BGA Layout While Designing Your Printed Circuit Board


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As technology increases, so does the need for BGA (Ball Grid Array) components. Screaming Circuits is excited to offer a presentation on BGA layout. This topic will cover why to use BGA's and specific considerations to have while designing your pcb.

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BGA Layout While Designing Your Printed Circuit Board

  1. 1. BGA Layout for ease of use Presenter Mike Galloway Manufacturing Engineer
  2. 2. Overview Introduction BGA Capability BGA History DFM Standards Technologies Design Thermal Management Trace Routing and Vias
  3. 3. IntroductionMike Galloway’s Experience:  18 years in electronics manufacturing.  Technical Support Team Manager for Screaming Circuits.Screaming Circuits History:  Established in 2003.  Assemble tens of thousands of boards with BGA components a year.  Screaming Circuits and it’s parent company MEC share 50 years of PCB assembly experience.
  4. 4. BGA Experience Solder Paste: Package Solder Jet PrintingStandard Stencil Paste Application on Package: Two BGA’s stacked. Fig. 4 Fig. 3 Hybrid Process Micro BGA: Mixed Alloys Less than .5mm Fig. 5 Fig. 6
  5. 5. BGA HistoryDeveloped in late 1980’s, gained popularity in 1990’s, andwide spread use in 2000’s.More complicated IC’s mean more I/O.  Real estate is at a premium, therefore smaller package types are becoming more common.  .5mm pitch and smaller is being used more.  Package on Package (POP) gaining popularity. Extensive use in the mobile device market.
  6. 6. Standards Recommended reads: IPC-7095B Design and Assembly Process Implementation for BGAs IPC- 7351A Land pattern standard IPC-A-610E Acceptability of Electronic Assemblies IPC-J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies
  7. 7. Technologies Ball Alloy and its effect on assembly. Mixed Technology:  Lead free BGA and leaded solder.  Some good history in the industry.  Alloy seems to be somewhat reliable for commercial applications. Fig. 10  Leaded BGA and lead free solder. (Not recommended)  Voiding.  Alloy issues.  Part integrity compromised due to heat.Avoid mixing if possible. Stick with what is reliable and easy.
  8. 8. DesignsMicro BGAs and the challengesaround them:  Larger dense parts nearby.  Issues with profiling.  Small pads.  SMDP (Solder Mask Defined Pad) Fig. 11  Trace routing:  Via in pad. (Fig. 12) Fig. 12
  9. 9. DesignsPackage on Package (POP):  Limited experience in prototypes.  Requires significant process development.  Things to consider while designing:  Adjacent Components  PCB Stack up  Process development:  Part warping causing defects or long term reliability issues.
  10. 10. Surface Finish Choices• HASL - Micro BGA not recommended due to coplarinarity variations. (Fig. 14)• ENIG - Needs good plating controls. Most vendors watch this very close. (Fig. 15)• IMAg - Some concerns with microvoids. (Fig. 16) Fig. 14 Fig. 15 Fig. 16
  11. 11. Thermal ManagementGround/thermal pad under package:  Effects of inner ball reflow. (Fig. 17)  Voiding in pad causing insufficient heat transfer.  Vias in ground pad leaching solder away from the die and down the vias. (Fig. 18) Fig. 17 Fig. 18
  12. 12. Trace Routing and ViasDesigns that try to keep everything on few layers:  Routing between pads. (Fig. 19)  Connecting a series of pads. (Fig. 20)  Using a thick trace, mask defined pads  Oversize or undersize pads, or a combination of both on one BGA Fig. 19 Fig. 20
  13. 13. Summary Best guide for DFM standards is IPC-7095B. BGA’s are becoming unavoidable and require more knowledge for manufacturability. Learn more, ask questions:  Go to SMTA meetings   
  14. 14. Thank you for joining us.Questions?