Merix Capabilities Ext Na 1 09
Upcoming SlideShare
Loading in...5
×
 

Merix Capabilities Ext Na 1 09

on

  • 1,899 views

 

Statistics

Views

Total Views
1,899
Views on SlideShare
1,887
Embed Views
12

Actions

Likes
1
Downloads
6
Comments
0

1 Embed 12

http://www.slideshare.net 12

Accessibility

Categories

Upload Details

Uploaded via as Adobe PDF

Usage Rights

© All Rights Reserved

Report content

Flagged as inappropriate Flag as inappropriate
Flag as inappropriate

Select your reason for flagging this presentation as inappropriate.

Cancel
  • Full Name Full Name Comment goes here.
    Are you sure you want to
    Your message goes here
    Processing…
Post Comment
Edit your comment

Merix Capabilities Ext Na 1 09 Merix Capabilities Ext Na 1 09 Presentation Transcript

  • Merix Corporation Capabilities Cross Compare San Jose Oregon Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B 1.0 Material 1.1 Global Material Offerings All Sites Number of Conductive layers Number of Conductive layers Number of Conductive layer Number of Conductive layer Isola FR406: 2 - 30 32 - 40 2 - 30 32 - 40 Isola 370HR: 2 - 30 32 – 40 2 - 30 32 – 40 ITEQ 180: NO 2 - 40 NO 2 - 40 FR408: 2 - 30 32 – 40 2 - 30 32 – 40 N4000-13 & 13SI: 2 - 30 32 - 40 2 - 30 32 - 40 Rogers 4350/4450: M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric 1.2 Additional Standard Based Material Standard FR4: 2 - 30 32 – 40 2 - 30 32 – 40 High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40 High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40 1.3 Low Loss E-Glass Materials High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40 Polyclad GETEK & MEM Megtron: NO NO NO NO Nelco 4000-13& 13SI: 2 - 30 32 – 40 2 - 30 32 – 40 1.4 Lead-Free Qualified Materials ITEQ 180: NO 2 - 40 NO 2 - 40 High Tg CAF Resistant (370HR): 2 - 30 32 – 40 2 - 30 32 – 40 High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40 High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40 Polyimide: 2 - 30 32 – 40 2 - 30 32 – 40 1.5 Lead-Free Low Loss Materials High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40 Nelco 4000-13EP and EPSI: 2 - 30 32 – 40 2 - 30 32 – 40 1.6 High Temperature Materials Polyimide: 2 - 30 32 – 40 2 - 30 32 – 40 1.7 Commercial RF Materials Roger 3000 Series: YES YES YES YES Roger 4000 Series: YES YES YES YES Taconic RF Materials: YES YES NO YES 1.8 Advanced RF Materials Nelco 9000 Series (PTFE): 1-2 NO NO NO Roger 6000 Series: 1–2 NO NO NO Roger 5000 Series: 1–2 NO NO NO 1.9 Asia Material Offering Isola 400,402, and ED130UV (Tg=125-145C): NO NO NO NO Polyclad 370/ Turbo (Tg=175C): NO NO NO NO ITEQ IT140(Tg=140C) NO NO NO NO Nanya NP-140 (Tg=140C) NO NO NO NO SHENGYI S1141 (Tg=135C): NO NO NO NO SHENGYI S1441 (Tg=140C): NO NO NO NO ITEQ IT158 (Tg=150C): NO NO NO NO SHENGYI S1170 (Tg=170C): NO NO NO NO ITEQ IT170 (Tg=170C) NO NO NO NO 1.10 Buried Capacitance Isola FR406– 2mil YES YES YES YES Isola FR408- 2mil YES YES YES YES Isola 370HR-2 mil YES YES YES YES Nelco-13 and -13Si – 2mil YES YES YES YES Isola IS620 – 2mil YES YES YES YES Polyimide P96 – 2mil YES YES YES YES Oak-Mitsui Faradflex – BC 24 ( 1 mil) NO NO YES YES Oak-Mitsui Faradflex – BC12TM (.5 mil) NO NO NO YES 1.11 Panel Sizes and Useable Area Merix Corporation Page 1 of 5 Rev:090128
  • San Jose Oregon Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B 18 X 24 18 X 24 Multilayer Panel Sizes: 12 X 18 16 X 18 21 X 24 16 x 18 Non Usable Border on Panel: Double Sided Boards: .65 .65 .65 .55 Multilayer Boards: .75 .75 .65 .55 Spacing Between Boards: (Routing Process) Double Sided and Multilayer Boards: .150 .100 .150 .100 2.0 Stack-ups 2.1 Overall Thickness Range and Tolerances Overall Board Thickness: ≤ ≤ ≤ ≤ .126 - .240 .240 .126 - .240 .275 Overall Board Thickness Tolerance: < .020”: +/- 15% +/- 15% +/- 15% +/- 15% .031”: +/- 15% +/- 10% +/- 15% +/- 10% .062”: +/- 10% +/- 8% +/- 10% +/- 8% .093”: +/- 10% +/- 8% +/- 10% +/- 8% .125”: +/- 10% +/- 8% +/- 10% +/- 8% .187”: +/- 10% +/- 8% +/- 10% +/- 8% 2.2 Flatness Spec Flatness: (Warp per Inch) .010 .007 .010 .0075 2.3 Thinnest Dielectric Finished Thin Board Overall Thickness: .017 .013 .017 .015 Thinnest Plated Core: .012 .008 .012 .008 3.0 Mechanical Capabilities 3.1 Machining Drill Capabilities Primary Drilled Hole Location Tolerance to Datum (Hole) Zero (DTP): 0.007 0.006 0.007 0.006 2nd Drill Hole Location Tolerance to Datum Zero (DTP): 0.014 0.011 0.014 0.011 Minimum Clearance from Copper Conductor to Mechanical Drilled Hole: .0085 .008 .0085 .008 Minimum Clearance from Copper Conductor to a Laser Drilled Hole: .008 .006 .0085 .008 3.2 Plated Through Hole Capabilities Smallest Plated Thru Hole Size: (Finished Via Size with Finished Hole Size - 1 mil Min Ave Copper Requirement) Finished Panel Thickness < .020”: .004 .003 .006 .006 Finished Panel Thickness .031”: .004 .004 .006 .006 Finished Panel Thickness.062”: .006 .006 .006 .006 Finished Panel Thickness.093”: .010 .008 .008 .008 Finished Panel Thickness.125”: .012 .008 .008 .008 Finished Panel Thickness.187”: .015 .012 .014 .012 Plated Hole Tolerance: +/-.003 +/-.002 +/- .003 +/- .002 Aspect Ratio (with 10 mil drill): 10:1 12:1 12.5:1 14:1 Plated Hole Spacing Minimum (Drilled hole to hole): .022 .015 .022 .015 3.3 Non Plated Through Holes Smallest Non Plated Hole Size: (Finished) .010 .008 .010 .008 Largest Non-Plated Hole Size Routed: .200 NO LIMIT .200 NO LIMIT Largest Primary Drilled and Tented Non-Plated Hole: .200 .250 .200 .250 Non-plated Routed Hole Tolerance: +/- .005 +/- .003 +/- .005 +/- .003 Minimum NPTH to Edge of Board Spacing: .020 .010 .020 .010 3.4 Micro Via (µVia) Capabilities Smallest Laser µVia Hole Size: ( Via Size with 0.4 mil Copper Requirement) .004 .004 .004 .004 Largest Drilled Laser Via: .010 .010 .006 > .009 Via Aspect Ratio 0.8:1 .9:1 .75:1 .85:1 Capture Pad Size: µvia + .010 µvia + .006 µvia + .010 µvia + .007 Landing Pad Size: µvia + .010 µvia + .006 µvia + .010 µvia + .007 Stacked Via NO 2 NO 3 Type I Capabilities YES YES YES YES Type II Capabilities YES YES YES YES Type III Capabilities NO NO NO YES 3.5 Control Depth Drill Capabilities Smallest Control Depth Drill .008 .006 .010 .010 Largest Control Depth Drill .125 .257 .125 .125 Minimum Backside Dielectric Separation .008 .005 .007 .007 Control Depth Drill Depth Tolerance .005 .002 .005 .002 Control Depth Drill Aspect Ratio (with tolerance) .75:1 .85:1 .75:1 .85:1 3.6 Back Drilling Capabilities Merix Corporation Page 2 of 5 Rev:090128
  • San Jose Oregon Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Minimum Back Drill Drilled Diameter .022 .020 .022 .020 Drilled Hole Over Finished Hole Size .012 .010 .012 .010 Drill Depth Tolerance +/- .008 +/- .005 +/-.008 +/-.005 Number of Drilled Depths per Side MULTIPLE MULTIPLE MULTIPLE MULTIPLE 3.7 Scoring Capabilities Angles: 60° 30° / 45° 30° 30° Offset Tolerance: +/- .010 +/- .005 +/- .003 +/- .002 Optimum Remaining Web Thickness: .018 .012 .015 .012 Remaining Web Tolerance +/- .005 +/- .003 +/- .005 +/-.002 True Position Tolerance: .010 .005 .008 .005 3.8 Edge Connector Bevel Capabilities Finger Tip Angle: 45° 30° / 20° 49°, 45°, 40° 30°, 20° Bevel Depth Tolerance: +/- .010 +/- .005 +/- .008 +/- .005 3.9 Profile Capabilities Standard Router Bit Diameter: .093 & .125 .062,.039,.031 1.6 mm, 2.4mm, .125 .031, 1mm Routed Profile Tolerance: (18”X 24” Panel): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 Routed Cutout Tolerance: (0.50” x 0.50”): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 Minimum Internal Rout Radius: > .031 0.016 > .031 0.016 Minimum Routed Slot Width: > .062 .062 - .031 > .062 .062 - .031 4.0 Feature Size Capabilities 4.1 Innerlayer Capabilities Minimum Conductor Width Internal Starting Copper Weight ½ oz.: .00325 .003 .00325 .003 Internal Starting Copper Weight 1 oz.: .004 .0035 .004 .0035 Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 Internal Starting Copper Weight 3 oz: NO YES NO YES Minimum Conductor Spacing: (Airgap) Internal Starting Copper Weight ½ oz.: .0035 .00325 .0035 .00325 Internal Starting Copper Weight 1 oz.: .004 .004 .004 .004 Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 Internal Starting Copper Weight 3 oz.: NO YES NO YES 4.2 Outerlayer Capabilities (Finished Cu Thick) (Finished Copper Thickness with Base Foil and Plating) Minimum Conductor Width (Finished Copper Thickness with Base Foil and Plating) External Copper Thickness 1.5 mil: .004 .003 .0035 .003 External Copper Thickness 2.0 mil: .0045 .0035 .004 .0035 External Copper Thickness 2.5 mil: .0055 .005 .0055 .005 External Copper Thickness 3.0 mil: .007 .006 .007 .006 (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) Minimum Conductor Spacing: (Airgap External Copper Thickness 1.5 mil: .004 .003 .004 .0035 External Copper Thickness 2.0 mil: .0045 .0035 .0045 .004 External Copper Thickness 2.5 mil: .005 .004 .006 .0055 External Copper Thickness 3.0 mil: .007 .006 .007 .006 4.3 Pad Diameter to Finished Hole Size Conventional Drilling: Minimum Pad / Drill / Plated Hole: (Pad Size for Tangency. Add 2X minimum annular ring as needed.) PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE .062 Thick Board: .020/.010/.006 .018/.008/.004 .020 / .010 / .006 .018 / .008 / .004 .093 Thick Board: .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .125 Thick Board ( .120 for HY only): .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .150 Thick Board: .022 / .012 / .008 .020 / .010 / .005 .022 / .012 / .008 .020 / .010 / .005 .187 Thick Board: .024 / .014 / .010 .022 / .012 / .008 .024 / .014 / .010 .022 / .012 / .008 Micro Drilling: Laser Via Blind Via: .012/.006/.003 .010/.005/.003 .012/.004/.004 .011/.004/.004 Micro Drilling: Mechanical Via Blind Via: .012/.006/.003 .010/.005/.003 .020 / .010 / .006 .019 / .008/ .004 5.0 Solder Mask and Silkscreen 5.1 Solder Mask Minimum Solder Mask Clearance: (LPI) Pad size larger than NPTH: .010 .006 .010 .006 Over Surface Image (pad relief): .006 .003 .005 .004 Web Between Surface Mount Pads: .004 .003 .003 .002 IPC SPEC COVERAGE IPC SPEC COVERAGE Solder Mask Thickness Over Metal: (SPC RANGES .0002 - .003 TYPICAL = .0007 over conductor) (SPC RANGES .0002 - .003 TYPICAL = .0007 over conductor) BLUE, RED, BLACK, YELLOW, Solder Mask Colors: GREEN WHITE GREEN RED, BLUE, BLACK Merix Corporation Page 3 of 5 Rev:090128
  • San Jose Oregon Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Solder Mask Type: TAIYO-PSR4000 - HFX TAIYO-PSR4000 - HFX Minimum Mask Defined Pad Diameter: .012 .010 .012 .010 Mask Defined Pad Minimum Overlap of Copper: .005 .0025 .005 .0025 5.2 Silkscreen Minimum Width Silk Screen Image: .007 .005 .006 .005 Nomenclature Colors WHITE BLACK, YELLOW WHITE BLACK, YELLOW 6.0 Via-in-Pad - HDI 6.1 Epoxy Filled – Non Conductive Epoxy Filled Thru Hole Capability: YES YES YES YES Epoxy Filled Thru Hole Minimum: .010 .0072 .010 .008 Epoxy Filled Thru Hole Maximum: .018 .020 .020 .035 Epoxy Filled µVia Process: YES YES YES YES Epoxy Filled µVia Hole Minimum: .0055 .004 .0055 .004 Minimum Board Thickness: .025 .020 .020 .020 Maximum Board Thickness: .125 .180 .120 .180 Via Fill Aspect Ratio: 8:1 12:1 10:1 12:1 Maximum Panel Size for µVia: 12 X 18 18 X 24 18 X 24 21 X 24 Outerlayer Trace Widths/Spacing .004 / .005 .0035 / .0045 .004 / .005 .004 / .0045 with Wrap Spec Class II 6.2 Copper Plated/ Filled Copper Filled µVia Process: NO NO NO YES Copper Filled µVia Hole Minimum: NO NO NO .004” Copper Filled µVia Hole Maximum: NO NO NO .005” Via Fill Aspect Ratio: NO NO NO .85:1 Maximum Board Thickness: NO NO NO <.150” Outerlayer Trace Widths/Spacing: NO NO NO .004”/.004” with LB to Pattern Combined with other fill technologies NO NO NO Must be reviewed 7.0 Military 7.1 Etch Back 2 Pt. Connection YES YES FR406, 370HR, FR408, Nelco-13, IS415, and Polyimide 3 Pt. Connection ( glass etch) YES YES FR406, 370HR and Polyimide 8.0 Cavity Boards - TMS Through Rout Technology: NO YES YES YES Step Rout Technology: NO YES YES YES 9.0 Thermal Management Technology 9.1 Coin Attached Conductive Adhesive: NO NO YES YES Solder Adhesive: NO NO NO YES 9.2 Pallet Attached Conductive Adhesive: NO NO YES YES Embedded Copper Technology(Merix Patent Pending): NO NO YES YES 10.0Surface Finishes Options 10.1 Surface Finishes Selection Hot Air Solder Level: YES YES YES YES Immersion Silver: Enthone Alpha Star MacDermid Sterling Lead Free OSP : Shikoku F2(LX) Shikoku F2(LX) Electroless Nickel Immersion Gold: YES YES YES YES Immersion Tin: YES YES NO Yes – thru SJ Full Body Gold: YES YES – 4 mil spacing on .5 oz YES YES Bondable Gold: YES YES – 4 mil spacing on .5 oz NO NO 10.2 Mixed Finishes Immersion Silver with Selective Hard Gold: YES YES YES YES HASL with Selective Gold: YES YES YES YES Dual Gold Plating: YES YES YES YES Immersion Gold with OSP: YES YES NO NO Immersion Gold with Selective Hard Gold: NO YES NO YES Selective Hard Gold with OSP: YES YES YES YES Recessed Fingers: YES YES NO NO 10.3 Lead-Free Surface Finishes Immersion Silver: YES YES YES YES Lead Free OSP : Enthone 106AX-HT Shikoku F2(LX) Electroless Nickel Immersion Gold: YES YES YES YES Immersion Tin: YES YES NO YES Full Body Gold: YES YES YES YES Lead-Free HASL: NO YES – Outside Service NO YES – Outside Service 11.0 Testing Capabilities Merix Corporation Page 4 of 5 Rev:090128
  • San Jose Oregon Volume Production Controlled Volume Production Volume Production Controlled Volume Production Class A Class B Class A Class B Minimum Test Continuity Resistance: 20 OHMS 10 OHMS 20 OHMS < 20 OHMS Maximum Test Voltage: 100V 200V 100V 250V Maximum Test Isolated Resistance: 10M OHMS 50M OHMS 10M OHMS 100M OHMS Largest Test Bed Fixtured: 12 X 19.3 16.5 X 22.5 29.6 x 19.2 DD 29.6 x 19.2 DD Largest Test Bed Flying Probe: 20 X 24 20 X 24 24X27 24X27 Electrical Test Pitch (Fixture Test): 0.019 0.016 .020 .016 Electrical Test Pitch (Flying Probe Test): 0.008 0.004 .010 .005 DC Line Resistance Testing: NO YES NO YES Prop Delay: NO NO YES YES 12.0 Electrical Performance TDR Test Tolerance (Print and Etch): +/- 10% +/- 7.5% +/- 10% +/- 7.5% TDR Test Tolerance (Plated Copper): +/- 15% +/- 10% +/- 10% +/- 10% TDR Test Tolerance Differential Measurements: +/- 15% +/- 10% +/- 10% +/- 10% TDR Tolerance Single Ended Tolerance: +/- 10% +/- 7.5% +/- 10% +/- 10% HiPot Testing (AC & DC): NO YES YES YES 13.0 Data & Documentation 13.1 Tooling Formats Film Data Formats: ODB++ RS-274X ODB++ RS-274X Drill Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER Route Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER Electrical Test Formats: ODB++ IPC-D-356A ODB++ IPC-D-356A IPC-D-356A OR MENTOR NEUTRAL IPC-D-356A OR MENTOR NEUTRAL Netlist Compare Formats: FILE FILE ODB++ ODB++ 13.2 Tooling Communication Media Types & Data Transfer: FTP FTP ftp.sj.merix.com ftp.merix.com E-mail E-mail cam@sj.merix.com cam@fg.merix.com Compression Formats: ZIP, TAR, TGZ RAR, ARC ZIP, TAR, TGZ RAR, ARC Secured Transfer: FTP PGP ENCRYPTION FTP PGP ENCRYPTION Merix – San Jose Merix – Oregon 355 Turtle Creek Court 1521 Poplar Avenue San Jose, California 95125 Forest Grove, Oregon 97116 Phone: (800) 800-3278 Phone: (888) 256-3749 Direct: (408) 280-0422 Direct: (503) 359-9300 FTP: ftp.sj.merix.com FTP: ftp.merix.com Merix Corporation Page 5 of 5 Rev:090128