MEMS are tiny devices (with dimensions measuring less then 100 microns) that are generally integrated on a larger silicon substrate and controlled by electronic circuits to perform mechanical functions.
Many MEMS devices involve the binding of thin films of distinct materials.
In order to determine critical stresses for microstructures, were subjected to a tensile test
The force acting on the specimen is determined using a high resolution balance, while the strain is determined using a video camera and a least square template matching algorithm (LSM) which yields a super resolution in the specimen extension around 10nm under an optical microscope.
In addition to these techniques, a number of other methods for
material testing of micro-materials exist, which have received increasing attention.
They offer insight into many interesting phenomena (like bending, micro-tensile and torsion tests) Together with elaborate manufacturing possibilities as known from MEMS fabrication, they offer possibilities of probing material behavior in the nm range.
With this it is hoped that an improved understanding of processes important for the life time and reliability of MEMS components will be possible in the near future.