M2m technical-white-paper

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  • 1. SOLUTION BRIEFIntel® M2M Reference Design based on the Intel® Atom™ processorMachine-to-Machine (M2M) ApplicationsIntel® M2M Reference Design for Smart ServicesDevelopment based on the Intel® Atom™ ProcessorWith a footprint the size of a credit card† the design supports a variety of wireless connectivity and delivers thecomputing performance required for M2M (machine-to-machine) applications. The Connected World Intel and Ericsson* both forecast that tens The need for M2M connectivity and compute of billions of devices will communicate is accepted worldwide by technology over the Internet this decade.1,2 Cellular leaders who share the vision that most, if carriers worldwide believe their networks not all, electronic devices will be connected will serve more machines than people.3 to the Internet in the not too distant future. This will create a pervasive Internet that When those devices become connected, enables more intelligent devices, and Intel new opportunities for services, delivery of is ready to meet the needs of a connected content, system optimization and a limitless world. number of other possibilities will emerge. Small Connected Compute Platform Sparing system designers from mastering the complexities of wireless connected computer technology, the Intel® M2M Reference Design, based on the Intel® Atom™ processor, provides a manufacturing- ready platform supporting a variety of wireless connectivity, including 3G/4G wireless broadband, WiFi* and solutions using the IEEE 802.15.4 WPAN technology such as ZigBee*. Now, manufacturers of connected devices can dramatically lower development and product cost with this Intel Atom processor-based platform based on COM Express* form factor architecture. Measuring a mere 84 mm x 55 mm, this “nano” form factor (Figure 1) is ideal for space-constrained, fanless environments. The compute module sits on a carrier board in a case measuring 100 mm x 67 mm, not including antennas or connectors.
  • 2. Reference Design ModelThe reference design is comprised offive main components: carrier board,a Kontron* COM Express* compatiblenanoETXexpress-TT Computer-On-Moduleand enclosure, as well as the optional AVBoard and Expansion Board. Commercial Figure 1. Reference Design Footprint, Kontron* COM Express* compatible nanoETXexpress-TToff-the-shelf (COTS) COM Express modulesare available from multiple suppliers.Benefits for Developers • Optimal System Form Factor: The low- playing a key role in bridging large andThis Intel reference design, featuring support power, small form factor design satisfies small devices. The Intel M2M Referencefor multiple wireless connections, offers requirements for space-constrained Design based on the Intel Atom processorsignificant advantages for developers: environments (e.g., above ceilings and in can be used to develop M2M devices: equipment closets). indirect nodes, direct nodes and gateways,• Reduced Time-to-Market: Complete, manufacturing-ready system helps • Broad Range of Solutions: Intel as described in Figure 2. reduce development time and project risk. reference designs are supported and M2M Indirect node: “Indirect” interface enriched by a strong ecosystem of to the cloud. Attaches to an M2M gateway• Lower Risk: Equipment manufacturers hardware and software providers, (part of the gateway’s domain) using a easily implement connected compute including members of the Intel® wireless personal area network, such as technologies without prior wireless Embedded Alliance. experience. ZigBee, or a wireless local area network www.intel.com/go/embeddedalliance (WLAN), such as WiFi.• Diverse Open Source Software: A wide variety of open source software Smart Services Nodes and Gateways is available, including the Linux* Internet Protocol (IP) networks are the Direct Node operating system, chipset drivers and foundation for the connected world, and protocol stacks. there are several wireless technologies 2.5G/3G/4G Gateway Wireless Broadband WiFi, Ethernet, ZigBee Indirect Node Figure 2. Connectivity Example for Gateways and Direct/Indirect Nodes M2M Direct node: “Direct” interface to the cloud. Attaches directly to a wireless broadband network using 2.5G, 3G or 4G radios. M2M Gateway: “Direct” interface to the cloud and indirect nodes. Has a wired or wireless broadband network interface and one or more short haul or WLAN interfaces for connecting to indirect nodes.
  • 3. Small Form-Factor COM ExpressAdvantagesCOM Express is a Computer-on-Module(COM) mezzanine architecture that placesthe processor, chipset and memory ina compute module that is seated underthe carrier board. This solution makes SIMit possible to swap in different COM CardExpress modules for the right level ofperformance. The Kontron COM Express WPAN WLANcompatible nanoETXexpress-TT is an Antenna Carrier Board with 802.15.4 Radio Antennaextension of the COM Express architecture MicroSD RJ-45to a smaller (84x55mm) form factor Headphone underneath (w/magnetics)that maintains backwards compatibility 60-PIN CONNECTOR Microphone 12 Vdc Drop-In 3G INwith the COM Express connector and pin AV Board PCI Express* 60-PIN CONNECTOR Full-Minidefinitions, thus enabling vendors to meet MicroHDMI* Radio Card USB Wi-Fismaller footprints. MicroHDMI* PCI Express* Client USB Half-Mini USB PortApplying the COM Express modular underneath Radio Card underneath 3G/3G 3G/WLAN MIMOarchitectural approach, equipment Antenna Antennamanufacturers can reduce development Figure 3. Reference Design Carrier Boardeffort and risk, simplify manufacturing andstreamline support processes, compared to Drop-In 3G PCI Express Wi-Fi PCI Expressfully custom designs. Full-Mini Radio Card AV Board Half-Mini Radio Card• Minimize product definition: Instead of expending valuable time writing Carrier Board with 802.15.4 Radio Carrier Board with 802.15.4 Radio specs for the computing system, MicroSD Card SIM Card MicroSD Card SIM Card developers can simply evaluate COTS nanoFTXexpress-TT* COM nanoFTXexpress-TT* COM COM Express modules available from a) Headless Version b) With Optional Boards various suppliers. Figure 4. The Intel® M2M Reference Design Based on the Intel® Atom™ processor• Reduce design risk: Since proven standard COM Express modules can be COM Express Carrier Board additional connectivity or interfaces. There The Intel® M2M Reference Design based is also an RJ-45 connector with onboard acquired at an early stage of the project, on the Intel® Atom™ processor is based magnetics for connecting to a wired it is possible to get a head start on prototyping and software development, on a carrier board that is the same size Ethernet LAN. An accelerometer is attached which lowers software development as its companion Kontron COM Express to the I2C bus. risk. The same carrier boards can be compatible nanoETXexpress-TT with The reference design, illustrated in Figure used with multiple generations of a Type 1 or Type 10 connector. The 4, supports two configurations: one with compute modules. design, illustrated in Figure 3, supports two PCI Express* Mini Cards for wireless audio-video (AV) and expansion boards• Simplify build management: Equipment connectivity: a full-size card for broadband and the other without, making it suitable manufacturers only need to track one wireless (e.g., 3G/4G) and a half-size card for headless devices. The AV board has line item for a COM Express module for WiFi, Bluetooth or WiMAX*. The carrier microphone and speaker jacks plus two instead of more than a hundred parts board also has an 802.15.4 radio to support MicroHDMI connectors for dual independent associated with the computing module, wireless PAN protocols such as ZigBee. displays. The expansion board can be used greatly simplifying manufacturing. Three USB ports are available to support to add other functionality and I/O.
  • 4. Kontron* M2M System Kontron nanoETXexpress-TT* COM Carrier Board Intel® Atom™ Processor E640T Audio-Video (AV) Board 1 GHz DDI (SDVO) HDMI* Converter Integrated Graphics LVDS Engine HDMI* Converter HDA + SPKR Audio Codec PCI Express x1 PCI Express* Half-Mini Card USB 2.0 Subscriber Identity Module (SIM) Card Connector Memory 1GB DDR2 UICC Controller (memory down) PCI Express x1 PCI Express Full-Mini Card USB 2.0 Future Expansion PCI Express x1 PCI Express SPI bus Serial Peripheral Interface PCI Express x1 USB 2.0 USB 2.0/1.1 PortsPower-efficient Intel® Atom™ 2x UART/CAN UART/optional CANProcessors 2x SATA Serial ATAThe reference design’s block diagram, SMBus System Management Busillustrated in Figure 5, meets the I2C Intel® Platformneeds of a large assortment of I2 C Controller I 2C Hub EG20Tperformance-intensive, small form Accelerometerfactor systems that require low USB 2.0/1.1 Ports 3x USB 2.0/1.1 SDI SDIO Boot Flashpower. An Intel® Atom™ processor USB 2.0 802.15.4 RadioE6xx series, paired with the highly SDIOintegrated Intel® Platform Controller MicroSD* Connector RGMIIHub EG20T, has a combined thermal Ethernet Port (RJ-45) Ethernet Ethernet PHYdesign power (TDP) under 6 watts.The Intel® processor integrates a Figure 5. Reference Design Block Diagramgraphics engine supporting 2D andadvanced 3D graphics, high-definition Jumpstart Your Connected-Compute Smart Services Designvideo decode, image processing andLVDS/SDVO display interfaces. This Simplifying M2M design, the Intel M2M Reference Design based on the Intel® Atom™platform’s low power consumption and processor, provides smart services developers, equipment manufacturers and independentembedded lifecycle support is ideal for software vendors (ISVs) with a platform that can greatly reduce development time andmany embedded markets, especially cost. As the M2M industry evolves, network connectivity will be a check-off requirementthose requiring fanless operation. for most every device. Satisfying this expectation, the reference design delivers a small, high-performance, low-power solution. To learn more about Intel’s solutions for wireless connected devices, please visit www.intel.com/go/m2m For more information about the Kontron M2M platform visit www.kontron.com/M2M †Compute card is about the size of a credit card, the carrier board and case are slightly larger INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL MAY MAKE CHANGES TO SPECIFICATIONS, PRODUCT DESCRIPTIONS, AND PLANS AT ANY TIME, WITHOUT NOTICE. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel’s Web Site at www.intel.com. Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details. 1 http://www.intel.com/embedded/intelligence/embedded-internet/index.htm 2. http://www.ericsson.com/news/1403231 3. http://connectedplanetonline.com/3g4g/news/T-Mobile-M2M-connections-outnumber-humans Copyright © 2011 Intel Corporation. All rights reserved. Intel, Intel Atom, Intel Atom Inside and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the United States or other countries. *Other names and brands may be claimed as the property of others. 0711/MS/SD/PDF Please Recycle 324391-009US