Thin Wafers, Temporary Bonding Equipment & Materials Market


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Thin Wafers, Temporary Bonding Equipment & Materials Market

  1. 1. Thin Wafers, Temporary Bonding Equipment & MaterialsMarketReport Details:Published:October 2012No. of Pages:Price: Single User License – US$5390Memory, Logic, Power Devices & Image Sensors markets will drive the thin wafers marketand related handling technologiesWITH ALMOST ¾ OF THE TOTAL NUMBER OF WAFERS EXPECTED TO BE THINNED BY2017, TEMPORARY BONDING MARKET WILL INCREASE IN THE COMING YEARSThis Yole Développement report describes why thinner wafers will be needed in the future,especially for consumer applications. Indeed, consumer electronics is a big driver for smaller,higher-performing, lower-cost device configurations for use in various applications, such asmemory and wireless devices. These new configurations, in turn, are pushing demand for thin (<100 µm) and even ultra-thin semiconductor wafers (below 40µm) with the following benefits:•Reduced thickness and thus thinner packages (in cell phones, packaged dies must be < 1.2mm thick; this number shrinks to1mm for smart phones)•Wafer thinning is the most efficient approach used for heat dissipation in thermal management•For 3D integration, thin wafers bring higher through Si vias density, as pitch and dimensions are becoming smallerHowever, as wafer thickness decreases to 100µm and below, manufacturing challenges arise.Ultra-thin wafers are less stable and more vulnerable to stress, and the die can be prone tobreaking and warping—not only during grinding but also during subsequent processing steps. YoleDéveloppement’s report describes why special thin wafer handling processes (i.e. temporarybonding) are necessary, especially when wafers are dual-side processed or have hightopographies.This report deals not only with the thin wafers market and applications, but also with relatedprocesses, equipment, and materials for temporary bonding.Thin wafer shipment forecasts are analyzed, as there is definitely a growing need for thin wafers(below 100 µm) for numerous applications: 3D ICs, MEMS, CMOS Image Sensors, PowerDevices, LEDs, RF Devices, Memory & Logic, Interposers and Photovoltaic. The report showsthat, by 2017, the ratio of THIN wafers vs. TOTAL number of wafers (in 300 mm eq.) will be 74%,corresponding to > 80M 12’’ eq. wafers.Applications are also described in the report. The 2012 market drivers for thin wafers are 3D ICs,and also Power Devices and CIS BSI for ultra-thin wafers. Indeed, the BSI application is the big
  2. 2. driver for ultra thin wafers; this application is currently booming. 2011 was a big year for 300 mmwafer bonding tools, thanks to BSI. This application requires ultra thin layers (< 10µ) on 12’’.Forecasts by wafer thickness are analyzed in the report. In 2017, most of the 12’’ wafers will be200µm thick for logic application; also, most of the thinned wafers will be in the 10-99µ thicknessrange. This includes memory, as well as interposers and power device applications.CURRENTLY LOW IN VALUE, THE TEMPORARY BONDING EQUIPMENT MARKET WILLREACH US$250M BY 2017Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinnerand wafer diameter increases, thinning/handling procedures are required. This impliesdevelopment in wafer thinning, wafer dicing and wafer temporary bonding.Yole Développement’s report provides a temporary wafer bonding equipment forecast whichshows that 10% of the total thin wafer shipment will experience a temporary bonding step by 2017.So, while temporary bonding equipment is still a small market today, it is expected to grow as theneed for thin wafer handling grows. In fact, we estimate the market for temporary bonding tools tobe more than $250M by 2017. Currently, shipped bonder/debonders are for Power and 3D ICsapplications. However, we believe 3D ICs will become the predominant application for temporarybonders > 2015.Temporary bonding implies know-how in process and chemistry, and an understanding of the finalapplication requirements. Temporary bonding is a complex technology, requiring an interfacematerial (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporarybonding materials (wax, tape or glue) is temperature stability, the material must be strong enoughto withstand processing steps (metallization, etching, grinding). Another issue is the choice ofcarrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc.,and carrier lifetime should be at least tens of times, though this is not yet the case today.WHAT’S NEW COMPARED TO THE 2011 REPORT?Compared to the 2011 installment, this report now contains: Updated thin wafers forecast 2011-2017•By application•By thickness•By wafer size Updated players•New chapter on Power MOSFETs•Why thin wafers for power•Players•Roadmap New chapter on Photovoltaic•Why thin wafers for PV•Players•Roadmap New chapter on temporary bonding
  3. 3. •Players•Technologies•Applications•Challenges Equipment forecast 2011-2017•In units•In US$•By application Temporary chemistry forecast 2011-2017OBJECTIVES OF THE REPORT Provide an understanding of the thin wafers application:•Overview of thin wafers applications: MEMS, CMOS Image Sensors, Memory, Power Devices, RF Devices, LEDs, Interposers, Photovoltaics•Thin wafers roadmap Present market forecasts for thin wafers:•2011-2017 Market Forecast in units and US$ for thin wafers•Detailed forecasts by application, wafer size and thickness Analyze wafer thinning trends, with a focus on temporary bonding Market Forecasts for temporary bonding in US$ value and number of equipment:•By application•By wafer size Market Forecast for temporary bonding chemistry Overview of the different temporary bonding approaches, i.e.:•Without carrier:•TAIKO•DoubleCheck Semiconductors•With Carrier:•UV laser released•Electrostatic•Thermal release•Mechanical release•Chemical release•Temporary bonding trends•Thinning trends•Dicing trends•Description of the applications for temporary wafer bonding, including main characteristics and challengesCOMPANY INDEX1366 Technologies, 3M, AAC, ABB, Accretech, ADI, AGC, ALSI, Altera, AMAT, AMD, Amkor,Ampulse, ANJI, Aptina / Micron, ASE, AstroWatt, Avago, Brewer Science, Cabot, Canon, Corning,
  4. 4. Cree, Crystal Solar, Dalsa, Danfoss, Discera, Disco, Dongjin, DoubleCheck Semiconductors,Dupont, Dynatex, Ebara, EM Marin, Epistar, Epoxy Technologies, ERS, ESI, EVG, Fairchild,Fraunhofer IZM, Freescale, GCL Solar, Hamamatsu, Hitachi Chemical, Hynix, IBM, Imec, Infineon,Intel, International Rectifier, Invensense, Ipdia, LDK, Leti, LG Innotek, Lintec, Lumileds, MEMC,Micron, Misui Chemical, Mitsubishi Electric, Nichia, Nitronex, Nitta Corp., Nitto Denko, Okamoto,Omnivision, ON Semi, Osram, Panasonic, PlanOptik, Protec, Qualcomm, REC, Renesas,ReneSola, RFMD, Robert Bosch, Roockwood, S’Tile, Samsung, SanRex, Schott, Sensonor, SeoulSemiconductor, Shinko, Sigen, Silex, Skyworks, Solarforce, SPIL, STMicroelectronics,Strasbaugh, STATSChipPAC, Sumitomo Chemical, SUSS MicroTEC, Synova, Taiko, Tekcore,TEL, TMAT, TOK, Toyoda Gosei, Triquint, Twincreeks, VisEra, WLCSP, Xilinx, Xintec, Yushin.Get your copy of this report @ points covered in Table of Contents of this report includeTable of ContentsTable of contents 3Why this report 4What is new compared to 2011 report 6List of companies mentioned in the report 7Executive summary 8THIN WAFERS 222011-2017 thin wafer market forecasts 24Thinned wafers vs. TOT number of shipped wafers 26Thin wafers shipment in 300 mm eq. 272011-2017 thin wafer shipment forecast by application in units 28In US$ 302011-2017 thin wafer shipment forecast by wafer diameter in units 32In US$ 332011-2017 thin wafer shipment forecast by wafer thickness in units 34In US$ 352011 Thickness Breakdown 362017 Thickness Breakdown 37Description of applications 39TOP Thin wafers processors 40Thin wafers processors production ranking 41Thin wafers processors by application 42Thin wafer processing geographical breakdown 43Grinding players 44MEMS 48CMOS Image Sensors 60
  5. 5. Memory & Logic 70Power Devices 74RF Devices (GaAs) 91LEDs 98Advanced Packaging 104Photovoltaic 116THIN WAFERS HANDLING 141Temporary bonders/Carriers/Materials forecast 143Temporary bonded wafers forecast 144Temporary bonders forecast in $M/units 146Temporary bonders forecast by wafer size 147Temporary bonding materials forecast 148Est 2011 temporary bonding players market share 149Thin wafer handling: the different solutions 150Wafer handling with carrier: temporary bonding . 155The different temporary bonding techniques 170Thermal plastic release 171Mechanical release 174ZoneBOND 177YAG laser release 180Excimer laser release 183Chemical release 185Temporary bonding materials 193The “Magic” material 195Carriers 207Wafer handling with carrier: electrostatic carrier . 212Wafer handling without carrier 215Wafer handling with ring technology 220Wafer thinning 226Wafer dicing 238Final conclusions 264Contact: for more information.