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ALPHA WS-819 Solder Paste

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Water soluble solder pastes are commonly used for high reliability medical, …

Water soluble solder pastes are commonly used for high reliability medical,
military and telecom infrastructure applications. Until now, high reliability has
had a price-namely poor resistance to variations in temperature and humidity
in the print process, and poor resistance to BGA voiding.

Published in Technology
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  • 1. the product:A world classlead free, highreliability watersoluble paste ®offering best in ALPHAclass printing,resistance to BGAvoids and WS-819cleanability. Solder Paste product guide The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 1
  • 2. WS-819 solder pasteA world classlead free, high Welcome to thereliability water ALPHA® WS-819 Product Guidesoluble paste CONTENTSoffering best inclass printing, 1. Introduction 3resistance to BGA 2. Performance Summary 4voids andcleanability. 3. Print Performance 5-9 4. Reflow Performance 10 - 19 5. Post Reflow Cleaning 20 - 22 6 . Shelf Life 23 7. Summary 24 - 26 8. Technical Bulletin 27 - 30 9. MSDS 31 - 36 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 2
  • 3. WS-819 solder paste Introduction Introducing ALPHA® WS-819, the state of the art in Water Soluble, Lead Free Solder Paste. Water soluble solder pastes are commonly used for high reliability medical, military and telecom infrastructure applications. Until now, high reliability has had a price-namely poor resistance to variations in temperature and humidity in the print process, and poor resistance to BGA voiding. WS-819 was developed to offer the widest possible print process window, with consistent high print deposit volumes, IPC Class III resistance to voiding, and ease of cleanability in a ORH0 class solder paste. As with all Alpha brand products, WS-819 comes with complete process and product support whenever and however you need us. It’s the kind of support you would expect from a company that’s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years. The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 3
  • 4. WS-819 solder paste Performance Summary SMT Process Step Performance Indicator WS-819 Performance Capability Excellent print definition and consistant volumetric performance Fine Feature Print to 0.30mm (12 mil) circles and 0.4mm (16 mil) pitch rectangular Performance QFP pads. Stencil Life 8 hours at 35-65% Relative Humidity Capable of printing in temperatures from 20°C to ≥ 28°C at Humidity/Temperature Window Relative Humidities of 50% +-15% (35% to 65%) Print Process Window 3 to 10 prints per wipe, depending on smallest feature printed, Stencil Cleaning Frequency and use of apeture reduction and stencil thickness 25mm/second to 100mm/second (1 inch/second to 4 Print Speed Range inches/second) down to 0.30mm (12 mil) circles and .4mm (16 mil) pitch QFP pads. Optimal results found at 100mm/second. Solder Spread 88.6% (Average) per JIS-Z-3197:1999 8.3.1.1 Exceeds requirements of IPC 7095 Class lll using soak and Resistance to Voids ramp reflow profiles on OSP, Immersion Tin, Immersion Silver and ENIG finishes. Resistance to Hot and Cold Exceeds the requirements of IPC J-STD-005. No slump at Reflow Yield Slump 0.2mm gap per JIS-Z-3284. Straight Ramp, or <60 second soak profile in air. Nitrogen Reflow Process Window recommended for longer (>60 second) soak profiles. Meets IPC requirements over range of cleaning temperatures Residue Cleaning and water pressures, using DI water without additives. Meets/Exceeds IPC Bellcore and HP EL-EN861-00 Cleanability Requirements Post Reflow J-STD-004 Classification ORH0 Halide Content Halide Free The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 4
  • 5. WS-819 solder paste8 Hour Stencil Life at High Humidity (66% RH @ 27°C) PWS0608A #70329576 - 8hr Stencil Life Volume Chart PWS0608A #70329576 - 8hr Stencil Life Volume Chart BGA56-12 (12 mil Circles) BGA36 (15 mil Circles) 600 Theoretical Volume (565 cubic mils) Condition 900 Theoretical Volume (884 cubic mils) Condition 80F/65-67% RH 80F/65-67% RH 800 500 700 400 600 Volume Volume 500 55% Trans Effi ciency 300 50% Trans Effi ciency 400 200 300 200 100 100 0 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Condition 80F/65-67% RH Condition 80F/65-67% RH PWS0608A #70329576 - 8hr Stencil Life Volume Chart PWS0608A #70329576 - 8hr Stencil Life Volume Chart QFP120-1 (16 mil pitch QFP deposits, 63x10x5 mils) BGA256 (20 mil Circles) 3500 Condition 1600 Theoretical Volume (1571 cubic mils) Condition Theoretical Volume (3150 cubic mils) 80F/65-67% RH 80F/65-67% RH 3000 1400 2500 1200 70% Trans Effi ciency 1000 Volume Volume 2000 60% Trans Effi cie 800 1500 600 1000 400 500 200 0 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Condition 80F/65-67% RH Condition 80F/65-67% RH PWS-0608A was the pre-commercial laboratory name for WS-819 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 5
  • 6. WS-819 solder paste8 Hour Stencil Life at Low Humidity (23% RH @ 29°C) PWS0608A #70329576 - 8hr Stencil Life Volume Chart PWS0608A #70329576 - 8hr Stencil Life Volume Chart BGA56-12 (12 mil Circles) BGA36 (15 mil Circles) 600 Theoretical Volume (565 cubic mils) Condition 900 Theoretical Volume (884 cubic mils) Condition 81-94F/23-25% RH 81-94F/23-25% RH 800 500 700 400 600 Volume Volume 500 55% Trans Effi ciency 300 50% Trans Effi ciency 400 200 300 200 100 100 0 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Condition 81-94F/23-25% RH Condition 81-94F/23-25% RH PWS0608A #70329576 - 8hr Stencil Life Volume Chart PWS0608A #70329576 - 8hr Stencil Life Volume Chart QFP120-2 (16 mil pitch QFP deposits, 56.7x9x5 mils) BGA256 (20 mil Circles) Theoretical Volume (2552 cubic mils) Condition 1800 Condition 2500 81-94F/23-25% RH 81-94F/23-25% RH 1600 Theoretical Volume (1571 cubic mils) 2000 1400 1200 70% Trans Effi ciency Volume Volume 60% Trans Effi ci ency 1500 1000 800 1000 600 400 500 200 0 0 Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Time T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr Condition 81-94F/23-25% RH Condition 81-94F/23-25% RH PWS-0608A was the pre-commercial laboratory name for WS-819 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 6
  • 7. WS-819 solder paste Fine Feature Print Performance Print Process Window 1 inch (25mm) – 4 inches (100 mm)/second1 PWS0608A #70329576 - Volume Repeatability Chart BGA56-12 (12 mil Circles) 600 Theoretical Volume (565 cubic mils) Print Speed 1 inch/sec. 2 inches/sec. 500 4 inches/sec. 400 Volume 300 50% Trans Effi ciency 200 100 0 Board 1 2 3 4 1 2 3 4 1 2 3 4 Print Speed 1 inch/sec. 2 inches/sec. 4 inches/sec. 1) 5 mil laser cut stencil PWS-0608A was the pre-commercial laboratory name for WS-819 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 7
  • 8. WS-819 solder paste Print Process Window IPC Tack Test IPC TM-650 2.4.44 Tack Strength (g / sq mm) Time 25% RH 50% RH 75% RH Initial 2.8 2.8 2.8 16 hr 3.3 3.0 2.3 24 hr 3.4 3.1 3.0 ∆ Tack < 1 unit over 16 hours at all RH The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 8
  • 9. WS-819 solder paste Print Process Window Wipe Frequency– Number of Print Strokes between Stencil Cleaning Step Paste: ALPHA PWSO608A Lot Number: 70329576 Solder Paste - Wipe Freqency. Print Parameters: 1 in/s, 1.25 lbs/inch, 0.02 in/s Number of Bridges Number of Bridges Board Set 1 Board Set 2 QFP Device QFP Device Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) 1 0 0 0 0 1 0 0 0 0 2 0 0 0 0 2 0 0 0 0 3 0 0 0 0 3 0 0 0 0 4 1 0 2 0 4 0 0 0 0 5 1 0 0 0 5 0 0 0 0 6 0 0 0 0 6 >10 0 0 0 7 3 0 0 0 7 0 0 0 0 8 0 0 0 0 8 0 0 0 0 9 2 0 0 0 9 0 0 0 0 10 0 0 0 0 10 0 0 0 0 Inside Printer Inside Printer Temperature: 80*F Temperature: 80 F Relative Humidity: 40 % RH Relative Humidity: 40 % RH PWS-0608A was the pre-commercial laboratory name for WS-819 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 9
  • 10. WS-819 solder paste Reflow Yield Yield Reflow Reflow Process Guidelines Parameter Guideline Additional Information Atmosphere Air (Straight Ramp or < 60 Mass production verification Second Soak) both in air and N2. N2 for soak profiles >60 seconds up to 180 seconds SnAgCu alloy melting ranges. Lower temperature=solidus; SAC305: 217 – 220 ℃ Use for reflow above higher temperature = liquidus •SAC405: 217 – 225 ℃ liquidus setting Profile General Guideline (Typical for SAC305) Setting Zone Optimal Dwell Period Extended window 40oC to 220oC 105 to 180 seconds <210 seconds 130oC to 220oC 90- 100 seconds <135 seconds 170oC to 220oC 60 seconds <90 seconds TAL (220oC) 45 - 90 seconds 30-90 seconds. Peak temp. < 240oC for standard OSP <250°C For Entek HT, finish Immersion Silver, Immersion Tin or ENIG finishes The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 10
  • 11. WS-819 solder paste Reflow Yield Ramp Profile 1: 0.7C/s 235C Peak 60s TAL The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 11
  • 12. WS-819 solder paste Reflow Yield Ramp Profile 2: 1.5C/s 240C Peak 60s TAL The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 12
  • 13. WS-819 solder paste Soak Reflow Profile: Reflow Yield 175C/60s Soak 240C Peak 60s TAL (Nitrogen Required for Longer Soak Profiles) The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 13
  • 14. WS-819 solder paste Reflow Yield Spread Test Method JIS-Z-3197:1999 8.3.1.1 Polish the surface of phosphor deoxidized copper plate (50×50×0.5mm) with #500 polishing paper applying drops of alcohol. Wash the surface with alcohol and cool in room temperature. Subject to oxidizing treatment in a dryer set at 150℃ for 1 hour. Put approx. 0.3g of solder paste on the center of the copper plate and weigh with high accuracy. Place the test panel onto the surface of melted solder in a solder bath set at 250℃. Keep heating for 30sec. after the solder melts. Remove the flux residues from the test panels with solvent. Measure the height of solder with a micrometer and calculate the spreading rate from the following formula. S=[(D-H)/D] ×100 . S: Spreading Rate(%) H: Height of Spreading Solder (mm) D: Diameter of Solder assuming it as a sphere (mm) D = 1.24 V 1/3 V: Mass / Specific Gravity of Solder 3.Apparatus Solder Bath POT-200C The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 14
  • 15. WS-819 solder paste Reflow YieldResult: 88.6% Spread Density of Solder Alloy [g/cm] 7.4 A. Weight of Paste Weight of Solder Height of Solder Spreading Rate AverageSample [g] [g] [mm] [%] [%] #1 0.3206 0.2853 0.384 90.8% #2 0.3174 0.2825 0.441 89.4% #3 0.3751 0.3338 0.494 88.8% 88.6% #4 0.3052 0.2716 0.639 84.5% #5 0.3332 0.2965 0.442 89.6% #1 #2 #3 #4 #5 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 15
  • 16. WS-819 solder paste Reflow Yield Reflow Yield: Application Note Definition of Voiding Performance Solder Outline Void Outlines Location of Void Class I Class II Class III Void in Solder 60% of diameter 42% of diameter 30% of diameter (Solder Sphere) = 36% of Area = 20.25% of Area = 9% of Area 0.1dVoid at interface of 50% of diameter 25% of diameter 20% of diameter Solder (Sphere) = 25% of Area = 12.25% of Area = 4% of Area 0.25d and Substrate d Example: Total Void Diameter 0.10d +0.25d = 0.35d IPC Criteria for Voids in BGAs, IPC 7095 7.4.1.6 The IPC criteria provide three classes of acceptance for both the solder sphere and the sphere-pad interface. Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint. The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 16
  • 17. WS-819 solder paste Reflow Yield Voiding Performance Void Size Distribution BGA256 100.00% 90.00% 80.00% WS-819 89.5 M17 Cerf HS 160/60 soak 240Cp 70.00% WS-819 89.5 M17 Cerf St.Ramp 0.7C_S 235Cp. % of Joints 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20% % of Joint areaWS-819 Meets Criteria for Class lll Voiding Using Soak or Ramp ProfilePer IPC 7095 7.4.1.6 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 17
  • 18. WS-819 solder paste Reflow Yield Solder Balling Resistance IPC TM-650 Method 2.4.43 Initial After 4 Hr. @ 25°C, 50% RH Both “Preferred” per IPC Standard The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 18
  • 19. WS-819 solder paste Reflow Yield Slump Resistance IPC TM-650 2.4.35 Cold Slump Hot Slump Oven 150C / 25C / 50% / 75% RH 10mins 00.63 x Pad Size 0.33 x 2.03mm 0.63 x 2.03mm 0.33 x 2.03mm 2.03mm Largest Gap No Bridges 0.1 0.41 0.25 Bridged IPC max gap 0.48 0.2 0.56 0.25bridge allowed Pass Pass Pass Pass The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 19
  • 20. WS-819 solder paste Post Reflow Cleaning Cleanability Study Boards were built using all five pastes and subsequently cleaned using two water tem peratures (120 and 150F) and two conveyor speed settings (2 and 5 ft/min) in order to assess the relative cleanability of the pastes. The pre-wash and wash water pressure were both set at 90 psi, while the rinse water pressure was set at approximately 70 psi. IPC J-STD-001 states that the contamination limit for assemblies tested using the dynamic method of detecting ionic surface contamination (method used with the Ionograph) is 10 µg/in2 (1.56 µg/cm2) sodium chloride equivalent ionic or ionizable flux residue. WS-819 (known as PWS-0608A during the product development process) showed Ionograph contamination levels of results of 1.10 to 1.58 µg/in2 (0.172 to 0.256 µg/cm2 ), after two reflows and a 48 hour delay before cleaning, exceeding the IPC requirement under the pressure and temperature conditions described above Paste 120F/2.5 ft/min. 120F/5 ft/min. 150F/2.5 ft/min. 150F/5 ft/min. 1.5799 µg/in2 1.1996 µg/in2 1.5106 µg/in2 1.1015 µg/in2 PWS0608A •Pass Pass Pass Pass The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 20
  • 21. WS-819 solder paste Post Reflow Cleaning Post Cleaning Cosmetics Paste Aged 21 Days in Sealed Container Prior to Reflow QFP208 High soak profile 160°C, 240°C peak OSP The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 21
  • 22. WS-819 solder paste Post Reflow Cleaning Electrical Reliability IPC SIR 85C / 85% RH, -48 V Bias SIR (Ω) Reflow & Cleaning 1 day 4 day 7 day Ramp 0.7 ° C/sec, 237 ° C peak Clean 130 ° C, 8 min DI H20 - Req: SIR > 1 x 108 Ω after Within 2 hours of reflow 9 10 9 2.4 x 10 1.0 x 10 9.9 x 10 4 & 7 days (PASS) Ramp 0.7 ° C/sec, 237 ° C peak Clean 130 ° C, 8 min DI H20 - 9 9 9 Delayed 48 hours after reflow 1.4 x 10 2.4 x 10 2.5 x 10 Ionic Cleanliness Reflow & Cleaning Ionic Contamination (µg/sq in) Ramp 0.7 ° C/sec, 237 ° C peak Clean 130 ° C, 8 min DI H20 - Within 2 hours of reflow 1.36 Req: Ionic contamination < Ramp 0.7 ° C/sec, 237 ° C peak 10 µg / sq in (PASS) Clean 130 ° C, 8 min DI H20 - Delayed 48 hours after reflow 2.43 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 22
  • 23. WS-819 solder paste Shelf Life 3 Weeks Room Temperature Stability (25°C; 77°F) in Unopened Container 2500 200010 RPM Malcolm Viscosity (KCPS) 1500 WS-819 Viscosity Upper Limit Low er Limit 1000 500 6 Month Shelf Life When Stored in Sealed Jar at 1° to 10 ° C (34° to 50° F) 0 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Days After Manufacture The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 23
  • 24. WS-819 solder paste Summary Delivers excellent print volume and consistency • Prints .4mm (16 mil) pitch QFP’s , .3mm (12 mil) circles with Type 3 Powder • Consistent Print Volume Repeatability at both Low (<35%) and High (65%) Relative Humidity • 8 Hour Stencil Life at Low and High Humidity • Excellent post print tack life • Wide print speed process window (25mm/sec to 100mm/sec) High Post Reflow Yields • IPC Class III Voiding Performance (Using Soak Reflow Profile) • Resistance to cold and hot slump • Easily Cleaned with Water, after 2 lead free reflow cycles and 48 hour delay Electrical Reliability • IPC SIR • Bellcore SIR • Bellcore Electromigration • HP EL-EN861-00 Electromigration The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 24
  • 25. WS-819 solder paste SummaryLeading ProductsNo Clean, SnPb • ALPHA OM-6106 •ALPHA OM-5100No Clean, Lead-free • ALPHA OM-338 T •ALPHA OM-338 PT • ALPHA OM-350Water Soluble, SnPb • ALPHA WS-809Water Soluble, Lead-free • ALPHA WS-819 The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 25
  • 26. WS-819 solder paste Summary The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 26
  • 27. SM919ALPHA® WS-819 Water Soluble Lead-Free Solder PasteDESCRIPTIONALPHA® WS-819 is the newest Alpha® brand lead free, halide free solder paste offering the ideal combinationof printability under varying environmental conditions, 8 hour stencil life, resistance to BGA voids, high spreadcombined with cleanability with water based cleaning systems.FEATURES & BENEFITS• Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features• 8 hour stencil life at 35% to 65% Relative humidity• High spread/wetting lead free paste compatible with lead free alloys and surface finishes• High Reflow Yield with IPC Class III Voiding Performance when used to solder BGA components• Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP.• Cleanable with water based cleaning systemsPHYSICAL PROPERTIES• Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu), SAC405 (95.5%Sn/4.0%Ag/0.5%Cu)• Application : Stencil printing (89.5% Metal Loading, M-17 Viscosity) Dispense application (85% Metal Loading, Type 4 Powder, M9 Viscosity)• Powder Size: Type 3 (25µ-45µ)• RoHS Status: Completely free of Hazardous Materials per RoHS Directive 2002/95/ECAPPLICATIONSAlpha® WS-819 was formulated to meet the requirements of water soluble solder lead free applications. Alpha®WS-819 was developed to offer best in class resistance to heat and humidity variations in the printing process,while offering exceptional post reflow cleanability and low BGA voiding.This paste is designed to enable users of Alpha® WS-609; WS-709 and WS-809 and other leading water solublepaste brands to comply with RoHS and customer based demand for lead free materials.SAFETYWhile the ALPHA® WS-819 flux system is not considered toxic, its use in typical reflow will generate a smallamount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area.Consult the MSDS for additional safety information.SHIPPING AND STORAGEALPHA® WS-819 is shipped in thermally controlled boxes and should be stored refrigerated upon receipt at 340 -450F (10 - 70C). ALPHA® WS-819 should be permitted to reach room temperature before opening the packageprior to use.The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding theaccuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07 14 Tuas Avenue 10, Singapore 639138, 65-68611977, www.alphametals.com
  • 28. ALPHA® WS-819 TECHNICAL DATAPhysical PropertiesItems ALPHA® WS-819 SAC 305/405 Test Method 89.5-3-M17 (stencil printing)Appearance (flux residues after reflowed) Light yellowish color (before water washed) CEAMG PUT 001.05Metal content (%) 89.4% +- 0.2% CEAMG STM 0355Viscosity (Poise, Malcom spiral viscometer M17 for stencil printing CEAMG STM 0541@10rpm) M9 for dispensingStencil life (50%+- 15%RH, 25°C) >8 hours CEAMG PUT 001.01Printability Suitable for fine pitch printing applications (Down CEAMG PUT 001.01 to 16 mil (0.4mm) pitch QFP components, 12 mil (0.3mm) BGA circles @) up to 100 mm/sec squeegee speed, using 5 mil (125µ) thick laser cut stencilResponse to pause 0-1 Knead Stroke Required CEAMG PUT 001.08Tack Initial 2.0 g/mm²; 1.8 g/mm² after 4 hours at 25°C IPC TM-650 2.4.44 and 50% R.H.Random Solder Balls Preferred (Both Initial and after 4 hours at 25°C IPC TM-650 2.4.43 and 50% R.H.Slump Resistance Pass IPC TM-650 2.4.35Chemical PropertiesItems ALPHA® WS-819 Flux SystemHalide content (IPC J-Std-004) ORH0Corrosivity (IPC J-Std-004) Not applicable for water soluble solder paste ALPHA® WS-819 PROCESSING GUIDELINESSTORAGE-HANDLING PRINTING / DISPENSING REFLOW CLEANING• Refrigerate to guarantee stability @ STENCIL: Recommend ALPHA CUT ATMOSPHERE: • ALPHA WS-819 is designed 34-45°F (1-7°C) Laser Cut Stencil @ 0.005 inch (5 • Clean-dry air to be water rinsed in washing mil, 127µ) thick for 0.012 inch (.30 If soak temp ≥ 160°C) and soak operations. with minimal• Warm-up of 500g jar to room foaming in recirculating mml) pitch QFPs time > 45-60 seconds Nitrogen temperature (should be ~ 6 hours). systems. recommended for longer soak Set up printer with room SQUEEGEE: Metal (Recommended) profiles (60 to 180 seconds). temperature paste. Check paste • The flux residues from temperature with a thermometer. • ALPHA WS-819 are PROFILE (PRINTING): completely water soluble.• Do not remove worked paste from Print Speed: 2.0 -4.0 in./sec (50-100 • See profiles evaluated in This allows for more flexible stencil and mix with unused paste mm/sec.) 4.0 in/sec. optimal product development below washing conditions which can in jar. This will alter rheology of o be board design specific. unused paste. SQUEEGEE: Pressure: 1.5 to 2.0 • Slow ramp from 130 C to o lbs./ linear in. (0357 Kg/cm) 180 C for 90~120 seconds o • If lower/no foaming is desired• Do not shake or mix paste using • Ramp @ 0.5~2 C/sec to peak o o in cleaning equipment, Alpha automatic paste shaking equipment Stencil Release Speed: .02 in/sec temperature 230 C - 250 C P-2000 defoamer may be prior to opening jar. The plunger (0.5 mm/second) TAL for 40~80 seconds. used. insert used may submerge into • Ramp down to R.T. @ o paste and produce difficulties with Compatible with DEK Pro-Flow 1~3 C/sec. plunger removal. Enclosed print head. Report available upon request.The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding theaccuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07
  • 29. Reflow Profiles Tested, using Clean, Dry Air CERF Straight Ramp 0.7C/s 235C Peak 60s TALCERF Straight Ramp 1.5C/s 240C Peak 60s TALThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding theaccuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07
  • 30. CERF 60s Soak @ 175°C/ 240C Peak 60s TALNote- profiles using a soak time > 60 seconds may require nitrogen for satisfactory results Use of air for long soakprofiles have resulted in dull, grainy joints, and possible de-wetting of solder joints.The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding theaccuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07
  • 31. Page 1 of 6Revised 5/21/07 MATERIAL SAFETYReplacesPrinted 4/23/07 5/21/07 DATA SHEETMSDS ID: AA 00151090 1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT NAME: ALPHA WS-819 SOLDER PASTE SAC305 & SAC405 MANUFACTURERS NAME: ALPHA METALS, INC ADDRESS: 600 ROUTE 440 JERSEY CITY, NJ 07304 TRANSPORT EMERGENCY #: CHEMTREC: 1-800-424-9300 BUSINESS PHONE: 1-201-434-6778 2. INGREDIENT AND EXPOSURE LIMIT INFORMATION CHEMICAL NAME CAS # % W/W OSHA PEL - TWA TIN 7440-31-5 80 - 90 2.0 mg/m3 SILVER 7440-22-4 1 - 5 0.01 mg/m3 COPPER 7440-50-8 0.2 - 1 0.1 mg/m3 (fume) Ethoxylated-N-Tallow 61790-85-0 1 - 3 NE Alkyltrimethylenediamine FORAL AX 65997-06-0 1 - 3 ** Ethoxylated octylphenol 9002-93-1 1 - 5 NE **SENSITIZER 3. HAZARDS IDENTIFICATION EMERGENCY OVERVIEW: MODERATE EYE IRRITANT. WILL NOT BURN TOXIC BY INHALATION. MODERATE GASTROINTESTINAL TRACT IRRITANT. MODERATE RESPIRATORY TRACT IRRITANT. CAUSES SKIN IRRITATION HMIS RATING SYSTEM: Health: 1 ; Flammability: 0 ; Reactivity: 0 ; Protection: C NFPA RATING SYSTEM: Health: 2 ; Flammability: 0 ; Reactivity: 0 ROUTES OF ENTRY: INHALATION; INGESTION; SKIN CONTACT; EYE CONTACT; ABSORPTION; TARGET ORGANS: BLOOD; DIGESTIVE TRACT; KIDNEYS; NERVOUS SYSTEM; EYES; SKIN. MEDICAL CONDITIONS AGGRAVATED: DIGESTIVE TRACT DISEASE; KIDNEY DISEASE EYE DISEASE. SKIN DISEASE INCLUDING ECZEMA AND SENSITIZATION. IMMEDIATE (ACUTE) SYMPTOMS OVER-EXPOSURE BY ROUTE OF EXPOSURE: INHALATION: CAN CAUSE MODERATE RESPIRATORY IRRITATION, DIZZINESS, WEAKNESS, FATIGUE, NAUSEA AND HEADACHE. MAY CAUSE AN
  • 32. Page 2 of 6Revised 5/21/07 MATERIAL SAFETYReplacesPrinted 4/23/07 5/21/07 DATA SHEETMSDS ID: AA 00151090 3. HAZARDS IDENTIFICATION (Cont.) ALLERGIC REACTION. MAY CAUSE RESPIRATORY TRACT SENSITIZATION, CHARACTERIZED BY ASTHMA-LIKE SYMPTOMS. EYES: CAN CAUSE MODERATE IRRITATION, TEARING AND REDDENING, BUT NOT LIKELY TO PERMANENTLY INJURE EYE TISSUE. SKIN CONTACT: CAN CAUSE SLIGHT IRRITATION. INGESTION: IRRITATING TO MOUTH, THROAT, AND STOMACH. CAN CAUSE ABDOMINAL DISCOMFORT, NAUSEA, VOMITING AND DIARRHEA. LONG TERM (CHRONIC) HEALTH EFFECTS: CARCINOGENICITY: NONE OF THE SUBSTANCES HAVE BEEN SHOWN TO CAUSE CANCER IN LONG TERM ANIMAL STUDIES. NOT A CARCINOGEN ACCORDING TO NTP, IARC, OR OSHA. REPRODUCTION: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTS PRESENT AT GREATER THAN 0.1% MAY CAUSE BIRTH DEFECTS. MUTAGENICITY: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTS PRESENT AT GREATER THAN 0.1% IS MUTAGENIC OR GENOTOXIC. 4. FIRST AID MEASURES SKIN EXPOSURE: WASH WITH SOAP AND WATER. REMOVE CONTAMINATED CLOTHING AND LAUNDER. GET MEDICAL ATTENTION IF IRRITATION DEVELOPS OR PERSISTS. EYE EXPOSURE: FLUSH EYES WITH PLENTY OF WATER FOR AT LEAST 20 MINUTES RETRACTING EYELIDS OFTEN. TILT THE HEAD TO PREVENT CHEMICAL FROM TRANSFERRING TO THE UNCONTAMINATED EYE. GET IMMEDIATE MEDICAL ATTENTION. INHALATION: REMOVE TO FRESH AIR. IF BREATHING IS DIFFICULT, HAVE A TRAINED INDIVIDUAL ADMINISTER OXYGEN. IF NOT BREATHING, GIVE ARTIFICIAL RESPIRATION AND HAVE A TRAINED INDIVIDUAL ADMINISTER OXYGEN. GET MEDICAL ATTENTION IMMEDIATELY INGESTION: SEEK MEDICAL ATTENTION IMMEDIATELY. NOTES TO DOCTOR: NO ADDITIONAL FIRST AID INFORMATION AVAILABLE 5. FIRE FIGHTING MEASURES FLAMMABILITY SUMMARY: NOT COMBUSTIBLE FLASH POINT: N/A AUTOIGNITION TEMPERATURE: N/E EXPLOSIVE LIMITS % IN AIR: N/E EXTINGUISHING MEDIA: USE ALCOHOL RESISTANT FOAM, CARBON DIOXIDE, OR DRY CHEMICAL WHEN FIGHTING FIRES. WATER OR FOAM MAY CAUSE FROTHING IF LIQUID IS BURNING BUT IT STILL MAY BE USEFUL EXTINGUISHING AGENT IF CAREFULLLY APPLIED TO THE SURFACE OF THE FIRE. DO NOT DIRECT A STREAM OF WATER INTO
  • 33. Page 3 of 6Revised 5/21/07 MATERIAL SAFETYReplacesPrinted 4/23/07 5/21/07 DATA SHEETMSDS ID: AA 00151090 5. FIRE FIGHTING MEASURES (Cont.) MOLTEN MATERIAL. FIRE AND EXPLOSION METHODS: MATERIAL MAY BE IGNITED ONLY IF PREHEATED TO TEMPETURES ABOVE THE HIGH FLASH POINT, FOR EXAMPLE IN A FIRE. DUST AT SUFFICIENT CONCENTRATIONS CAN FORM EXPLOSIVE MIXTURES WITH AIR. FIRE FIGHTING METHODS: WILL NOT BURN, NO SPECIAL INSTRUCTIONS AVAILABLE. USE METHODS APPROPRIATE FOR SURROUNDING MATERIALS. HAZARDOUS COMBUSTION PRODUCTS: CARBON MONOXIDE; CARBON DIOXIDE; METAL FUMES; TOXIC FUMES. 6. ACCIDENTAL RELEASE MEASURES PRECAUTIONS AND EQUIPMENT: EXPOSURE TO THE SPILLED MATERIAL MAY BE IRRITATING OR HARMFUL. FOLLOW PERSONAL PROTECTIVE EQUIPMENT RECOMMENDATIONS FOUND IN SECTION VIII OF THIS MSDS. METHODS FOR CLEAN-UP: WEAR COMPLETE AND PROPER PERSONAL PROTECTIVE EQUIPMENT FOLLOWING THE RECOMMENDATION OF SECTION VIII GATHER AND STORE IN A SEALED CONTAINER PENDING A WASTE DISPOSAL EVALUATION. DO NOT USE BROOM OR AIR CLEANING ETC. 7. HANDLING AND STORAGE HANDLING MEASURES: HARMFUL OR IRRITATING MATERIAL. AVOID CONTACTING AND AVOID BREATHING THE MATERIAL. USE ONLY IN A WELL VENTILATED AREA. AS WITH ALL CHEMICALS, GOOD INDUSTRIAL HYGIENE PRACTICES SHOULD BE FOLLOWED WHEN HANDLING THIS MATERIAL. AVOID CONTACT WITH MATERIAL, AVOID BREATHING DUSTS OR FUMES, USE ONLY IN A WELL VENTILATED AREA. WASH THOROUGHLY AFTER HANDLING; WASH HANDS BEFORE EATING; DO NOT GET IN EYES, ON SKIN AND CLOTHING; MINIMIZE DUST GENERATION AND ACCUMULATION; AVOID CREATING DUSTS AS AN EXPLOSIVE HIGH CONCENTRATIONS. STORAGE MEASURES: NO SPECIAL REQUIREMENTS KEEP AWAY FROM FOOD AND DRINKING WATER. STORE IN A COOL DRY PLACE.
  • 34. Page 4 of 6Revised 5/21/07 MATERIAL SAFETYReplacesPrinted 4/23/07 5/21/07 DATA SHEETMSDS ID: AA 00151090 8. EXPOSURE CONTROLS AND PERSONAL PROTECTION ENGINEERING MEASURES: USE LOCAL EXHAUST VENTILATION OR OTHER ENGINEERING CONTROLS TO MINIMIZE EXPOSURES AND MAINTAIN OPERATOR COMFORT. ENGINEERING CONTROLS MUST BE DESIGNED TO MEET THE OSHA CHEMICAL SPECIFIC STANDARD IN 29 CFR 1910. VENTILATION IS REQUIRED TO MAINTAIN OPERATOR EXPOSURE BELOW PUBLISHED EXPOSURE LIMITS. USE PROCESS ENCLOSURES, LOCAL EXHAUST VENTILATION, OR OTHER ENGINEERING CONTROLS TO CONTROL AIRBORNE LEVELS BELOW RECOMMENDED EXPOSURE LIMITS; EXPLOSION PROOF EXHAUST VENTILATION SHOULD BE USED. FACILITIES STORING OR USING THIS MATERIAL SHOULD BE EQUIPPED WITH AN EYEWASH AND SAFETY SHOWER. RESPIRATORY PROTECTION: RESPIRATORY PROTECTION MAY BE REQUIRED TO AVOID OVEREXPOSURE WHEN HANDLING THIS PRODUCT. GENERAL OR LOCAL EXHAUST VENTILATION IS THE PREFERRED MEANS OF PROTECTION. USE A RESPIRATOR IF GENERAL ROOM VENTILATION IS NOT AVAILABLE OR SUFFICIENT TO ELIMINATE SYMPTOMS. FOLLOW A RESPIRATORY PROTECTION PROGRAM THAT MEETS 29 CFR 1910.134 AND ANSI Z88.2 REQUIREMENTS WHENEVER WORK PLACE CONDITIONS WARRANT THE USE OF A RESPIRATOR. WEAR A NIOSH APPROVED RESPIRATOR IF ANY EXPOSURE IS POSSIBLE. EYE PROTECTION: WEAR CHEMICALLY RESISTANT SAFETY GLASSES WITH SIDE SHIELDS WHEN HANDLING THIS PRODUCT. DO NOT WEAR CONTACT LENSES. WEAR GOGGLES AND A FACE SHIELD SKIN PROTECTION: WEAR PROTECTIVE GLOVES. INSPECT GLOVES FOR CHEMICAL BREAK-THROUGH AND REPLACE AT REGULAR INTERVALS. CLEAN PROTECTIVE EQUIPMENT REGULARLY. WASH HANDS AND OTHER EXPOSED AREAS WITH MILD SOAP AND WATER BEFORE EATING, DRINKING, AND WHEN LEAVING WORK CONTROL PARAMETERS: ----------ACGIH EXPOSURE LIMITS---------------- CHEMICAL NAME TLV-TWA STEL CEILING Forax AX Sensitizer;keep exposure as low as possible. TIN 2 mg/m3 TWA SILVER 0.01 mg/m3 TWA COPPER 0.1 mg/m3 TWA (fume)
  • 35. Page 5 of 6Revised 5/21/07 MATERIAL SAFETYReplacesPrinted 4/23/07 5/21/07 DATA SHEETMSDS ID: AA 00151090 9. PHYSICAL AND CHEMICAL PROPERTIES COLOR: GREY ODOR: NONE pH: N/A 10. STABILITY AND REACTIVITY DECOMPOSITION PRODUCTS: METAL FUMES; TOXIC FUMES. INCOMPATIBLE MATERIALS: STRONG ACIDS; STRONG OXIDIZING AGENTS; CONDITIONS TO AVOID: NONE KNOWN CONTAMINATION: CONTACT WITH AIR. CONTACT WITH WATER 11. TOXICOLOGICAL INFORMATION COMPONENT TOXICOLOGY DATA (NIOSH) CHEMICAL NAME LD50/LC50 Ethoxylated octylphenol Acute oral toxicity (LD50):1800 mg/kg(Rat) Ethoxylated-N-Tallow LD50: 945 mg/kg oral rat Alkyltrimethylenediamine Floral AX Sensitizer 12. ECOLOGICAL INFORMATION OVERVIEW: SLIGHT ECOLOGICAL HAZARD. IN HIGH CONCENTRATIONS, THIS PRODUCT MAY BE DANGEROUS TO PLANTS AND/OR WILDLIFE. 13. DISPOSAL CONSIDERATIONS WASTE DESCRIPTION: SPENT OR DISCARDED MATERIAL IS PROBABLY A HAZARDOUS WASTE. DISPOSAL METHODS: DISPOSE OF IN ACCORDANCE WITH FEDERAL, STATE, LOCAL, OR PROVINCIAL LAWS AND REGULATIONS.
  • 36. Page 6 of 6Revised 5/21/07 MATERIAL SAFETYReplacesPrinted 4/23/07 5/21/07 DATA SHEETMSDS ID: AA 00151090 14. TRANSPORT INFORMATION SHIPPING BASIC DESCRIPTION: DOT & IATA: NOT RESTRICTED 15. REGULATORY INFORMATION TSCA STATUS: ALL COMPONENTS OF THIS PRODUCT ARE LISTED ON THE TSCA INVENTORY OF EXISTING CHEMICAL SUBSTANCES. REGULATED CHEMICALS: CHEMICAL NAME REGULATION SILVER 7440-22-4 SARA 313 WHMIS rating: D2B 16. OTHER INFORMATION The information contained herein is based on data considered accurate. However, no warranty is expressed of implied regarding the accuracy of these data or the results to be obtained from the use thereof. Additionally, Alpha Metals, Inc. assumes no responsibility for injury to the vendee or third persons proximately caused by the material even if reasonable safety procedures are followed. Furthermore, vendee assumes the risk in his use of the material.