever had the pleasure to have worked with”. Top 20 Semiconductor Mfr. Global Accounts Manager 18
  • 19. Next Steps We will support your product development with uncommon engineering expertise, teamwork, commitment, and passion… Let’s get started! Contact Information: Jim Herrmann, Managing Partner Mobile: 585-507-3464 Steve Griffith, Managing Partner Mobile: 585-734-7975 Angelo Caruso, Managing Partner Mobile: 585-414-8193 19