Panel Internet & infraestructura - Dia Mundial de Internet

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Panel Internet & infraestructura;
Aspectos regulatorios e infraestructura necesaria para el funcionamiento de Internet: conectividad; banda ancha; hardware; regulaciones; Internet Governance, presentacion realizada por Silvia Caruso (AMD)

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  • Our history of innovation in the server market directly tracks to the changing demands over time. We believe we’re correctly anticipating a major market shift yet again.AMD has consistently been just ahead of market shifts and delivered technology at the right time to meet the industry’s needs. The first wave of AMD innovation brought:Rise of x86 in servers and need for additional competition – our market entry64-bit computingBalanced platformsRecognition of power concernsConsistent understanding of memory transitions – you see this throughout our history in the server marketRise of virtualizationWorkload-based performanceAnd today – it’s the new shift in what customers perceive as value in a server purchase. The Second Wave.
  • We believe the IT customer today cares about more than performance,More than power,They care about complete package that includes excellent application performance, superior power efficiency, and delivers overall valueValue = reasonable costs to obtain, deploy, manage, upgrade
  • Panel Internet & infraestructura - Dia Mundial de Internet

    1. 1. The AMD Opteron™ Platform<br />Día Mundial de Internet<br />17 de Mayo de 2010 – Aula Magna UADE<br />Silvia Caruso<br />Business Development Manager<br />AMD – Spanish South America<br />
    2. 2. AMD is Changing Server Market Dynamics Again<br />AMD Opteron™ Processor, World’s First x86 Processor with 64- and 32-bit capability, integrated memory controller, HyperTransport™ technology high-speed serial system bus and glueless 1- to 8-P scalability<br />World’s First Native Quad-Core x86 Processor with HW-based virtualization features<br />AMD Opteron™ Processor HE/EE, First Low-Power x86Processors<br />World’s First 6-core x86 Processor for 1P to 8P<br />World’s First Dual-Core x86 Processor<br />World’s First 12-core x86 Processor and Direct Connect Architecture 2.0<br />AMD Socket F (1207) Platform: four generations of upgradeability<br />Anticipating needs and delivering innovation at the right time for the market<br />2003<br />2005<br />2007<br />2004<br />2006<br />2008<br />2009<br />2010<br />
    3. 3. Six-Core AMD Opteron™ Processor: Savings Opportunity<br />2003<br />2009<br />2009<br />up to 14x Performance<br />Similar Performance<br />or<br />Room for expansion<br />Room for expansion<br />up to 95% Annual Energy Costs Estimated Reduction<br />up to 30% Annual Energy Costs Estimated Reduction<br />14 Single-Core<br />AMD Opteron™ processor<br />based servers<br />14 Six-Core <br />AMD Opteron™ processor<br />1 Six-Core <br />AMD Opteron™ processor<br />Source: AMD internal performance and power measurements and estimates using a java-based workload.. Information is provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. For detailed calculations, configurations and assumptions refer to backup slides 18-19. <br />3<br />More performance, more savings opportunity<br />
    4. 4. Workload Optimized – Processors for Every Application<br />Scalability<br />More cores, greater scalability<br />(“more cores” Standard/SE)<br />More clocks, greater scalability<br />(“less cores” Standard/SE)<br />Multi-threaded HPC<br />Compute-intensive Technical Applications<br />Virtualization<br />Clock Speed<br />Database<br />Cores<br />Network Infrastructure<br />Power-constrained HPC<br />Cloud<br />Email<br />File/print<br />Web Hosting<br />More clocks, more efficiency<br />(“less cores” Standard/HE/EE)<br />More cores, more efficiency<br />(“more cores” Standard/HE/EE)<br />Efficiency<br />
    5. 5. Direct Connect Architecture 2.0Balanced and Scalable Design to Support up to 16 Cores* per CPU <br />4 MEMORY<br /> CONTROLLERS<br />4 MEMORY<br /> CONTROLLERS<br />12 DIMMs per CPU<br />12 DIMMs per CPU<br />4 MEMORY<br /> CONTROLLERS<br />4 MEMORY<br /> CONTROLLERS<br />12 DIMMs per CPU<br />12 DIMMs per CPU<br /><ul><li>1-hop between processors
    6. 6. Four memory controllers
    7. 7. Up to 50% more DIMMs
    8. 8. Up to 33% increase in CPU to CPU communication speed*</li></ul>Based on HyperTransport™ technology links @ up to 4.8 GT/s for Six-Core AMD Opteron™ processor vs. 6.4 GT/s for AMD Opteron™ 6100 Series processor.<br />*16-core configuration planned for upcoming AMD processor core codenamed “Bulldozer.” <br />
    9. 9. STRATO Europe & AMD – Caso de Estudio <br /><ul><li>STRATO : Compañía Alemana, segundo proveedor de Alojamiento WEB de Europa
    10. 10. 1,6 millones de clientes en 6 países Europeos
    11. 11. 2 Datacenters donde se administran 35.000 servidores con 4 millones de dominios
    12. 12. Estrategia:
    13. 13. Datacenter: Seguridad y disponibilidad en letras mayúscula
    14. 14. Medio Ambiente: Energía eficiente y protección
    15. 15. Calidad de Servicio: Certificada por TÜV, Alta Disponibilidad y Seguridad</li></li></ul><li>Summary: Value Definition Has Changed Over Time<br />Over time, the criteria has changed from:<br />Price /performance /watt<br />$<br />Performance / watt <br />Raw Performance<br />1995<br />2005<br />2000<br />2010<br />
    16. 16. GRACIAS !!!<br />
    17. 17. Forward-Looking Statement<br />This presentation contains forward-looking statements concerning AMD and technology partner product offerings which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," “strategy,” “roadmaps,” "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. With respect to AMD, risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting AMD's business will prevent attainment of AMD's current plans; customers stop buying AMD’s products or materially reduce their operations or demand for its products; AMD will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; standards promulgated by open standards will be adopted at rates slower than currently projected, demand for computers and, in turn, demand for AMD’s products will be lower than currently expected; there will be unexpected variations in market growth and demand for AMD’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; and AMD will be unable to maintain the level of investment in research and development that is required to remain competitive. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to the Annual Report on Form 10-K for the fiscal year ended December 26, 2009.<br />Trademark Attribution<br />AMD, the AMD Arrow logo, AMD Cool Core, AMD Cool Speed, AMD PowerNow!, AMD Opteron and combinations thereof, and AMD-Vi are trademarks of Advanced Micro Devices, Inc.  HT is a licensed trademark of the HyperTransport Consortium.  Other marks used herein may be the trademarks of their respective companies.<br />©2010 Advanced Micro Devices, Inc. All rights reserved.<br />

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