EKH Company Presentation 2010 11
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EKH Company Presentation 2010 11

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Short Overview on the services provided by EKH - EyeKnowHow

Short Overview on the services provided by EKH - EyeKnowHow

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EKH Company Presentation 2010 11 EKH Company Presentation 2010 11 Presentation Transcript

  • Eye Know How Signal Integrity Consulting Services and KnowHow
  • Company Facts Founder: Dipl. Ing. (FH) Hermann Ruckerbauer Founded: March 2009 Location: Office in Moos (Bavaria), Germany Network partners in: Munich (Design, Layout, CAD) Straubing (EMV) Deggendorf (Lab) China (Shandong und Shaanxi): Oulong Consulting EKH - EyeKnowHow 11/11/10 2
  • Hermann RuckerbauerBackgroundStudy of Micro System Technology at University of AppliedSciences in Regensburg Dipl. Ing. (FH) Micro System Technology15 Years experience in Memory Development and HighSpeed Signaling Siemens: Bench and Production test Infineon / Qimonda: High Speed Signaling Application test Interface standard definition Holder of many patents EEE Publication: Cascading Techniques for a High-Speed Memory Interface EKH - EyeKnowHow 11/11/10 3
  • EKH - Services Consulting for High Speed Signaling Consulting for memory implementation High speed simulation and measurement Power delivery simulation Model generation Logic Analyzer measurements Failure analysis (esp. on memory interfaces) PCB Design and Layout EKH - EyeKnowHow 11/11/10 4
  • EKH - Cooperation partners DKH – DesignKnowHow: Dr. Abdallah Bacha PCB Design and Layout RF Topics ESFODA: Michael Vogl (www.esfoda.de) CAD customization and automation SinePulse: Md Sayfullah (www.sinepulse.com) IT services (India) Hardware development (e. g. FPGA) FH Deggendorf (www.fh-deggendorf.de) Measurement Lab PCB X-section EKH - EyeKnowHow 11/11/10 5
  • EKH - Cooperation partners EMV – Testhaus (www.emv-testhaus.de) EMI / EMC compliance test PCB Manufacturing Enzmann (www.enzmann.de) Ilfa (www.ilfa.de) Assembly Mair Electronics (www.mair-elektronik.de) China Business (Peter Poechmueller) Oulong Consulting (www.oulongconsulting.com) EKH - EyeKnowHow 11/11/10 6
  • EKH - Customer examples Happy Customers TQ – Systems Kontron Congatec Numonyx 3D-Plus EKH - EyeKnowHow 11/11/10 7
  • Software Tools Agilent ADS Time and Frequency domain simulation Analog and Digital Simulation 2.5D and 3D field solver Data evaluation (measurement and simulation) Power Delivery Sigrity Power SI Design and Layout Cadence Allegro Mentor Hyperlinx/Pads EKH - EyeKnowHow 11/11/10 8
  • Services from EyeKnowHow 1) Memory System Know How 2) DRAM device Know How 3) Analog Simulation 4) Power Delivery Simulation 5) 2.5D Modeling: PCB Layout 6) 3D Modeling: Package and Connectors 7) Measurement Based Modeling 8) Signal Integrity Correlation Measurement 9) Logic Analyzer Memory Command Trace Evaluation 10) Failure Analysis 11) Design and Layout Services 12) EMC / EMI Measurement and Consulting EKH - EyeKnowHow 11/11/10 9
  • 1) Memory System Know HowWorked in the development of DDR1 / DDR2 / DDR3 / DDR4 Data and Command/Address bus architecture development Memory Device SpecificationConsumer, Mobile, Desktop and Server system understanding Differences in requirements and boundary conditionsSystem requirements Cache line size limitations Turnaround times, Bandwidth and latency Power limitationsClocking SSC, Random and Deterministic JitterController functionality Controller PCI register features (e. g. Delay shift, Driver strength, digital timings) EKH - EyeKnowHow 11/11/10 10
  • 1) Memory System Know How DDR1 Motherboard example DRAM DIMM Bus End TerminationController Register/PLLMemoryBUS 2 Slot/ 1 Connector System CLK buffer EKH - EyeKnowHow 11/11/10 11
  • 1) Memory System Know How DDR1 MBTDDR2 Testboard Example DIMMs DDR2 ODT Controller Emulator Clock Buffer EKH - EyeKnowHow 11/11/10 12
  • 1) Memory System Know HowDDR3 System example T D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D CPU T EKH - EyeKnowHow 11/11/10 13
  • 1) Memory System Know HowClose interaction between system Architecture and DRAM features IO specification (e. g. Input capacitance, driver and termination linearity) DLL functionality Memory Device SpecificationDRAM Core / architecture / process limitation Source for Latency ODOC package and impact on Architecture DRAM process and impact on speed and parasiticsDRAM packaging Planar and stacked DRAM parasitics Single Die DRAM package Wirebond and FCIP packaging EKH - EyeKnowHow 11/11/10 14
  • 3) Analog Simulation Time Domain simulation Spice models (Lumped elements and BSIM Transistor based) S-Parameter IBIS Frequency Domain simulation S-Parameter model generation Model comparison Statistical Data evaluation Adding Random and deterministic Jitter Channel characterization by Step Response Data Eye evaluation Setup/Hold Data eye generated out of Timing budget calculation Channel Step response EKH - EyeKnowHow 11/11/10 15
  • 3) Analog Simulation Schematic example: 10 coupled lines on a Desktop PC Motherboard DIMM socket DIMMController Package Controller Driver T-Branch on Motherboard 10 Coupled Via Motherboard Lead In EKH - EyeKnowHow 11/11/10 16
  • 3) Analog Simulation Simulation schematic example: 10 Coupled lines DRAM load Package Stub Resistor DIMM Lead In EKH - EyeKnowHow 11/11/10 17
  • 4) Power Delivery Simulation PowerSI Simulation: PDN impedance over frequency EKH - EyeKnowHow 11/11/10 18
  • 5) 2.5D Modeling PCB Layout Large LogicCadence and Mentor to ADS Layout transfer packageSimulation in Momentum Result: S-Parameter Model Co-Simulation with ADS time/frequency domain simulation Signals and Power Supply Integrity Layout accurate simulation X-talk (intera- and inter layer) Reflections Losses 3 coupled lines of a CA bus on a DIMM EKH - EyeKnowHow 11/11/10 19
  • 6) 3D Modeling: Package / ConnectorPackage and Connector ModelingADS 3D Fieldsolver EMDS Substrate routing Bondwires FBGA Package balls Signal traces Power planes 16 Coupled Bondwires: Signal and Power EKH - EyeKnowHow 11/11/10 20
  • 7) Measurement basedModelingCharacterization of existing boards Measurement with VNA TDR/TDT Characterization up to 20 GHz BW TDR of Memory Riser Card EKH - EyeKnowHow 11/11/10 21
  • 7) Measurement based Modeling Definition, Design and Layout of Characterization boards Lumped model fitting Insertion Loss Blue: Model Red: MeasurementTestboard for S-Parameter Measurements FEXT ADS model fitted to measurement results NEXT EKH - EyeKnowHow 11/11/10 22
  • 7) Measurement basedModeling Physical X-sections Measure what the manufacturer delivers Create model based on real HardwareDielectric (FR4) Traces Cross section of PCB with blind and micro vias (transmission line) Vias EKH - EyeKnowHow 11/11/10 23
  • 8) Correlation Measurements Dataeye @ 5.3Gb Measured vs. Simulated / Ball vs. Pad2x65 Ohm (initial Setting) Measurement @ ball Simulated @ ball Simulated @ pad2x45 Ohm (matched to the differential PCB Channel impedance) Measurement @ ball Simulated @ ball Simulated @ pad EKH - EyeKnowHow 11/11/10 24
  • 9) Logic AnalyzerCommand Trace evaluation Digital timing Trace evaluation Spec compliant timings / Finding timing violations Digital Timing Settings / MRS setting EKH - EyeKnowHow 11/11/10 25
  • 9) Logic Analyzer Command Trace evaluation Statistical Command sequence evaluation Timings: Statistical Access evaluation AL=3 BL=4 RL=4 TCCD=2 TCK=3750 TFAW=14 TPDN=0 TRAS=12 TRC=16 TRCD=4 TRFC=54 TRP=4 TRRD=3 TRTP=2 TRTW=2 TWR=4 TWTR=2 VDD=1800 WIDTH=64 WL=3 XT=1 Performance/Power Optimization Command Bank_00 Bank_01 Bank_02 Bank_03 Bank_04 Bank_05 Bank_06 Bank_07 Banks_All TOTAL RD 1289 402 1180 3884 0 0 0 7 0 6762 WR 1107 402 0 7 0 0 0 4 0 1520 ACT 45 31 31 30 0 0 0 1 0 138Observed timings RD_AP WR_AP 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0Name Min Max Name Min Max PRE 16 2 2 1 0 0 0 1 0 22tRAS_bank_0 12 2025 tRC_bank_0 16 2150 PRE_A 0 0 0 0 0 0 0 0 30 30tRAS_bank_1 259 2025 tRC_bank_1 761 2158 des 0 0 0 0 0 0 0 0 55843 55843tRAS_bank_2 450 2020 tRC_bank_2 718 2182 nop 0 0 0 0 0 0 0 0 0 0tRAS_bank_3 1874 2030 tRC_bank_3 2032 2122 MRS 0 0 0 0 0 0 0 0 0 0tRAS_bank_4 - - tRC_bank_4 - - REF 0 0 0 0 0 0 0 0 31 31tRAS_bank_5 - - tRC_bank_5 - - SRE 0 0 0 0 0 0 0 0 0 0 SRX 0 0 0 0 0 0 0 0 0 0tRAS_bank_6 - - tRC_bank_6 - - PDE 0 0 0 0 0 0 0 0 0 0tRAS_bank_7 573 573 tRC_bank_7 - - PDX 0 0 0 0 0 0 0 0 0 0tRAS_rank 12 2030 tRC_rank 16 2182 PRE_I 0 0 0 0 0 0 0 0 0 0 PDCONT 0 0 0 0 0 0 0 0 0 0tRCD_bank_0 1 5 tRP_bank_0* 4 124 BST 0 0 0 0 0 0 0 0 0 0tRCD_bank_1 1 11 tRP_bank_1* 5 1763 DPD 0 0 0 0 0 0 0 0 0 0tRCD_bank_2 1 6 tRP_bank_2* 5 268tRCD_bank_3 1 10 tRP_bank_3* 5 142tRCD_bank_4 - - tRP_bank_4* - -tRCD_bank_5 - - tRP_bank_5* - -tRCD_bank_6 - - tRP_bank_6* - -tRCD_bank_7 5 5 tRP_bank_7* 1089 1089tRCD_rank 1 11 tRP_rank 4 1763tRFC 55 55tREFI 2072 2091tRRD 3 2070tCCD 2 77 EKH - EyeKnowHow 11/11/10 26
  • 10) Failure analysis Memory test failure Analyis Evaluate log files from Software Memory tests Narrow down failure reason DQ vs. CA related fail Single DQ vs. DQS fail Read vs. Write fail Device vs. Signal integrity related fail Vref Margin test implementation Adjust VREF until fail and evaluate fail behavior Timing Margin test implementation Change Controller delays (DQS and CLK) until fail and evaluate fail behavior 12742808 12742822 FAILURE: possible bad address line at offset FAILURE: possible bad address line at offset 0x00000000 = 0x018A5141 = address 0x062D4504 address 0x099C0038 Expected value F9D2BAFB, Read value 8002BAFB Expected value F663FFC7, Read value 099C0038 Re-Read: Re-Read: Expected value F9D2BAFB, Read value 8002BAFB Expected value F663FFC7, Read value 099C0038 Expected value F9D2BAFB, Read value 8002BAFB Expected value F663FFC7, Read value 099C0038 Expected value F9D2BAFB, Read value 8002BAFB Expected value F663FFC7, Read value 099C0038 Expected value F9D2BAFB, Read value 8002BAFB Expected value F663FFC7, Read value 099C0038 Skipping to next test... EKH - EyeKnowHow 11/11/10 27
  • 11) Design / Layout4GB DDR2 Registered DDR2 RDIMM 4GB EKH - EyeKnowHow 11/11/10 28
  • 11) Design / Layout DDR3 Unbuffered VLP DDR3 UBU VLP 1Rx8/2Rx8 ECC/non ECC: DIMM view Top view ECC Termination CA BUS RANK 0Termination Bottom view ECC CA BUS RANK 1 EKH - EyeKnowHow 11/11/10 29
  • 11) Design / LayoutDDR3 Unbuffered VLP : Timing budget Setup/Hold: 558ps/336ps Setup/Hold: 532ps/368ps Setup/Hold: 511ps/336ps WEAK CASE 39 ohm Termination D0 D1 D2Setup/Hold: 481ps /334ps Setup/Hold: 423ps/406ps Setup/Hold: 341ps/478ps D3 D8-ECC D4Setup/Hold: 298ps/513ps Setup/Hold: 273ps/512ps Setup/Hold: 226ps/524ps D5 D6 D7 EKH - EyeKnowHow 11/11/10 30
  • 12) EMC / EMI Investigations Spec. Limits & Measurementssystem specificationlimits (e.g. for PC, Server) measurement results DDR2 P-/R-DIMM on SUN Fire T2000 "Ontario" EKH - EyeKnowHow 11/11/10 31