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2010 May Fastech Semicon Marketing  Presentation
 

2010 May Fastech Semicon Marketing Presentation

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Fastech Synergy Ltd Company Presentation

Fastech Synergy Ltd Company Presentation

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  • Others note that since set-up costs in China ’ s electronics belt around Shanghai are already rising toward those of the Philippines, China ’ s advantage is less than most imagine; the Philippines scores further with its wealth of IT graduates, many speaking English. China is also a growing export market for the Philippines, in chips and other sectors, which helped counterbalance the lower US import demand for electronics goods in 2001, further offset by unusually strong domestic consumption, despite rising unemployment and high real and nominal interest rates. Growth in the service sector also helped.

2010 May Fastech Semicon Marketing  Presentation 2010 May Fastech Semicon Marketing Presentation Presentation Transcript

  • F ASTECH S YNERGY L TD Leading-edge Solutions for Niche Customers
    • 26 years in Semiconductor Manufacturing business with 900+ employees
    • Established in 1983 as Circuit Packaging Inc. Renamed as Fastech in 1989.
    • Acquired Tag Semiconductor Philippine operations in 1993
    • IPO and listing in the Singapore Stock Exchange in 1999.
    • Consolidated factory operations from 3 to 1 location in 2001
    • Expanded RF Microwave operations in 2004
    • Certified to TS16949:2002 and ISO9001:2000 in 2006
    • Established Precision Machining for RF/Microwave customer in January 2007
    • Expanded capacity by 25% on 3 major package in 2007
    • Introduced 5 new packages on Power packages in 2007
    • MACOM/Tyco test transfer of all Mixer products at Fastech.
    • Microsemi Scottsdale line transfer of all CBU products
    • CASCO automotive sensor products, production orders from Volvo, Audi and BMW Europe.
    • 2007 Sales US$ 14.2M / 2008 Sales US$11.6M / 2009 US$ 5M
    Quick Facts about FASTECH …
  • A recognized leader in outsource manufacturing & test for RF/Microwave components, systems and modules, and hybrid assembly products.
    • Maintain a long-term relationship of trust and confidence with our customer and supplier.
    • Achieve reasonable returns for our shareholders in a work environment where employees are respected, listened to, recognized, involved and motivated.
    Company Introduction Vision Vision Mission Mission
      • Total Area (Building 1 & 2) : 145,300 square feet
      • Addt'l. Available Area (Building 3) : 155,700 square feet
      • Total Land Area : 300,000 square feet
    Bldg 3 - Corporate Office Bldg 2 – RF and Microwave Modules Division Manufacturing Complex Ampere St. cor. West Road, Light Industry & Science Park I, Cabuyao, Laguna, Phils. Bldg 1 – Semiconductor Division
  • Management Team OFFICE OF THE CHIEF EXECUTIVE SATURNINO G. BELEN JR CEO / PRESIDENT BUSINESS UNIT BUSINESS SUPPORT [ SALES & MARKETING & CUSTOMER SERVICE] [ SEMICONDUCTORS ] [RF & MICROWAVE ] OFFICE OF THE PRESIDENT PRIMO MATEO CFO - COO BONG SADURAL Vice President 21 years ERWIN O. MANIBOG Executive Director 25 years ARLENE S. SAUDI Vice- President 15 years [ HRMD ] WALTER AGCAMBERT Vice President 22 years CORPORATE QA/REL RENE I. DELA CRUZ Executive Director 20 years ODESSA T./ SALLY L./ RIZA R. QA Supervisors [ SEMICON and RF MICROWAVE ]
  • Fastech Human Resources (Semiconductor / RF Microwave) As of June 2010 561+ hi ghly-skilled and English-speaking employees 8 Senior Management 9 Managers 9 Technical Supervisors 31 Engineers 44 Technicians 19 Administrative Staff 63 Non-Technical Staff 378 Operators/ Assemblers
  • Human Resources Focus
    • Engineering Scholarship
    • In-House Masters Program on Engineering courses
    • Continuing Education Program
    • Advanced Technical Training
    • Team Building Seminars
    • Technical Ladder for Technicians and Engineers
    • Cadetship Engineers Program
  • Operating Pillars
    • TQM – SEVEN ADVOCACY GROUPS
    • Customer Focus
    • TPM
    • ESD
    • IT
    • Employee Empowerment
    • Environmental/Health/Safety
    • 5S
    • PRODUCTIVITY
    • Direct Labor & staff productivity thru IPR(DL800+; IDL150+)
    • Integrated with Monthly Performance Appraisal(Individual/Team)
    • Results tied up to Incentive Programs
    • TECHNICAL COMPETENCY:
    • Establish Technical position ladder
    • Technical Staff membership (10)
    • Semi annual Key Technical Employee (KTE) summit/awards (40+papers)
  • Management Information System
      • Integrated – Finance, Distribution and Manufacturing Systems
      • 30+ segregated access terminals
    Enterprise Resource Program (JD Edwards) 12 Support Information Systems in:
      • HRIS, Training, Quality, Maintenance and Test Engineering
    System Infrastracture:
      • Secured access by 300+ users in 250 terminals in the Factory
      • T1 connection with back-up (Dial-up)
      • Redundant Hardwire system on 15 servers
  • Management Information System
  • Quality Milestones Major Customer Commendations Valpey Fisher Corporation Best Supplier 2008 Advanced Control Components Best Supplier 2008 RFS/Alcatel Best Supplier 2007 Semtech Corporation Best Quality 2008 Macom/Tyco Best Supplier 2007 Maxim/Dallas (power modules) Best Supplier 2007 Tyco / MACOM Best Supplier Award MACOM Microwave Group 2001/ 2003 Golden Shell Award Dept of Trade & Industry, Phils 1995/ 2000
  • Quality Milestones Certification/Award Certifying Body TS14969:2000 TUV Nord 2007 ISO 9001:2000 TUV NORD 2007 ISO/ TS16949 TUV NORD 2006 RoHs Compliant 2005 IPC-A-610 IPC / EPTAC 2005 IPC-J-STD IPC / EPTAC 2005 IBM Audit DALLAS/MAXIM 2005 Quality Systems Approval HERLEY-CTI 2006 Quality Systems Approval VALPEY FISHER 2006 Quality Systems Approval ALCATEL FERROCOM 2006 Quality Systems Approval TEMEX FRANCE 2004 Quality Systems Approval CHELTON UK 2004 QS9000 TUV 2003 Quality System Review (Level 2) MACOM /Tyco 2000 IBM Audit (RF / Microwave) modules 1999 Quality System Approval DALLAS/MAXIM 1998
  • Quality Milestones Certification/ Award 2010 Fujitsu Quality Laboratory Ltd Audit March 2010 Broadband Amplifiers products 2009 Nokia Siemens Audit (Broadband Wireless Group) February 2009 Sony Japan (Power IC Group) March 2009 NEC Audit (Microwave Group) June 2009 Emerson Audit (Semicon/IC Group) October 2009 2008 Miyoshi Electric/ Sony Japan Quality Systems Audit December 2008 Advanced Control Components - Quality Systems Approval October 2008 Semtech/Huawei China Quality Audit August 2008 Microsemi Quality Audit July 2008 Emerson Power/ Astec Quality Audit July 2008 Semtech / Canon Japan Quality Audit May 2008 2007 RFS/ Alcatel Ferrocom / Motorola Quality Audit November 2007 M/A COM Tyco/ NTT Japan Quality Audit October 2007 Semtech / Sharp Japan Quality Audit October 2007 Amplifier Solution Corp - Quality System Approval April 2007
  • Customer Milestones Semiconductor Group 96 97 98 99 00 01 02 03 04 05 06 07 08 09 MICROSEMI SEMTECH / FAGOR SMARTEC/ VITESSE / TIMEX CATALYST AME / HONEYWELL ATMEL / API / EMM Semiconductor Components TYCO ELECTRONICS RICHTEK ST MICROELECTRONICS ( Grenoble) MICROELECTRONICS ( Catania & Tours) BOURNS U.K. SEMELAB UK / CASCO CENTRAL SEMI / SUPERTEX CLARE / IXYS LITTELFUSE/ TECCOR AOS/ QSPEED / AMS FUJIMOTO INC / FUJI ELECTRIC INC VISHAY IES AUSTRALIA MICOSEMI – APT MICROSEMI – SCOTSDALE SEMEFAB SCOTLAND E2V HENDON TRANSFORM
  • Customer Milestones RF / Microwaves Group 96 97 98 99 00 01 02 03 04 05 06 07 08 09 RF / Microwave Components & Module Assembly MAXIM/ DALLAS M/A COM / TYCO (MA/ SJ) CHELTON U.K. TELEDYNE/ COUGAR HERLEY – CTI RLC ELECTRONICS MICRONETICS ALCATEL FERROCOM/ LUCENT VALPEY/ FISHER ADVANCED CONTROL COMPONENTS TEMEX CERAMICS TEMEX MICROSONICS HETRONIC MALTA FIRST SUMIDEN CIRCUITS RALTON ELECTRONICS CENTELLAX AMPLIFIER SOLUTIONS TRAK MICORWAVE TRIQUINT/ WJ RFS / ALCATEL SILICON CRYSTAL
  • Power Discretes SOT Micro Packages Copper Strap Packages Metal Can OPTOELECTRONICS / POWER Hybrid Power Packages Opto Sensor Clear Packages Semicondutor CORE COMPETENCE Core Competence Semiconductor
  • RF Isolators / Circulators RF Filters RF VCO/ OCXO/ Oscillators RF/ Microwave CORE COMPETENCE RF Mixers / Dividers VTDRO/PDROVSS LNA Amplifiers Attenuators Power Limiters Core Competence RF/ Microwave
  • SEMICON MANUFACTURING EXPERTISE
    • Power Discrete
    • 1. TO-220 3L/5L Au/Al
    • 2. TO-263 3L/5L Au/Al
    • 3. TO-252 3L/5L Au/Al
    • 4. TO-251 3L/5L Au/Al
    • 5. TO-247 3L Al
    • 6. TO-264 coming 2011 Al
    • 7. TO-268 coming 2011 Al
    • 8. TO-3P coming 2012 Al
    • 9. SOT-223 Au
    • 10. SOT-89 Au
    • 11. SOT-23 3/5/6L Au
    • 12. SO-8
    • 13. SO-14/16
    • 14. SMA/ SMB/ SMC
    • 15. Axial
    II. Opto Sensors/ITS 1. SO-8 Clear Package 2. SO-16 Black Transmissive 3. Custom Automotive Package 4. Metal Cans TO-18/TO-72/TO-39 III. Thermally Enhanced Package 1. TO-220 Dual Die w/ DBC 2. TO-247 Dual Die w/ DBC 3. SO-8 EHS Clip coming 2011 4. DPAK Clip coming 2011
  • POWER Packages TO92 2L/3L 3L TO252 (DPAK) 5L TO252 (DPAK) 3L TO252 (IPAK) 3L TO263 (DDPAK) 5L TO263 (DDPAK) 3L TO220 Standard 5L TO220 Standard 3L TO220 B/C NIA/ISOA TO202 V1 TO202 V3 TO3 MICRO Packages SOT23 3L SOT23 5L SOT89 SOT223 Annual Capacity of 600 Million units TSOT25 5L SOT23 6L
  • NEW PACKAGE CAPABILITIES TO-247 Standard / Max PLAD (Plastic Large Area Device) AXIAL SMB SMC
  • Integrated Circuits & Optoelectronics 5L SIP 8L SIP 8L SOIC 16L SOIC CUSTOM CLEAR & DIP PACKAGES
  • Wafer Plus Services WAFER SAW WAFER PROBE WAFER BACKGRIND WAFER PLATE WAFER SORT
  • Handler and Prober Package Model Configuration / Capability PACKAGING DPAK MCT3608 Ambient or Dual – Temp; Single site Bulk, tube IPAK MCT3608 Ambient or Dual -Temp; Single site Bulk, tube T0263 3Ld/5Ld MCT3608 Ambient ; Single site Bulk, tube T0220 Tesec 8512PH Ambient ; 4 test site Bulk, tube Tesec 8307MK Ambient ; Dual function (Test/Mark) Bulk, tube T0202 Tesec 8017PH Ambient ; Single test Bulk, tube
    • Gravity:
    Package Model Configuration / Capability PACKAGING T092 TSM THD111 Ambient ; Single test Bulk Tesec 906 Ambient ; Single test Bulk Tesec 786 Ambient ; Single test Bulk SOT89 Shinja JT100 Ambient ; Single test Bulk SOT23 3Ld Tesec 9718HT Ambient ; In-line (Test/Mark/Reel) Bulk, TNR Ismeca NT216 Ambient ; In-line (Test/Mark/Reel) Bulk, TNR SOT23 5Ld/6Ld Tesec 9718HT Ambient ; In-line (Test/Mark/Reel) Bulk, TNR Ismeca NT216 Ambient ; In-line (Test/Mark/Reel) Bulk, TNR SOT223 Tesec 9718HT Ambient ; In-line (Test/Mark/Reel) Bulk, tube, TNR
    • Bowl Feed:
    • Wafer Probing
    • Assembly / Packaging
    • Custom Package Development
    • Final Test
    • Product Engineering
    • New Product Development
    • Failure Analysis
    • Product Reliability
    • Component/ Logistics Outsourcing
    • Drop Shipment/ Warehousing
    Packaging & Test Turnkey Services
  • TEST/ADDED VALUE SERVICES
        • Test Program Generation and Hardware Development
        • Test Program Debugging and Optimization
        • Test Program Platform Conversion
        • New Device Correlation and Qualification
        • In depth Product Engineering
        • 24-Hour Failure Analysis
        • Test Yield Improvements
        • FT Data Logs and Statistical Analysis
        • Correlation to Wafer Probe and Fab Yields
        • Primary Test Platforms TMT, LTX and TESEC
        • Delta Vf, UIL/UIS and Trr tests for MOSFET devices
  • Test Equipment
  • Package Model Configuration / Capability PACKAGING T0202 Tesec 9512PH Ambient ; In-line (Test/Mark/Test) Bulk, tube TO220 Tesec 9512PH Ambient ; In-line (Test/Mark/Test) Bulk, tube Three Test site TO247 Tesec 9512PH Ambient ; In line (Test/Mark/Test) Bulk, tube
    • Pick & Place:
    Package Model Configuration / Capability 4-6 inch EG2001X Ambient ; Single test
    • Prober:
    Package Model Configuration / Capability PACKAGING DPAK STI TRI8AS3 Mark & lead vision inspection, taping TNR SOT89 Shinja ST400 Taping TNR TO263 3Ld/5Ld STI TRI8AS3 Mark & Lead vision inspection, taping TNR Shinja ST300 Mark & Lead vision inspection, taping TNR TO92 Sillner Taping Ammopack (Reverse/standard) TNR
    • Tape & Reel:
  • PACKAGE RELIABILIY CAPABILITY Test Integrity for Die and Wire Bond
    • Intermittent Operating Life (IOL)
    • Solder Heat Test (Die Crack Test)
    • High Temp. Storage Life (HTSL)
    • Resistance to Soldering Heat (RSH)
    • Temp. Cycle Test (TCT)
    • IR Reflow
    • Pressure Cooker Test (PCT)
    • Pre conditioning
      • Humidity Chamber (Q2 2004 Avail.)
    Wire Bond Die Bond
    • Lead Integrity Test
      • Lead Fatigue Test
  • Package Analysis Capability
  • VCXO, Clock New Products VCXO Low Noise Amplifier Radio Remote Control Transmitter for Overhead Crane Tunnel Module Detector SP3T RF Switch SP2T RF Switch
  • ON-GOING QUALS Circulator - 6GHz Broadband Amplifier Module Broadband Digital Synthesizer Down Converter Jitter Attenuator Crystal Oscillator
    • To enable our customers/strategic partners to achieve a sustainable advantage in terms of:
      • Quality
      • Cost of Ownership
      • Delivery (time to market/time to volume)
      • Process technology/engineering
      • Assurance of supply (capacity planning)
      • Environmental Compliance
      • Security
    Commitment to Customers
  • Line Transfer Success Story
    • 1. 2008 CENTELLAX INC
    • - Broadband Amplifier
    • 2008 TRIQUINT / WJ
    • - High Linear Amplifier
    • 3. 2008 RFS / ALCATEL
    • - Isolators
    • 4. 2007 MICROSEMI CORPORATION
    • - Plad / SMB/SMC / Axial / Dicing
    • 5. 2007 AMPLIFIER SOLUTION CORPORATION
    • - LNA Amplifiers
    • 6. 2006 HERLEY CTI
    • - VSS Oscillator Modules, VTDRO
    • 7. 2006 ADVANCED CONTROL COMPONENTS
    • - Down Converter, RF Driver Amplifier
  • 8. 2005 CASCO / ITALY - Optoelectronics / Sun sensors 9. 2005 VALPEY FISHER - RF Oscillator Modules 10. 2005 ALCATEL / LUCENT FERROCOM - Isolators / Circulators 11. 2004 TEMEX / CHELTON - VCO-Oscillators / Isolators / Circulators 12. 1999 DALLAS / MAXIM (second source 2007) - PCB Modules 13. 1997 ST MICOELECTRONICS - TO-220 B/C / TO220 Al / TO202 / TOP3P (ended 2005) 14. 1995 MACOM / TYCO - RF Components
  • Thank you & Mabuhay “ If we don’t have it, let’s talk. “