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  • DC-DC Converter ICs: Power System in Package, Worldwide TechnologyTrends, Forecasts and Competitive Environment, First Editionhttp://www.aarkstore.com/reports/DC-DC-Converter-ICs-Power-System-in-Package-Worldwide-Technology-Trends-Forecasts-and-Competitive-Environment-First-Edition-170260.htmlThis report provides a detailed and quantitative analysis of the global market for Power Sistem inPackage (PSiP) dc-dc converter modules. In many instances, unit sales, dollar sales and pricingtrends are discussed. See the listing of Figures for a complete description of the Tables includedin this unique and extensive analysis.Topics covered include:Definitions and Factors Driving AdoptionSystem Maker Demand CharacteristicsIC Developments and Packaging TrendsMaterials ChallengesApplication Demand CharacteristicsWorldwide PSiP ForecastsCommercial DevelopmentCompetitive OverviewPSiP products are encroaching certain dc-dc converter IC markets and could replace traditionalsolutions over the next five years. The total Worldwide PSiP dollar market is projected to growfrom approximately $65 million in 2011 to $284 million in 2016, a compound annual growth rate(CAGR) of 34.4%. High growth rates are expected for all the application segments targeted bycompanies making PSiP products. The engineering innovations that have led to PSiP, PCiP and PwrSoC designs will have animpact on different levels and functions of existing dc-dc power converter ICs and modules.PSiP and PCiP (and eventually PwrSoC) products are expected to encroach on the current levelsoccupied by LDOs, switching regulators, and controllers/FETs. The best opportunities are in communications and computers, where unit CAGRs are expectedto range between 35% and 50% between 2011 and 2016; and revenue CAGRs will be around23% to 38% over the forecast period. Industrial applications will see good growth, as well,around 55% for unit sales and 44% for dollar sales. The best smaller markets will have even faster unit growth, but this is due to very low startingbases. These include automotive, military/aerospace and medical applications, which will seegrowth between 50% and 100%. Most of these applications will not see significant revenue until2013, however. “Power System in Package” is a term that encompasses several new package styles that couldreplace certain existing dc-dc converter IC solutions in the future. The bulk of this report focuseson “Power Supply in Package” (PSiP) designs, which are highly integrated micro-modules andthe most commercially advanced, although still considered an emerging solution. It also includes
  • “Power Supply on Chip” (PwrSoC), which is a complete switch-mode dc-dc converter solutionintegrated onto a single piece of silicon (not yet commercially available); and “Power Converterin Package” (PCiP), where some components are integrated, but other components are external. PSiP devices could replace LDOs, for instance, since they can address space constraintchallenges while tripling power efficiency in ultra-low-noise environments. They could alsoreplace noisy dc-dc switching regulators with ultra-quiet, high-efficiency dc-dc converters andminiaturize traditional discrete dc-dc converters. This report identifies the functions that require the specific benefits offered byPSiP/PCiP/PwrSoC products; and then identifies the applications that need these functions,which are presently being met by LDOs, switching regulators, and so on. Due to pricingconstraints, however, these products are expected to be a very small portion of the overall dc-dcconverter IC market, but their share is growing. No true commercial PwrSoC products currently exist, so the forecasts presented are forPSiP/PCiP-type products. But these functions and applications could be met by future PwrSoCproducts, as well. Darnell Group believes that looking at these technologies based on thefunctions that the components perform opens up the commercial potential for PwrSoC, PSiP andPCiP products. For example, an isolation barrier is typical in many applications, but this functionmay be performed with multiple technologies. Capacitors are used for filtering and energystorage, which can also be addressed in other ways. Looking at PwrSoC, PSiP and PCiP technologies from a function integration perspective, asopposed to a component integration perspective, also opens up the application markets wherethese devices can be used, since the limitations of components integration may no longer apply.Alternative solutions for these applications can be considered, and some companies are alreadylooking at this kind of redefinition in designing products. Not all of these solutions are cost-effective yet, but they are expected to be over the coming years. At the present time, most PSiP/PCiP solutions are being directed at the lower input voltagesegments. This is expected to change over the course of the forecast period, with products beingused in higher input voltage applications. While PSiPs are intended to primarily compete withnon-isolated dc-dc converter modules, PwrSoCs are expected to compete with both modules andIC-based solutions. Printed-circuit-board-based dc-dc converter modules are dominant at current levels of 5A andmore, and are less common at lower current levels. PSiPs are the more “mature” technology, arecommercially available, and are becoming more cost-competitive. PSiP-style products are not anew trend, but they are expected to be the “advance guard” for PwrSoC products. Mostcompanies Darnell spoke to see a growing market for PSiP-style devices, including systemmakers. PwrSoC still faces issues with cost and other economic factors, so adoption is expectedto be sporadic and in “niche” applications, such as computer distributed point-of-load, mobiledevices, and applications where ultrahigh-power density is required.Since no true PwrSoC commercial products exist yet, this report focuses on companies that are
  • either making PSiP products, or are developing technologies or researching innovative solutionsthat are expected to further the PwrSoC market. The applications targeted by companies makingPSiP products include high-performance computer applications, such as servers; telecomapplications; and mobile devices, such as tablets and smartphones. Energy harvesting was alsocited as a “definite market,” along with “some industrial.” Although not included specifically inthese forecasts, PwrSoC is projected for small products and low-current applications. Original equipment manufacturers (OEMs) frequently drive trends and changes in power supplydesigns. The same dynamics are expected for PwrSoC. Intel sees “the start of a revolution inpower delivery and power management for SoCs and high performance applications.” Part ofthis is “combining” power delivery and power management in applications ranging fromperformance servers to small consumer electronic devices. Intel says, “The trend in platformpower needs to shrink, become more efficient, and be more cost-effective.” With system makers driving power trends and prices coming down, the PSiP (and relatedproducts) market is expected to grow significantly enough in the next few years to provide good“early adopter” opportunities for companies with the foresight to take advantage of them.Table of Contents :Introduction 6Definitions and Factors Driving Adoption 8System Maker Demand Characteristics 10IC Developments and Packaging Trends 143D IC Packaging/Stacked Solutions 14Functional Integration versus Component Integration 16High-Voltage CMOS Technology 18Embedded Batteries 18Materials Challenges 20Integrating Magnetics in PSiPs and PwrSoCs 20Application Demand Characteristics 24FPGAs 25Radio Frequency (RF) Transmitters 26Memory Termination Supply (VTT) 27Energy Harvesting 27Worldwide PSiP Forecasts 29Forecast Assumptions 29Market Adoption Drivers and Challenges 30PSiP, PwrSoC and Non-Isolated Module Price/Performance 32Output Current Forecasts 36Input Voltage Forecasts 41Application Drivers and Forecasts 45
  • Commercial Development 58Competitive Overview 58Analog Devices 58Cymbet Corp. 59Efficient Power Conversion (EPC) 60Enpirion 61Infineon 63Infinite Power Solutions 64Intel 64Linear Technology 65National Semiconductor 66NXP Semiconductors 67ROHM 68Texas Instruments 69University of Rochester 70Vicor 71Volterra 71List of ExhibitsTABLESTable 1 – PSiP Companies, Selected Applications and Enablers 34Table 2 – Worldwide PSiP Market, by Output Current (millions of units) 37Table 3 – Worldwide PSiP Market, by Output Current (millions of $) 37Table 4 – Worldwide PSiP Market, by Output Current ($/unit) 37Table 5 – Worldwide PSiP Market, by Input Voltage (millions of units) 41Table 6 – Worldwide PSiP Market, by Input Voltage (millions of $) 42Table 7 – Worldwide PSiP Market, by Input Voltage ($/unit) 43Table 8 – Worldwide PSiP Market, by Application (millions of units) 47Table 9 – Worldwide PSiP Market, by Application (millions of $) 48Table 10 – Worldwide PSiP Market, by Application ($/unit) 48Table 11 – Worldwide PSiP Market, by Application and Output Current (millions of units) 52Table 12 – Worldwide PSiP Market, by Application and Input Voltage (millions of units) 55FIGURESFigure 1 – Linear Technology µModule 9Figure 2 – 2011: POL Regulators in Server Systems 11Figure 3 – 2012-2015: POL Regulators for Servers 12Figure 4 – Beyond 2015: Integrated Regulators in a Processor Package 12Figure 5 – Cross-section of a Device Using a PowerStack Package 16Figure 6 – EnerChip Die in System-in-Package 19Figure 7 – Cross-Section Diagram of isoPower Transformer 21Figure 8 – Photograph of isoPower Transformer 21
  • Figure 9 – Bond Wire Inductor 22Figure 10 – Low Temperature Co-fired Ceramic DC-DC Converter Prototype 23Figure 11 – Micro-Inductor Structure 23Figure 12 – Normalized Pricing for Point-of-Load Converters 33Figure 13 – Price Differentials Between High-Performance PSiP Products and Equivalent “Generic”Products, by Amperage Segment (2011 and 2016) 35Figure 14 – Worldwide PSiP Market, by Output Current (millions of units) 38Figure 15 – Worldwide PSiP Market, by Output Current (unit market share) 39Figure 16 – Worldwide PSiP Market, by Output Current (millions of $) 40Figure 17 – Worldwide PSiP Market, by Input Voltage (millions of units) 43Figure 18 – Worldwide PSiP Market, by Input Voltage (unit market share) 44Figure 19 – Worldwide PSiP Market, by Input Voltage (millions of $) 45Figure 20 – Worldwide PSiP Market, by Application (millions of units) 49Figure 21 – Worldwide PSiP Market, by Application (unit market share) 49Figure 22 – Worldwide PSiP Market, by Application (millions of $) 50Figure 23 – Worldwide PSiP Market, Application Growth Rates – 2011 & 2016 (units and dollars 51Figure 24 – Worldwide PSiP Market, by Application and Output Current (millions of units) 53Figure 25 – Worldwide PSiP Market, by Application and Input Voltage (millions of units) 57Figure 26 – EnerChip Bare Die Attachment Mechanisms 60Figure 27 – Enpirion Power-System-on-Chip 62Figure 28 – Texas Instruments TPS82671 System-in-Package Regulator, Embedded DC-DC Converter IC 70Related Keywords : Converter,Power, System ,Package,Worldwide ,Technology ,Trends, Forecasts, Competitive,Environment, First ,Edition,Aarkstore Enterprise, companyreports, company profiles, country reports, market size,market research reports, market analysis, primary, business,publications, company, profile, service, revenue,opportunities, company information, country, segment,trends, market forecasts, country, reports, competitor,country, risk, report, market, industry, research, marketingFor More details about above & other Reportsplz contact :PranaliAarkstore.comContact: Marketing teamMob.No.918149852585Email: enquiry@aarkstore.com ,discount@aarkstore.comURL: http://www.aarkstore.comhttp://in.linkedin.com/in/aarkstorehttp://www.facebook.com/aarkstore