WLCSP Market & Industrial TrendsPublished: November 2011Price: $ 5790Growth rate is still high, but the market shows early...
Looming over the horizon is the threat of the CMOS 28nm node technology with such a highIO density that some package with ...
• Detailed account of all the application fields of WLCSP (examples DC/DC converters andLDOs, connectivity „WLAN+Bluetooth...
Microchip, Micron, Micronics, Mitsubishi Chemical, Mosart, Motorola, Murata, NationalSemiconductors, Nemotek, Nepes, Nexx,...
‘FAN-IN’ WLCSP INFRASTRUCTURE & SUPPLY CHAINSupply chain case of fan-in WLCSPSupply chain case of 3D WLCSPBusiness model e...
3D WLCSP manufacturing infrastructure2010 fan-in 3D WLCSP wafer capacity - by playersPlayers by business Model in the 3D W...
Upcoming SlideShare
Loading in …5
×

WLCSP Market & Industrial Trends

2,137 views
1,996 views

Published on

In this WLCSP 2011 report, you will find detailed technical and market status and forecasts on WLCSP technologies and applications. Market forecasts and growth rates are provided based on device units and wafers for each market segment over the 2010-2016 timeframe. Market value forecasts in dollars are given over the same period of time.

Published in: Technology, Business
0 Comments
0 Likes
Statistics
Notes
  • Be the first to comment

  • Be the first to like this

No Downloads
Views
Total views
2,137
On SlideShare
0
From Embeds
0
Number of Embeds
4
Actions
Shares
0
Downloads
13
Comments
0
Likes
0
Embeds 0
No embeds

No notes for slide

WLCSP Market & Industrial Trends

  1. 1. WLCSP Market & Industrial TrendsPublished: November 2011Price: $ 5790Growth rate is still high, but the market shows early signs of maturityMany “WLP” technologies are now cruising at a very high altitude. This is serious business:over 23 billion units packaged with „fan-in‟ as we may call it are expected to sell and bemounted in smartphones, tablet PCs or other mobile devices in 2011. For size reduction,together with low cost, remains the main driver for adoption of this technology. If „fan-in‟WLCSP already reached high penetration rates in mobile applications for connectivity(Bluetooth+WLAN+FM combos, GPS) and analog integrated circuits (DC/DC converters,LDOs, ESD/EMI protection devices), it is still growing fast for some other IC types as wellas in MEMS and sensors. We are not at a time to claim that “Wafer Level Packaging” istaking off any longer.Reaching over 2 million 300mm equivalent „fan-in‟ WLCSP wafers in 2011 for a total marketsize of b$1.7Of course, one may argue that these are tiny devices. Well, if this is true for many of them,it appears that the average size of a „fan-in‟ WLCSP device tended to increase over the past2 years, with many “connectivity” devices reaching sizes of more than 30mm2. We estimatethat in 2011, more than 2.3 million 300mm equivalent „fan-in‟ WLCSP wafers will beprocessed for the first time. All steps compounded (wafer level, die level and test), weestimate that the 2011 market value of „fan-in‟ WLCSP is close to B$ 1.7.Prices keep on decreasing, but the market growth rate is expected to stay high at 12% overthe 2010-2016 time periodAlthough costs and prices still decrease as the technology and its market mature, themarket value growth rate for the 2010-2016 timeframe is still expected around 12%, 4points higher than semiconductor packaging in general. However, this is lower than the22% 2008-2013 growth rate we had computed for the same market 2 years ago. Costs kepton decreasing thanks to the end of the capacity shortage on 12-inch diameter wafers andthanks to standardizing technologies with simplified process flows. And despite technologiesimproved to the point that the maximum possible die size could be extended, its not allclear skies for „fan-in‟ WLCSP. With the continuous fallout of Nokia on the handsets market,this is WLCSPs historical biggest supporter which loses influence, and some tier twohandset manufacturers still seem reluctant to broadly adopt the technology.Changing paradigms: future growth will be driven by different devices, based on differenttechnologies
  2. 2. Looming over the horizon is the threat of the CMOS 28nm node technology with such a highIO density that some package with a “fan-out area” will be needed anyhow. Hopefully, Asignificant part of the „fan-in‟ WLCSP market still relies on the analogue ICs on the onehand, using older technologies, and on MEMS and sensors (particularly CMOS imagesensors) on the other hand. This latter device type is expected to be a high potential growthapplication for fan-in WLCSP in the coming 5 years: we expect a tremendous growth of upto 25% for MEMS and sensors with a WLCSP finishing over the next 5 years. All in all, „fan-in‟ WLCSP shows the first early signs of a maturing market. It still grows faster than theaverage semiconductor packaging market mainly thanks to the fast growth rates ofsmartphones and tablet PCs in which WLCSP considerably helps save space and reducecosts.High margins are attracting new player types with diverse business modelsThe supply chain is still primarily led by OSATs and IDMs, But the original “Wafer bumpinghouses” and “wafer packaging houses” take a significant share of the market too. All themajor OSATs invested in 300mm WLCSP capacity over the past 2 years. TSMC recentlyclaimed their will to step in this market too, possibly opening the way to other foundries.In this WLCSP 2011 report, you will find detailed technical and market status and forecastson WLCSP technologies and applications. Market forecasts and growth rates are providedbased on device units and wafers for each market segment over the 2010-2016 timeframe.Market value forecasts in dollars are given over the same period of time. Based on our“bottom-up” analysis of the WLP fabs, the report displays the list and ranking of the WLCSPfront-end (RDL, UBM and balling) players as of end of 2010, including the detailedrespective wafer production capacities by player and wafer type.Our unique “bottom-up meets top-down analysis” cross checks our forecasting modelsapplication by application, and player by player, delivering a high definition picture of thestatus of the „fan-in‟ WLCSP market, with, for example, the level of loading of the majorWLCSP fabs by application and by IC design company.Numerous application examples are given, recent technical developments on materials,architectures and test are detailed, and industry-wide technology roadmaps are presented.In addition, the report provides for the analysis of the supply chain and a detailed costanalysis section with models and examples.BENEFITSKey features of the report
  3. 3. • Detailed account of all the application fields of WLCSP (examples DC/DC converters andLDOs, connectivity „WLAN+Bluetooth+FM‟ combos, GPS, audio codecs and amplifiers,MEMS, CMOS image sensors ...)• Market trends and figures in Munits, M$, and wafer size equivalent with breakdown byapplication.• Wafer price ranges of WLCSP contract assembly by wafer size and breakdown by mainprocess step (wafer level, die level and test)• Complete technologies and material tool-box analysis, covering „fan-in‟ WLCSP as well as3DWLCSP of MEMS devices and sensors.• Market SharesWho should buy this report?• Integrated semiconductor Device Manufacturers and fabless semiconductor companies• Get the list of the top WLCSP service providers.• Benchmark the competition activity and choose the right package for your futureapplications• Assembly and Test Service companies and wafer bumping houses• Assess your technical and market position in the WLCSP service market.• Get the list of the main WLCSP users• Get acquainted with upcoming technologies and their potential• Plan ahead needed investments for capacity• Electronic module makers and Original Equipment Makers• Evaluate the benefits of using these new technologies in your end system.• Monitor new WLCSP application trends and package developments• Equipment and Material manufacturers• Identify new business opportunities and prospects• Understand the differentiated value of your products and technologies in this market• IC and MEMS Foundries• Spot new opportunities and define diversification strategiesCompanies cited in the reportAccretech, advantest, agilent technologies, Alphaprobes, Amkor, AMS, Anadigics, AnalogDevices, AnalogicTech, Apple, Applied Materials, Asahi Kasei (AKM), ASE, Audience, AvagoTechnologies, Bosch, Broadcom, Cascade Microtech, Casio Micronics, China WLCSP, CirrusLogic, CSR, Cypress, Delphi, Dialog Semiconductors, Discera, DNP, Dow, Dupont,electroglas, Ellipsiz, EPWorks, Fairchild, FCI, Form factor, Fraunhofer IZM, Freescale,Fujikura, Fujitsu, Google, Hamamatsu, Hynix, ICI, Idex, IDT, IDT, IME, imec, Infineon,International Rectifier, Intersil, Invensense, JCAP, JEM, JSR Micro, LAM Research, LBSemicon, Lenovo, LETI, Linear Technology, LTX/Credence, Marvell, Maxim, Maxlinear,
  4. 4. Microchip, Micron, Micronics, Mitsubishi Chemical, Mosart, Motorola, Murata, NationalSemiconductors, Nemotek, Nepes, Nexx, Nippon Steel, Materials, Nokia, NXP, OKI, Okmetic,Omnivision, On semiconductor, Optopac, PacTech, Panasonic, Panasonic, PowerTech (PTI),Qualcomm, Renesas, Rhom, RIM (Blackberry), Samsung, Sanyo, Sensonor, Sharp,Shibasoku, Shin-Etsu, Shinko, Silecs, Silex, Siltech, SiTime, SMSC, Sony, SPIL, SPTS,StatsChipPac, STEricsson, STMicroelectronics, Sumitomo, Suss Microtec, TDK-Epcos,technoprobe, TEL, Teledyne/Dalsa, teradyne, TeraMikros, TeraProbe, Texas Instruments,Toray, Toshiba Semiconductors, Tronics, TSMC, UMC, Unisem, verigy, Visera, VTI,Wentworth laboratories, Wolfson Microelectronics, Xintec, Yamaha, YokogawaAbout the authorsJean-Marc Yannou joined Yole Développement as technology and market expert in the fieldsof advanced packaging and Intergrate Passive Devices. He has 15-years of experience inthe semiconductor industry.Lionel Cadix joined Yole after the completion of several projects linked to thecharacterization and modeling of high density TSV and 3DIC chip stacking in collaborationwith CEA-Leti and STMicroelectronics during his PhD.ABOUT YOLE DÉVELOPPEMENTBeginning in 1998 with Yole Développement, we have grown to become a group ofcompanies providing market research, technology analysis, strategy consulting, media inaddition to fi nance services. With a solid focus on emerging applications using siliconand/or micro manufacturing Yole Développement group has expanded to include more than40 associates worldwide covering MEMS, Microfluidics & Medical, Advanced Packaging,Compound Semiconductors, Power Electronics, LED, and Photovoltaic.Table of ContentsSCOPE OF THE REPORT & DEFINITIONSDefinitions of wafer scale packaging, wafer level packaging & wafer level chip scalepackagingScope of the reportEXECUTIVE SUMMARY‘FAN-IN’ WLCSP MARKET FORECASTSTop-down analysis & 2010-2016 unit, wafer and market forecastBottom-up analysis and 2010 production capacity and market sharesDetailed view of WLCSPs IC design wins on the marketIC Players capacity for each WLCSP application
  5. 5. ‘FAN-IN’ WLCSP INFRASTRUCTURE & SUPPLY CHAINSupply chain case of fan-in WLCSPSupply chain case of 3D WLCSPBusiness model examples‘FAN-IN’ WLCSP TECHNOLOGIESRDL, UBM and ballingTest of „fan-in‟ WLCSPCOST OF ‘FAN-IN’ WLCSP„fan-in‟ WLCSP cost structure2008-2016 „fan-in‟ WLCSP cost roadmap by main stepsCost comparisons of different package platforms for a 64 IO device‘FAN-IN’ WLCSP APPLICATION FOCUSWLCSP ICs in handsets, tablet PCs and MP3WLCSP ICs for computingWLCSP for ICs in medical, automotive & space applicationsWLCSP of CMOS image sensorsWLCSP of MEMS devicesCONCLUSION & PERSPECTIVESAPPENDIXYole Développement company presentationCompany servicesAdvanced Packaging team analystsLIST OF FIGURES:„Fan-in‟ WLCSP Market Value Forecast ($M)2010 „Fan-in‟ WLCSP Market Value ($M)Split by cost-of-ownership segmentsExamples of fan-in WLCSP penetration in real products2010-2016 „Fan-in‟ WLCSP unit forecast2010-2016 „Fan-in‟ WLCSP wafer forecast10 top 30 IC design companies demand for WLCSP servicesWLCSP design wins2010 3D WLCSP & WLCSP wafer shipmentWLCSP + 3D WLCSP regional capacities2010 WLCSP & 3D WLCSP wafer capacitiesMatching 2010 bottom up and top down analysisfan-in WLCSP manufacturing infrastructure2010 fan-in WLCSP wafer capacity (3D WLCSP excluded)Players by business Model in the WLCSP spaceSupply Chain for WLCSP Manufacturing
  6. 6. 3D WLCSP manufacturing infrastructure2010 fan-in 3D WLCSP wafer capacity - by playersPlayers by business Model in the 3D WLCSP spaceSupply Chain for 3D WLCSP Manufacturing2010 WLCSP / 3D WLCSP wafer capacities - Breakdown by business modelAn example of “Packaging House” Business Model for WLCSPWLCSP manufacturing strategy - Supply Chain / RelationshipsPackaging subcons main loading partners for WLCSP (TRIAL)Typical Fan-in WL CSP process flowExample of overall 3D WLP process flowWLCSP polymers main propertiesWLCSP polymers advantages and drawbacksMapping of WLCSP UBM/passivation materialsWLCSP challenges and solutionsMain WLCSP roadmap Trends„Fan-in‟ WLCSP contract price Forecasts„Fan-in‟ WLP Cost Model„Fan-in‟ WLP Device CategoriesAbout Us:ReportsnReports is an online library of over 100,000+ market research reports and in-depthmarket research studies & analysis of over 5000 micro markets. We provide 24/7 online andoffline support to our customers. Get in touch with us for your needs of market researchreports.Follow us on Twitter: http://twitter.com/marketsreportsOur Facebook Page: http://www.facebook.com/pages/ReportsnReports/191441427571689Contact:Mr.Priyank7557 Rambler road,Suite727,Dallas,TX75231Tel: + 1 888 391 5441E-mail: sales@reportsandreports.comhttp://www.reportsnreports.comVisit our Market Research Blog

×