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I cs

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  • 1. INTEGRATED CIRCUITS<br />BY-: RANJAN KUMAR<br /> B-tech{ece}<br /> 2nd sem<br />1<br />
  • 2. Contents<br /> 5<br />1<br />ABOUT ICS<br />HISTORY<br />2<br />CATEGORIES OF ICS<br />3<br />TYPES OF ICS<br />4<br />DETAILS IN SLIDE<br />………………………………………………………..<br />2<br />RANJAN KUMAR 10907637<br />
  • 3. Integrated Circuits are usually called ICs or chips.<br />A complex set of electronic components and their interconnections that are imprinted onto a tiny slice of semiconducting material.<br />Integrated circuit:<br />3<br />RANJAN KUMAR 10907637<br />
  • 4. WHAT ARE INTEGRATED CIRCUIT<br />Ics is one of the basic component of every electronic device.<br /> Ics consists of active as well as passive components.<br />Ics had revolutionized the world of electronics.<br />It increases the speed and functioning of electronic devices.<br />4<br />RANJAN KUMAR 10907637<br />
  • 5. ABOUT 1st IC’s<br /><ul><li>The first integrated circuit was developed in the 1950s by Jack Kilby
  • 6. He put together few transistors,capacitors, linking them with a thin layer of germanium, a semiconducting material</li></ul>The World First Ics or chip<br />5<br />RANJAN KUMAR 10907637<br />
  • 7. THE WORLD 1st Ics with silicon chip<br />Ics with “silicon chip” <br />6<br />RANJAN KUMAR 10907637<br />
  • 8. MAIN COMPONENTS OF ICs<br />TRANSISTOR<br />Title<br />CAPACITOR<br />Title<br />RESISTOR<br />Title<br />An Ics have million of microscopic elements, but most vital componentsare<br />D<br />DIODE<br />7<br />RANJAN KUMAR 10907637<br />
  • 9. Diagram<br />1<br />3<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />8<br />RANJAN KUMAR 10907637<br />
  • 10. Diagram<br />1<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />9<br />RANJAN KUMAR 10907637<br />
  • 11. Categories of ICsbased on “Packing Density”<br />SSI<br />MSI<br />ULSI<br />LSI<br />VLSI<br />SLSI<br />10<br />RANJAN KUMAR 10907637<br />
  • 12. SHORT DETAILS<br />LOGIC GATES<br />SSI<br /> =1-12 =1- 50<br />1 <br />DEVICES<br />ULSI<br /><1O,000<br />MSI<br /> =12-100<br /> =50- 5000<br />1 CRORE-<br />10 CRORE<br /><1 LAKHS<br /><10CRORES<br />SLSI<br />=<100<br /> =5000-1 LAKHS<br />=1000-10,000<br />=1 LAKHS-1 CRORE<br />LSI<br />VLSI<br />11<br />RANJAN KUMAR 10907637<br />
  • 13. ON THE BASIS OF PACKING <br />ICS ARE OF THREE TYPES <br />DIP<br />FLAT PACK IC<br />CAN SHAPE IC<br />12<br />RANJAN KUMAR 10907637<br />
  • 14. 1<br />3<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />PICTORIAL DIAGRAM OF DIP<br />13<br />RANJAN KUMAR 10907637<br />
  • 15. PICTORIALDIAGRAM OF FLAT PACK ICS<br />1<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc.<br />14<br />RANJAN KUMAR 10907637<br />
  • 16. PICTORIAL DIAGRAM OF IC CAN<br />1<br />3<br />Inc.<br />15<br />RANJAN KUMAR 10907637<br />
  • 17. ABOUT PINOUT<br />Nr.NamePurpose<br />1GNDGround, low level (0 V)<br />2TRIGA short pulse high-to-low on the trigger starts the timer<br />3OUT<br />During a timing interval, the outputstaysat +VCC<br />4RESETA timing interval can be interrupted by applying a reset pulse to low (0 V)<br />5CTRLControl voltage allows access to the internal voltage divider (2/3 VCC)<br />6THRThe threshold at which the interval ends (it ends if the voltage at THR is at least 2/3 VCC)<br />7DISConnected to a capacitor whose discharge time will influence the timing interval<br />8V+, VCC<br />The positive supply voltage which must be between 3 and 15 V<br />EG:<br />555<br />16<br />RANJAN KUMAR 10907637<br />
  • 18. Types of ICs <br />1.Analog<br />INTEGRATED <br />CIRCUITS<br />2.Digital<br />3.Mixed Signal<br />17<br />RANJAN KUMAR 10907637<br />
  • 19. WHY WE NEED ICs<br />FOR MAKING COMPLEX DEVICES<br />IMPROVED PERFORMANCE<br />LOW POWER <br />CONSUMPTION<br />EASY TO REPAIR<br />18<br />RANJAN KUMAR 10907637<br />
  • 20. REASONS<br />FOR MAKING COMPLEX DEVICES<br /> Like LAPTOP ,PALMTOP, MOBILE etc..<br />LOW POWER CONSUMTION<br /> If we use different transistor, capacitor, diode, resistor separately it require large amount of voltage while the use Ics reduces this voltage consumption .<br />19<br />RANJAN KUMAR 10907637<br />
  • 21. REASONS<br />EASY TO REPAIR: In case IC get damage, we can easily change it instead of changing each components separately.<br />IMPROVED PERFORMANCE: Performance is increased due to high speed and efficiency.<br />20<br />RANJAN KUMAR 10907637<br />
  • 22. Advantage of Ics<br />1.SMALL IN SIZE<br />2.LOW COST<br />Advantage<br />3.VERY LOW WEIGHT <br />4. EASY REPLACEMENT<br />5.LESS POWER TO OPERATE<br />21<br />RANJAN KUMAR 10907637<br />
  • 23. DISADVANTAGE OF “ICS”<br />COSTLY TO <br />REPLACE<br />PRECIOUS TO<br /> MAKE ICs<br />MANY PINS<br /> ARE USED <br />Title<br />Add your text<br />22<br />RANJAN KUMAR 10907637<br />
  • 24. Why silicon is preferred over germanium<br />SILICON<br />GERMANIUM<br />Less cost<br />High cost<br />GROUP 4<br /> Operate>200cels.<br />.<br />Operate<=100cels.<br />High M.P<br />Low M.PS<br />CONCEPT<br />23<br />RANJAN KUMAR 10907637<br />
  • 25. USES<br />Ics are used in all branches of electronics.<br />EG: Printing machines<br /> Computer<br />INDUSTRIAL CONTROL <br />EG: Cellphones, <br />COMMUNICATION SYSTEM<br />Fax machine<br /> EG: Buzzer, <br /> water indicator <br />ELECTRONICS INSTRUMENTS<br />EG: Detection and <br /> measurement of protiens<br />MEDICAL<br />24<br />RANJAN KUMAR 10907637<br />
  • 26. LATEST CHIP USED NOW A DAYS<br />IT,S NOTHING BUT CARBON CHIP<br />CHIP MANUFATURED ON DIAMOND<br />STRUCTURAL CARBON WAFER<br />MAJOR COMPONENT ARE<br />CARBON NANOTUBE USING “C”<br />DIAMOND CHIP<br />25<br />RANJAN KUMAR 10907637<br />
  • 27. WHY DIAMOND CHIP REPLACES SILICON CHIP <br />WORK AT<br />HIGH<br />SPEED<br />WORK AT <br />HIGH TEMP.<br />SMALLER <br />IN SIZE<br />D<S<G<br />D>s>G<br />“C” CHIP>200CEL<br />26<br />RANJAN KUMAR 10907637<br />
  • 28. GROWTH IN Ics CHIP <br />Text<br />GERMANIUM CHIP<br />1950<br />SILICON CHIP<br />1961 <br />DIAMOND CHIP<br />1991<br />27<br />RANJAN KUMAR 10907637<br />
  • 29. FUNDMENTAL UNIT<br />OF ELETRONICS DEVICES<br />DIAMOND CHIP IS <br />METAL CHIP<br />ICS<br />ICS INCRESES<br />SPEED & EFFECIENCY<br />DIAMOND CHIP<br /> LATEST CHIP<br />REVOLUTION IN <br />FIELD OF ELETRONICS<br />ICS CONSISTS OF<br />MANY MICRO DEVICES <br />CONCLUSION<br />28<br />RANJAN KUMAR 10907637<br />
  • 30. THAT’S ALL !<br />29<br />

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