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BGA Layout While Designing Your Printed Circuit Board

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As technology increases, so does the need for BGA (Ball Grid Array) components. Screaming Circuits is excited to offer a presentation on BGA layout. This topic will cover why to use BGA's and specific …

As technology increases, so does the need for BGA (Ball Grid Array) components. Screaming Circuits is excited to offer a presentation on BGA layout. This topic will cover why to use BGA's and specific considerations to have while designing your pcb.

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  • 1. BGA Layout for ease of use Presenter Mike Galloway Manufacturing Engineer
  • 2. Overview Introduction BGA Capability BGA History DFM Standards Technologies Design Thermal Management Trace Routing and Vias
  • 3. IntroductionMike Galloway’s Experience:  18 years in electronics manufacturing.  Technical Support Team Manager for Screaming Circuits.Screaming Circuits History:  Established in 2003.  Assemble tens of thousands of boards with BGA components a year.  Screaming Circuits and it’s parent company MEC share 50 years of PCB assembly experience.
  • 4. BGA Experience Solder Paste: Package Solder Jet PrintingStandard Stencil Paste Application on Package: Two BGA’s stacked. Fig. 4 www.mydata.com Fig. 3 Hybrid Process Micro BGA: Mixed Alloys Less than .5mm www.laocsmta.org Fig. 5 Fig. 6
  • 5. BGA HistoryDeveloped in late 1980’s, gained popularity in 1990’s, andwide spread use in 2000’s.More complicated IC’s mean more I/O.  Real estate is at a premium, therefore smaller package types are becoming more common.  .5mm pitch and smaller is being used more.  Package on Package (POP) gaining popularity. Extensive use in the mobile device market.
  • 6. Standards Recommended reads: IPC-7095B Design and Assembly Process Implementation for BGAs IPC- 7351A Land pattern standard IPC-A-610E Acceptability of Electronic Assemblies IPC-J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies http://www.ipc.org
  • 7. Technologies Ball Alloy and its effect on assembly. Mixed Technology:  Lead free BGA and leaded solder.  Some good history in the industry.  Alloy seems to be somewhat reliable for commercial applications. www.jovy-sys.com Fig. 10  Leaded BGA and lead free solder. (Not recommended)  Voiding.  Alloy issues.  Part integrity compromised due to heat.Avoid mixing if possible. Stick with what is reliable and easy.
  • 8. DesignsMicro BGAs and the challengesaround them:  Larger dense parts nearby.  Issues with profiling.  Small pads.  SMDP (Solder Mask Defined Pad) www.polarinstruments.com Fig. 11  Trace routing:  Via in pad. (Fig. 12) Fig. 12
  • 9. DesignsPackage on Package (POP):  Limited experience in prototypes.  Requires significant process development.  Things to consider while designing:  Adjacent Components  PCB Stack up  Process development:  Part warping causing defects or long term reliability issues.
  • 10. Surface Finish Choices• HASL - Micro BGA not recommended due to coplarinarity variations. (Fig. 14)• ENIG - Needs good plating controls. Most vendors watch this very close. (Fig. 15)• IMAg - Some concerns with microvoids. (Fig. 16) Fig. 14 Fig. 15 Fig. 16
  • 11. Thermal ManagementGround/thermal pad under package:  Effects of inner ball reflow. (Fig. 17)  Voiding in pad causing insufficient heat transfer.  Vias in ground pad leaching solder away from the die and down the vias. (Fig. 18) Fig. 17 Fig. 18
  • 12. Trace Routing and ViasDesigns that try to keep everything on few layers:  Routing between pads. (Fig. 19)  Connecting a series of pads. (Fig. 20)  Using a thick trace, mask defined pads  Oversize or undersize pads, or a combination of both on one BGA Fig. 19 Fig. 20
  • 13. Summary Best guide for DFM standards is IPC-7095B. BGA’s are becoming unavoidable and require more knowledge for manufacturability. Learn more, ask questions:  Go to SMTA meetings  www.ipc.org  http://www.element14.com/community/groups/screaming-circuits  mgalloway@screamingcircuits.com
  • 14. Thank you for joining us.Questions?